In a typical power electronics package, a grease layer forms the interface between the direct bond copper (DBC) layer or a baseplate and the heat sink. This grease layer has the highest thermal resistance of any layer in the package.
The global Thermal Interface Materials for Power Electronics market was valued at US$ 462 million in 2023 and is anticipated to reach US$ 792.2 million by 2030, witnessing a CAGR of 8.3% during the forecast period 2024-2030.
North American market for Thermal Interface Materials for Power Electronics is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Thermal Interface Materials for Power Electronics is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Thermal Interface Materials for Power Electronics include Dupont, Shin-Etsu, Panasonic, Laird, Henkel, Honeywell, 3M, Semikron and Momentive, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Thermal Interface Materials for Power Electronics, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thermal Interface Materials for Power Electronics.
Report Scope
The Thermal Interface Materials for Power Electronics market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Thermal Interface Materials for Power Electronics market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Thermal Interface Materials for Power Electronics manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Dupont
Shin-Etsu
Panasonic
Laird
Henkel
Honeywell
3M
Semikron
Momentive
Roger
AI Technology
Fujipoly
Parker
Shenzhen HFC
Segment by Type
Silicone-based
Non-silicone
Segment by Application
CPU
GPU
Memory Module
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Thermal Interface Materials for Power Electronics manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Thermal Interface Materials for Power Electronics by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Thermal Interface Materials for Power Electronics in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Thermal Interface Materials for Power Electronics Market Overview
1.1 Product Definition
1.2 Thermal Interface Materials for Power Electronics Segment by Type
1.2.1 Global Thermal Interface Materials for Power Electronics Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Silicone-based
1.2.3 Non-silicone
1.3 Thermal Interface Materials for Power Electronics Segment by Application
1.3.1 Global Thermal Interface Materials for Power Electronics Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 CPU
1.3.3 GPU
1.3.4 Memory Module
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Thermal Interface Materials for Power Electronics Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Thermal Interface Materials for Power Electronics Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Thermal Interface Materials for Power Electronics Production Estimates and Forecasts (2019-2030)
1.4.4 Global Thermal Interface Materials for Power Electronics Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Thermal Interface Materials for Power Electronics Production Market Share by Manufacturers (2019-2024)
2.2 Global Thermal Interface Materials for Power Electronics Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Thermal Interface Materials for Power Electronics, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Thermal Interface Materials for Power Electronics Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Thermal Interface Materials for Power Electronics Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Thermal Interface Materials for Power Electronics, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Thermal Interface Materials for Power Electronics, Product Offered and Application
2.8 Global Key Manufacturers of Thermal Interface Materials for Power Electronics, Date of Enter into This Industry
2.9 Thermal Interface Materials for Power Electronics Market Competitive Situation and Trends
2.9.1 Thermal Interface Materials for Power Electronics Market Concentration Rate
2.9.2 Global 5 and 10 Largest Thermal Interface Materials for Power Electronics Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Thermal Interface Materials for Power Electronics Production by Region
3.1 Global Thermal Interface Materials for Power Electronics Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Thermal Interface Materials for Power Electronics Production Value by Region (2019-2030)
3.2.1 Global Thermal Interface Materials for Power Electronics Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Thermal Interface Materials for Power Electronics by Region (2025-2030)
3.3 Global Thermal Interface Materials for Power Electronics Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Thermal Interface Materials for Power Electronics Production by Region (2019-2030)
3.4.1 Global Thermal Interface Materials for Power Electronics Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Thermal Interface Materials for Power Electronics by Region (2025-2030)
