Wafer level chip scale packaging (WLCSP) is a wafer level chip packaging method, which is different from the traditional chip packaging method (cutting first and then sealing and testing, and at least 20% of the volume of the original chip is increased after packaging) , this latest technology is to package and test the whole wafer before cutting it into IC particles. Therefore, the volume after packaging is equal to the original size of IC bare crystal.
The global Wafer-Level Chip Scale Packaging Technology market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Wafer-Level Chip Scale Packaging Technology, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer-Level Chip Scale Packaging Technology.
Report Scope
The Wafer-Level Chip Scale Packaging Technology market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer-Level Chip Scale Packaging Technology market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer-Level Chip Scale Packaging Technology companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TSMC
China Wafer Level CSP
Texas Instruments
Amkor
Toshiba
Advanced Semiconductor Engineering
JCET Group
Huatian Technology
TongFu Microelectronics
CASMELT (NCAP China)
Keyang Semiconductor Technology
China Resources Microelectronics Holdings
JS nepes
Aptos
PEP Innovation
Segment by Type
FOC WLCSP
RPV WLCSP
RDL WLCSP
Segment by Application
Consumer Electronics
Automobile
Medical
Communication
Security Monitoring
Identification
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Wafer-Level Chip Scale Packaging Technology companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
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1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Wafer-Level Chip Scale Packaging Technology Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 FOC WLCSP
1.2.3 RPV WLCSP
1.2.4 RDL WLCSP
1.3 Market by Application
1.3.1 Global Wafer-Level Chip Scale Packaging Technology Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Automobile
1.3.4 Medical
1.3.5 Communication
1.3.6 Security Monitoring
1.3.7 Identification
1.3.8 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Wafer-Level Chip Scale Packaging Technology Market Perspective (2019-2030)
2.2 Wafer-Level Chip Scale Packaging Technology Growth Trends by Region
2.2.1 Global Wafer-Level Chip Scale Packaging Technology Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Wafer-Level Chip Scale Packaging Technology Historic Market Size by Region (2019-2024)
2.2.3 Wafer-Level Chip Scale Packaging Technology Forecasted Market Size by Region (2025-2030)
2.3 Wafer-Level Chip Scale Packaging Technology Market Dynamics
2.3.1 Wafer-Level Chip Scale Packaging Technology Industry Trends
2.3.2 Wafer-Level Chip Scale Packaging Technology Market Drivers
2.3.3 Wafer-Level Chip Scale Packaging Technology Market Challenges
2.3.4 Wafer-Level Chip Scale Packaging Technology Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Wafer-Level Chip Scale Packaging Technology Players by Revenue
3.1.1 Global Top Wafer-Level Chip Scale Packaging Technology Players by Revenue (2019-2024)
3.1.2 Global Wafer-Level Chip Scale Packaging Technology Revenue Market Share by Players (2019-2024)
3.2 Global Wafer-Level Chip Scale Packaging Technology Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Wafer-Level Chip Scale Packaging Technology Revenue
3.4 Global Wafer-Level Chip Scale Packaging Technology Market Concentration Ratio
3.4.1 Global Wafer-Level Chip Scale Packaging Technology Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Wafer-Level Chip Scale Packaging Technology Revenue in 2023
3.5 Wafer-Level Chip Scale Packaging Technology Key Players Head office and Area Served
3.6 Key Players Wafer-Level Chip Scale Packaging Technology Product Solution and Service
3.7 Date of Enter into Wafer-Level Chip Scale Packaging Technology Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Wafer-Level Chip Scale Packaging Technology Breakdown Data by Type
4.1 Global Wafer-Level Chip Scale Packaging Technology Historic Market Size by Type (2019-2024)
4.2 Global Wafer-Level Chip Scale Packaging Technology Forecasted Market Size by Type (2025-2030)
5 Wafer-Level Chip Scale Packaging Technology Breakdown Data by Application
5.1 Global Wafer-Level Chip Scale Packaging Technology Historic Market Size by Application (2019-2024)
5.2 Global Wafer-Level Chip Scale Packaging Technology Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Wafer-Level Chip Scale Packaging Technology Market Size (2019-2030)
6.2 North America Wafer-Level Chip Scale Packaging Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Wafer-Level Chip Scale Packaging Technology Market Size by Country (2019-2024)
6.4 North America Wafer-Level Chip Scale Packaging Technology Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Wafer-Level Chip Scale Packaging Technology Market Size (2019-2030)
7.2 Europe Wafer-Level Chip Scale Packaging Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Wafer-Level Chip Scale Packaging Technology Market Size by Country (2019-2024)
7.4 Europe Wafer-Level Chip Scale Packaging Technology Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Wafer-Level Chip Scale Packaging Technology Market Size (2019-2030)
8.2 Asia-Pacific Wafer-Level Chip Scale Packaging Technology Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Wafer-Level Chip Scale Packaging Technology Market Size by Region (2019-2024)
8.4 Asia-Pacific Wafer-Level Chip Scale Packaging Technology Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Wafer-Level Chip Scale Packaging Technology Market Size (2019-2030)
