Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.
The global Wafer Level Packaging market is projected to grow from US$ 2860 million in 2023 to US$ 4707.5 million by 2029, at a Compound Annual Growth Rate (CAGR) of 8.7% during the forecast period.
Global Wafer-level Packaging Equipment key players include Applied Materials, Tokyo Electron, KLA-Tencor Corporation, EV Group, etc. Global top four manufacturers hold a share nearly 60%.
China Taiwan is the largest market, with a share about 30%, followed by China Mainland, and North America, both have a share about 35 percent.
In terms of product, Fan-in WLP is the largest segment, followed by Fan-out WLP, etc.
In terms of production side, this report researches the Wafer Level Packaging production, growth rate, market share by manufacturers and by region (region level and country level), from 2018 to 2023, and forecast to 2029.
In terms of consumption side, this report focuses on the sales of Wafer Level Packaging by region (region level and country level), by company, by Type and by Application. from 2018 to 2023 and forecast to 2029.
Report Includes:
This report presents an overview of global market for Wafer Level Packaging, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2018 - 2022, estimates for 2023, and projections of CAGR through 2029.
This report researches the key producers of Wafer Level Packaging, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Wafer Level Packaging, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Wafer Level Packaging sales, revenue, market share and industry ranking of main manufacturers, data from 2018 to 2023. Identification of the major stakeholders in the global Wafer Level Packaging market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2018 to 2029. Evaluation and forecast the market size for Wafer Level Packaging sales, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including Amkor Technology Inc, Fujitsu Ltd, Jiangsu Changjiang Electronics, Deca Technologies, Qualcomm Inc, Toshiba Corp, Tokyo Electron Ltd, Applied Materials, Inc and ASML Holding NV, etc.
By Company
Amkor Technology Inc
Fujitsu Ltd
Jiangsu Changjiang Electronics
Deca Technologies
Qualcomm Inc
Toshiba Corp
Tokyo Electron Ltd
Applied Materials, Inc
ASML Holding NV
Lam Research Corp
KLA-Tencor Corration
China Wafer Level CSP Co. Ltd
Marvell Technology Group Ltd
Siliconware Precision Industries
Nanium SA
STATS Chip
PAC Ltd
Segment by Type
3D TSV WLP
2.5D TSV WLP
WLCSP
Nano WLP
Others ( 2D TSV WLP and Compliant WLP)
Segment by Application
Electronics
IT & Telecommunication
Industrial
Automotive
Aerospace & Defense
Healthcare
Others (Media & Entertainment and Non-Conventional Energy Resources)
Production by Region
North America
Europe
China
Japan
South Korea
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Middle East, Africa, Latin America
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc.), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Wafer Level Packaging production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Wafer Level Packaging in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 4: Detailed analysis of Wafer Level Packaging manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by type, by application and by country, sales and revenue for each segment.
Chapter 8: Europe by type, by application and by country, sales and revenue for each segment.
Chapter 9: China by type and by application sales and revenue for each segment.
Chapter 10: Asia (excluding China) by type, by application and by region, sales and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by type, by application and by country, sales and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Wafer Level Packaging sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Study Coverage
1.1 Wafer Level Packaging Product Introduction
1.2 Market by Type
1.2.1 Global Wafer Level Packaging Market Size by Type, 2018 VS 2022 VS 2029
1.2.2 3D TSV WLP
1.2.3 2.5D TSV WLP
1.2.4 WLCSP
1.2.5 Nano WLP
1.2.6 Others ( 2D TSV WLP and Compliant WLP)
1.3 Market by Application
1.3.1 Global Wafer Level Packaging Market Size by Application, 2018 VS 2022 VS 2029
1.3.2 Electronics
1.3.3 IT & Telecommunication
1.3.4 Industrial
1.3.5 Automotive
1.3.6 Aerospace & Defense
1.3.7 Healthcare
1.3.8 Others (Media & Entertainment and Non-Conventional Energy Resources)
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Wafer Level Packaging Production
2.1 Global Wafer Level Packaging Production Capacity (2018-2029)
2.2 Global Wafer Level Packaging Production by Region: 2018 VS 2022 VS 2029
2.3 Global Wafer Level Packaging Production by Region
2.3.1 Global Wafer Level Packaging Historic Production by Region (2018-2023)
2.3.2 Global Wafer Level Packaging Forecasted Production by Region (2024-2029)
2.3.3 Global Wafer Level Packaging Production Market Share by Region (2018-2029)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Executive Summary
3.1 Global Wafer Level Packaging Revenue Estimates and Forecasts 2018-2029
3.2 Global Wafer Level Packaging Revenue by Region
3.2.1 Global Wafer Level Packaging Revenue by Region: 2018 VS 2022 VS 2029
3.2.2 Global Wafer Level Packaging Revenue by Region (2018-2023)
