The global Wafer Level Chip Scale Package (WLCSP) market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Wafer Level Chip Scale Package (WLCSP) market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
TSMC
Amkor Technology
Macronix
China Wafer Level CSP
JCET Group
Chipbond Technology Corporation
ASE Group
Huatian Technology (Kunshan) Electronics
Segment by Type
Wafer Bumping
Shellcase
Segment by Application
Bluetooth
WLAN
PMIC/PMU
MOSFET
Camera
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Wafer Level Chip Scale Package (WLCSP) report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. Market Opportunities and Challenges
Chapter 3: Companies’ Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies’ Outline
Chapter 12: Market Conclusions
Chapter 13: Research Methodology and Data Source
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Wafer Level Chip Scale Package (WLCSP) Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 Wafer Bumping
1.2.3 Shellcase
1.3 Market by Application
1.3.1 Global Wafer Level Chip Scale Package (WLCSP) Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Bluetooth
1.3.3 WLAN
1.3.4 PMIC/PMU
1.3.5 MOSFET
1.3.6 Camera
1.3.7 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Wafer Level Chip Scale Package (WLCSP) Market Perspective (2018-2029)
2.2 Wafer Level Chip Scale Package (WLCSP) Growth Trends by Region
2.2.1 Global Wafer Level Chip Scale Package (WLCSP) Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 Wafer Level Chip Scale Package (WLCSP) Historic Market Size by Region (2018-2023)
2.2.3 Wafer Level Chip Scale Package (WLCSP) Forecasted Market Size by Region (2024-2029)
2.3 Wafer Level Chip Scale Package (WLCSP) Market Dynamics
2.3.1 Wafer Level Chip Scale Package (WLCSP) Industry Trends
2.3.2 Wafer Level Chip Scale Package (WLCSP) Market Drivers
2.3.3 Wafer Level Chip Scale Package (WLCSP) Market Challenges
2.3.4 Wafer Level Chip Scale Package (WLCSP) Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Wafer Level Chip Scale Package (WLCSP) Players by Revenue
3.1.1 Global Top Wafer Level Chip Scale Package (WLCSP) Players by Revenue (2018-2023)
3.1.2 Global Wafer Level Chip Scale Package (WLCSP) Revenue Market Share by Players (2018-2023)
3.2 Global Wafer Level Chip Scale Package (WLCSP) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Wafer Level Chip Scale Package (WLCSP) Revenue
3.4 Global Wafer Level Chip Scale Package (WLCSP) Market Concentration Ratio
3.4.1 Global Wafer Level Chip Scale Package (WLCSP) Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Wafer Level Chip Scale Package (WLCSP) Revenue in 2022
3.5 Wafer Level Chip Scale Package (WLCSP) Key Players Head office and Area Served
3.6 Key Players Wafer Level Chip Scale Package (WLCSP) Product Solution and Service
3.7 Date of Enter into Wafer Level Chip Scale Package (WLCSP) Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Wafer Level Chip Scale Package (WLCSP) Breakdown Data by Type
4.1 Global Wafer Level Chip Scale Package (WLCSP) Historic Market Size by Type (2018-2023)
4.2 Global Wafer Level Chip Scale Package (WLCSP) Forecasted Market Size by Type (2024-2029)
5 Wafer Level Chip Scale Package (WLCSP) Breakdown Data by Application
5.1 Global Wafer Level Chip Scale Package (WLCSP) Historic Market Size by Application (2018-2023)
5.2 Global Wafer Level Chip Scale Package (WLCSP) Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America Wafer Level Chip Scale Package (WLCSP) Market Size (2018-2029)
6.2 North America Wafer Level Chip Scale Package (WLCSP) Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Wafer Level Chip Scale Package (WLCSP) Market Size by Country (2018-2023)
6.4 North America Wafer Level Chip Scale Package (WLCSP) Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Wafer Level Chip Scale Package (WLCSP) Market Size (2018-2029)
7.2 Europe Wafer Level Chip Scale Package (WLCSP) Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Wafer Level Chip Scale Package (WLCSP) Market Size by Country (2018-2023)