9.2 Latin America Wafer-Level Chip Scale Packaging Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Wafer-Level Chip Scale Packaging Technology Market Size by Country (2019-2024)
9.4 Latin America Wafer-Level Chip Scale Packaging Technology Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Wafer-Level Chip Scale Packaging Technology Market Size (2019-2030)
10.2 Middle East & Africa Wafer-Level Chip Scale Packaging Technology Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Wafer-Level Chip Scale Packaging Technology Market Size by Country (2019-2024)
10.4 Middle East & Africa Wafer-Level Chip Scale Packaging Technology Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 TSMC
11.1.1 TSMC Company Detail
11.1.2 TSMC Business Overview
11.1.3 TSMC Wafer-Level Chip Scale Packaging Technology Introduction
11.1.4 TSMC Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.1.5 TSMC Recent Development
11.2 China Wafer Level CSP
11.2.1 China Wafer Level CSP Company Detail
11.2.2 China Wafer Level CSP Business Overview
11.2.3 China Wafer Level CSP Wafer-Level Chip Scale Packaging Technology Introduction
11.2.4 China Wafer Level CSP Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.2.5 China Wafer Level CSP Recent Development
11.3 Texas Instruments
11.3.1 Texas Instruments Company Detail
11.3.2 Texas Instruments Business Overview
11.3.3 Texas Instruments Wafer-Level Chip Scale Packaging Technology Introduction
11.3.4 Texas Instruments Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.3.5 Texas Instruments Recent Development
11.4 Amkor
11.4.1 Amkor Company Detail
11.4.2 Amkor Business Overview
11.4.3 Amkor Wafer-Level Chip Scale Packaging Technology Introduction
11.4.4 Amkor Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.4.5 Amkor Recent Development
11.5 Toshiba
11.5.1 Toshiba Company Detail
11.5.2 Toshiba Business Overview
11.5.3 Toshiba Wafer-Level Chip Scale Packaging Technology Introduction
11.5.4 Toshiba Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.5.5 Toshiba Recent Development
11.6 Advanced Semiconductor Engineering
11.6.1 Advanced Semiconductor Engineering Company Detail
11.6.2 Advanced Semiconductor Engineering Business Overview
11.6.3 Advanced Semiconductor Engineering Wafer-Level Chip Scale Packaging Technology Introduction
11.6.4 Advanced Semiconductor Engineering Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.6.5 Advanced Semiconductor Engineering Recent Development
11.7 JCET Group
11.7.1 JCET Group Company Detail
11.7.2 JCET Group Business Overview
11.7.3 JCET Group Wafer-Level Chip Scale Packaging Technology Introduction
11.7.4 JCET Group Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.7.5 JCET Group Recent Development
11.8 Huatian Technology
11.8.1 Huatian Technology Company Detail
11.8.2 Huatian Technology Business Overview
11.8.3 Huatian Technology Wafer-Level Chip Scale Packaging Technology Introduction
11.8.4 Huatian Technology Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.8.5 Huatian Technology Recent Development
11.9 TongFu Microelectronics
11.9.1 TongFu Microelectronics Company Detail
11.9.2 TongFu Microelectronics Business Overview
11.9.3 TongFu Microelectronics Wafer-Level Chip Scale Packaging Technology Introduction
11.9.4 TongFu Microelectronics Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.9.5 TongFu Microelectronics Recent Development
11.10 CASMELT (NCAP China)
11.10.1 CASMELT (NCAP China) Company Detail
11.10.2 CASMELT (NCAP China) Business Overview
11.10.3 CASMELT (NCAP China) Wafer-Level Chip Scale Packaging Technology Introduction
11.10.4 CASMELT (NCAP China) Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.10.5 CASMELT (NCAP China) Recent Development
11.11 Keyang Semiconductor Technology
11.11.1 Keyang Semiconductor Technology Company Detail
11.11.2 Keyang Semiconductor Technology Business Overview
11.11.3 Keyang Semiconductor Technology Wafer-Level Chip Scale Packaging Technology Introduction
11.11.4 Keyang Semiconductor Technology Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.11.5 Keyang Semiconductor Technology Recent Development
11.12 China Resources Microelectronics Holdings
11.12.1 China Resources Microelectronics Holdings Company Detail
11.12.2 China Resources Microelectronics Holdings Business Overview
11.12.3 China Resources Microelectronics Holdings Wafer-Level Chip Scale Packaging Technology Introduction
11.12.4 China Resources Microelectronics Holdings Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.12.5 China Resources Microelectronics Holdings Recent Development
11.13 JS nepes
11.13.1 JS nepes Company Detail
11.13.2 JS nepes Business Overview
11.13.3 JS nepes Wafer-Level Chip Scale Packaging Technology Introduction
11.13.4 JS nepes Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.13.5 JS nepes Recent Development
11.14 Aptos
11.14.1 Aptos Company Detail
11.14.2 Aptos Business Overview
11.14.3 Aptos Wafer-Level Chip Scale Packaging Technology Introduction
11.14.4 Aptos Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.14.5 Aptos Recent Development
11.15 PEP Innovation
11.15.1 PEP Innovation Company Detail
11.15.2 PEP Innovation Business Overview
11.15.3 PEP Innovation Wafer-Level Chip Scale Packaging Technology Introduction
11.15.4 PEP Innovation Revenue in Wafer-Level Chip Scale Packaging Technology Business (2019-2024)
11.15.5 PEP Innovation Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
TSMC
China Wafer Level CSP
Texas Instruments
Amkor
Toshiba
Advanced Semiconductor Engineering
JCET Group
Huatian Technology
TongFu Microelectronics
CASMELT (NCAP China)
Keyang Semiconductor Technology
China Resources Microelectronics Holdings
JS nepes
Aptos
PEP Innovation
听
听
*If Applicable.