3.5 Global Thermal Interface Materials for Power Electronics Market Price Analysis by Region (2019-2024)
3.6 Global Thermal Interface Materials for Power Electronics Production and Value, Year-over-Year Growth
3.6.1 North America Thermal Interface Materials for Power Electronics Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Thermal Interface Materials for Power Electronics Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Thermal Interface Materials for Power Electronics Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Thermal Interface Materials for Power Electronics Production Value Estimates and Forecasts (2019-2030)
4 Thermal Interface Materials for Power Electronics Consumption by Region
4.1 Global Thermal Interface Materials for Power Electronics Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Thermal Interface Materials for Power Electronics Consumption by Region (2019-2030)
4.2.1 Global Thermal Interface Materials for Power Electronics Consumption by Region (2019-2024)
4.2.2 Global Thermal Interface Materials for Power Electronics Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Thermal Interface Materials for Power Electronics Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Thermal Interface Materials for Power Electronics Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Thermal Interface Materials for Power Electronics Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Thermal Interface Materials for Power Electronics Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Thermal Interface Materials for Power Electronics Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Thermal Interface Materials for Power Electronics Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Thermal Interface Materials for Power Electronics Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Thermal Interface Materials for Power Electronics Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Thermal Interface Materials for Power Electronics Production by Type (2019-2030)
5.1.1 Global Thermal Interface Materials for Power Electronics Production by Type (2019-2024)
5.1.2 Global Thermal Interface Materials for Power Electronics Production by Type (2025-2030)
5.1.3 Global Thermal Interface Materials for Power Electronics Production Market Share by Type (2019-2030)
5.2 Global Thermal Interface Materials for Power Electronics Production Value by Type (2019-2030)
5.2.1 Global Thermal Interface Materials for Power Electronics Production Value by Type (2019-2024)
5.2.2 Global Thermal Interface Materials for Power Electronics Production Value by Type (2025-2030)
5.2.3 Global Thermal Interface Materials for Power Electronics Production Value Market Share by Type (2019-2030)
5.3 Global Thermal Interface Materials for Power Electronics Price by Type (2019-2030)
6 Segment by Application
6.1 Global Thermal Interface Materials for Power Electronics Production by Application (2019-2030)
6.1.1 Global Thermal Interface Materials for Power Electronics Production by Application (2019-2024)
6.1.2 Global Thermal Interface Materials for Power Electronics Production by Application (2025-2030)
6.1.3 Global Thermal Interface Materials for Power Electronics Production Market Share by Application (2019-2030)
6.2 Global Thermal Interface Materials for Power Electronics Production Value by Application (2019-2030)
6.2.1 Global Thermal Interface Materials for Power Electronics Production Value by Application (2019-2024)
6.2.2 Global Thermal Interface Materials for Power Electronics Production Value by Application (2025-2030)
6.2.3 Global Thermal Interface Materials for Power Electronics Production Value Market Share by Application (2019-2030)
6.3 Global Thermal Interface Materials for Power Electronics Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Dupont
7.1.1 Dupont Thermal Interface Materials for Power Electronics Corporation Information
7.1.2 Dupont Thermal Interface Materials for Power Electronics Product Portfolio
7.1.3 Dupont Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Dupont Main Business and Markets Served
7.1.5 Dupont Recent Developments/Updates
7.2 Shin-Etsu
7.2.1 Shin-Etsu Thermal Interface Materials for Power Electronics Corporation Information
7.2.2 Shin-Etsu Thermal Interface Materials for Power Electronics Product Portfolio
7.2.3 Shin-Etsu Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Shin-Etsu Main Business and Markets Served
7.2.5 Shin-Etsu Recent Developments/Updates
7.3 Panasonic
7.3.1 Panasonic Thermal Interface Materials for Power Electronics Corporation Information
7.3.2 Panasonic Thermal Interface Materials for Power Electronics Product Portfolio
7.3.3 Panasonic Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Panasonic Main Business and Markets Served
7.3.5 Panasonic Recent Developments/Updates