7.4 Europe Wafer Level Chip Scale Package (WLCSP) Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Wafer Level Chip Scale Package (WLCSP) Market Size (2018-2029)
8.2 Asia-Pacific Wafer Level Chip Scale Package (WLCSP) Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Wafer Level Chip Scale Package (WLCSP) Market Size by Region (2018-2023)
8.4 Asia-Pacific Wafer Level Chip Scale Package (WLCSP) Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Wafer Level Chip Scale Package (WLCSP) Market Size (2018-2029)
9.2 Latin America Wafer Level Chip Scale Package (WLCSP) Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Wafer Level Chip Scale Package (WLCSP) Market Size by Country (2018-2023)
9.4 Latin America Wafer Level Chip Scale Package (WLCSP) Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Wafer Level Chip Scale Package (WLCSP) Market Size (2018-2029)
10.2 Middle East & Africa Wafer Level Chip Scale Package (WLCSP) Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Wafer Level Chip Scale Package (WLCSP) Market Size by Country (2018-2023)
10.4 Middle East & Africa Wafer Level Chip Scale Package (WLCSP) Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 TSMC
11.1.1 TSMC Company Detail
11.1.2 TSMC Business Overview
11.1.3 TSMC Wafer Level Chip Scale Package (WLCSP) Introduction
11.1.4 TSMC Revenue in Wafer Level Chip Scale Package (WLCSP) Business (2018-2023)
11.1.5 TSMC Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Detail
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Wafer Level Chip Scale Package (WLCSP) Introduction
11.2.4 Amkor Technology Revenue in Wafer Level Chip Scale Package (WLCSP) Business (2018-2023)
11.2.5 Amkor Technology Recent Development
11.3 Macronix
11.3.1 Macronix Company Detail
11.3.2 Macronix Business Overview
11.3.3 Macronix Wafer Level Chip Scale Package (WLCSP) Introduction
11.3.4 Macronix Revenue in Wafer Level Chip Scale Package (WLCSP) Business (2018-2023)
11.3.5 Macronix Recent Development
11.4 China Wafer Level CSP
11.4.1 China Wafer Level CSP Company Detail
11.4.2 China Wafer Level CSP Business Overview
11.4.3 China Wafer Level CSP Wafer Level Chip Scale Package (WLCSP) Introduction
11.4.4 China Wafer Level CSP Revenue in Wafer Level Chip Scale Package (WLCSP) Business (2018-2023)
11.4.5 China Wafer Level CSP Recent Development
11.5 JCET Group
11.5.1 JCET Group Company Detail
11.5.2 JCET Group Business Overview
11.5.3 JCET Group Wafer Level Chip Scale Package (WLCSP) Introduction
11.5.4 JCET Group Revenue in Wafer Level Chip Scale Package (WLCSP) Business (2018-2023)
11.5.5 JCET Group Recent Development
11.6 Chipbond Technology Corporation
11.6.1 Chipbond Technology Corporation Company Detail
11.6.2 Chipbond Technology Corporation Business Overview
11.6.3 Chipbond Technology Corporation Wafer Level Chip Scale Package (WLCSP) Introduction
11.6.4 Chipbond Technology Corporation Revenue in Wafer Level Chip Scale Package (WLCSP) Business (2018-2023)
11.6.5 Chipbond Technology Corporation Recent Development
11.7 ASE Group
11.7.1 ASE Group Company Detail
11.7.2 ASE Group Business Overview
11.7.3 ASE Group Wafer Level Chip Scale Package (WLCSP) Introduction
11.7.4 ASE Group Revenue in Wafer Level Chip Scale Package (WLCSP) Business (2018-2023)
11.7.5 ASE Group Recent Development
11.8 Huatian Technology (Kunshan) Electronics
11.8.1 Huatian Technology (Kunshan) Electronics Company Detail
11.8.2 Huatian Technology (Kunshan) Electronics Business Overview
11.8.3 Huatian Technology (Kunshan) Electronics Wafer Level Chip Scale Package (WLCSP) Introduction
11.8.4 Huatian Technology (Kunshan) Electronics Revenue in Wafer Level Chip Scale Package (WLCSP) Business (2018-2023)
11.8.5 Huatian Technology (Kunshan) Electronics Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
TSMC
Amkor Technology
Macronix
China Wafer Level CSP
JCET Group
Chipbond Technology Corporation
ASE Group
Huatian Technology (Kunshan) Electronics
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*If Applicable.