7.4 Laird
7.4.1 Laird Thermal Interface Materials for Power Electronics Corporation Information
7.4.2 Laird Thermal Interface Materials for Power Electronics Product Portfolio
7.4.3 Laird Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Laird Main Business and Markets Served
7.4.5 Laird Recent Developments/Updates
7.5 Henkel
7.5.1 Henkel Thermal Interface Materials for Power Electronics Corporation Information
7.5.2 Henkel Thermal Interface Materials for Power Electronics Product Portfolio
7.5.3 Henkel Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Henkel Main Business and Markets Served
7.5.5 Henkel Recent Developments/Updates
7.6 Honeywell
7.6.1 Honeywell Thermal Interface Materials for Power Electronics Corporation Information
7.6.2 Honeywell Thermal Interface Materials for Power Electronics Product Portfolio
7.6.3 Honeywell Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Honeywell Main Business and Markets Served
7.6.5 Honeywell Recent Developments/Updates
7.7 3M
7.7.1 3M Thermal Interface Materials for Power Electronics Corporation Information
7.7.2 3M Thermal Interface Materials for Power Electronics Product Portfolio
7.7.3 3M Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.7.4 3M Main Business and Markets Served
7.7.5 3M Recent Developments/Updates
7.8 Semikron
7.8.1 Semikron Thermal Interface Materials for Power Electronics Corporation Information
7.8.2 Semikron Thermal Interface Materials for Power Electronics Product Portfolio
7.8.3 Semikron Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Semikron Main Business and Markets Served
7.7.5 Semikron Recent Developments/Updates
7.9 Momentive
7.9.1 Momentive Thermal Interface Materials for Power Electronics Corporation Information
7.9.2 Momentive Thermal Interface Materials for Power Electronics Product Portfolio
7.9.3 Momentive Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Momentive Main Business and Markets Served
7.9.5 Momentive Recent Developments/Updates
7.10 Roger
7.10.1 Roger Thermal Interface Materials for Power Electronics Corporation Information
7.10.2 Roger Thermal Interface Materials for Power Electronics Product Portfolio
7.10.3 Roger Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Roger Main Business and Markets Served
7.10.5 Roger Recent Developments/Updates
7.11 AI Technology
7.11.1 AI Technology Thermal Interface Materials for Power Electronics Corporation Information
7.11.2 AI Technology Thermal Interface Materials for Power Electronics Product Portfolio
7.11.3 AI Technology Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.11.4 AI Technology Main Business and Markets Served
7.11.5 AI Technology Recent Developments/Updates
7.12 Fujipoly
7.12.1 Fujipoly Thermal Interface Materials for Power Electronics Corporation Information
7.12.2 Fujipoly Thermal Interface Materials for Power Electronics Product Portfolio
7.12.3 Fujipoly Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Fujipoly Main Business and Markets Served
7.12.5 Fujipoly Recent Developments/Updates
7.13 Parker
7.13.1 Parker Thermal Interface Materials for Power Electronics Corporation Information
7.13.2 Parker Thermal Interface Materials for Power Electronics Product Portfolio
7.13.3 Parker Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Parker Main Business and Markets Served
7.13.5 Parker Recent Developments/Updates
7.14 Shenzhen HFC
7.14.1 Shenzhen HFC Thermal Interface Materials for Power Electronics Corporation Information
7.14.2 Shenzhen HFC Thermal Interface Materials for Power Electronics Product Portfolio
7.14.3 Shenzhen HFC Thermal Interface Materials for Power Electronics Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Shenzhen HFC Main Business and Markets Served
7.14.5 Shenzhen HFC Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Thermal Interface Materials for Power Electronics Industry Chain Analysis
8.2 Thermal Interface Materials for Power Electronics Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Thermal Interface Materials for Power Electronics Production Mode & Process
8.4 Thermal Interface Materials for Power Electronics Sales and Marketing
8.4.1 Thermal Interface Materials for Power Electronics Sales Channels
8.4.2 Thermal Interface Materials for Power Electronics Distributors
8.5 Thermal Interface Materials for Power Electronics Customers
9 Thermal Interface Materials for Power Electronics Market Dynamics
9.1 Thermal Interface Materials for Power Electronics Industry Trends
9.2 Thermal Interface Materials for Power Electronics Market Drivers
9.3 Thermal Interface Materials for Power Electronics Market Challenges
9.4 Thermal Interface Materials for Power Electronics Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Dupont
Shin-Etsu
Panasonic
Laird
Henkel
Honeywell
3M
Semikron
Momentive
Roger
AI Technology
Fujipoly
Parker
Shenzhen HFC
听
听
*If Applicable.