3.2.3 Global Wafer Level Packaging Revenue by Region (2024-2029)
3.2.4 Global Wafer Level Packaging Revenue Market Share by Region (2018-2029)
3.3 Global Wafer Level Packaging Sales Estimates and Forecasts 2018-2029
3.4 Global Wafer Level Packaging Sales by Region
3.4.1 Global Wafer Level Packaging Sales by Region: 2018 VS 2022 VS 2029
3.4.2 Global Wafer Level Packaging Sales by Region (2018-2023)
3.4.3 Global Wafer Level Packaging Sales by Region (2024-2029)
3.4.4 Global Wafer Level Packaging Sales Market Share by Region (2018-2029)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global Wafer Level Packaging Sales by Manufacturers
4.1.1 Global Wafer Level Packaging Sales by Manufacturers (2018-2023)
4.1.2 Global Wafer Level Packaging Sales Market Share by Manufacturers (2018-2023)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of Wafer Level Packaging in 2022
4.2 Global Wafer Level Packaging Revenue by Manufacturers
4.2.1 Global Wafer Level Packaging Revenue by Manufacturers (2018-2023)
4.2.2 Global Wafer Level Packaging Revenue Market Share by Manufacturers (2018-2023)
4.2.3 Global Top 10 and Top 5 Companies by Wafer Level Packaging Revenue in 2022
4.3 Global Wafer Level Packaging Sales Price by Manufacturers
4.4 Global Key Players of Wafer Level Packaging, Industry Ranking, 2021 VS 2022 VS 2023
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers Market Concentration Ratio (CR5 and HHI)
4.5.2 Global Wafer Level Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of Wafer Level Packaging, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of Wafer Level Packaging, Product Offered and Application
4.8 Global Key Manufacturers of Wafer Level Packaging, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 Market Size by Type
5.1 Global Wafer Level Packaging Sales by Type
5.1.1 Global Wafer Level Packaging Historical Sales by Type (2018-2023)
5.1.2 Global Wafer Level Packaging Forecasted Sales by Type (2024-2029)
5.1.3 Global Wafer Level Packaging Sales Market Share by Type (2018-2029)
5.2 Global Wafer Level Packaging Revenue by Type
5.2.1 Global Wafer Level Packaging Historical Revenue by Type (2018-2023)
5.2.2 Global Wafer Level Packaging Forecasted Revenue by Type (2024-2029)
5.2.3 Global Wafer Level Packaging Revenue Market Share by Type (2018-2029)
5.3 Global Wafer Level Packaging Price by Type
5.3.1 Global Wafer Level Packaging Price by Type (2018-2023)
5.3.2 Global Wafer Level Packaging Price Forecast by Type (2024-2029)
6 Market Size by Application
6.1 Global Wafer Level Packaging Sales by Application
6.1.1 Global Wafer Level Packaging Historical Sales by Application (2018-2023)
6.1.2 Global Wafer Level Packaging Forecasted Sales by Application (2024-2029)
6.1.3 Global Wafer Level Packaging Sales Market Share by Application (2018-2029)
6.2 Global Wafer Level Packaging Revenue by Application
6.2.1 Global Wafer Level Packaging Historical Revenue by Application (2018-2023)
6.2.2 Global Wafer Level Packaging Forecasted Revenue by Application (2024-2029)
6.2.3 Global Wafer Level Packaging Revenue Market Share by Application (2018-2029)
6.3 Global Wafer Level Packaging Price by Application
6.3.1 Global Wafer Level Packaging Price by Application (2018-2023)
6.3.2 Global Wafer Level Packaging Price Forecast by Application (2024-2029)
7 US & Canada
7.1 US & Canada Wafer Level Packaging Market Size by Type
7.1.1 US & Canada Wafer Level Packaging Sales by Type (2018-2029)
7.1.2 US & Canada Wafer Level Packaging Revenue by Type (2018-2029)
7.2 US & Canada Wafer Level Packaging Market Size by Application
7.2.1 US & Canada Wafer Level Packaging Sales by Application (2018-2029)
7.2.2 US & Canada Wafer Level Packaging Revenue by Application (2018-2029)
7.3 US & Canada Wafer Level Packaging Sales by Country
7.3.1 US & Canada Wafer Level Packaging Revenue by Country: 2018 VS 2022 VS 2029
7.3.2 US & Canada Wafer Level Packaging Sales by Country (2018-2029)
7.3.3 US & Canada Wafer Level Packaging Revenue by Country (2018-2029)
7.3.4 U.S.
7.3.5 Canada
8 Europe
8.1 Europe Wafer Level Packaging Market Size by Type
8.1.1 Europe Wafer Level Packaging Sales by Type (2018-2029)
8.1.2 Europe Wafer Level Packaging Revenue by Type (2018-2029)
8.2 Europe Wafer Level Packaging Market Size by Application
8.2.1 Europe Wafer Level Packaging Sales by Application (2018-2029)
8.2.2 Europe Wafer Level Packaging Revenue by Application (2018-2029)
8.3 Europe Wafer Level Packaging Sales by Country
8.3.1 Europe Wafer Level Packaging Revenue by Country: 2018 VS 2022 VS 2029
8.3.2 Europe Wafer Level Packaging Sales by Country (2018-2029)
8.3.3 Europe Wafer Level Packaging Revenue by Country (2018-2029)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China Wafer Level Packaging Market Size by Type
9.1.1 China Wafer Level Packaging Sales by Type (2018-2029)
9.1.2 China Wafer Level Packaging Revenue by Type (2018-2029)
9.2 China Wafer Level Packaging Market Size by Application
9.2.1 China Wafer Level Packaging Sales by Application (2018-2029)
9.2.2 China Wafer Level Packaging Revenue by Application (2018-2029)
10 Asia (excluding China)
10.1 Asia Wafer Level Packaging Market Size by Type
10.1.1 Asia Wafer Level Packaging Sales by Type (2018-2029)
10.1.2 Asia Wafer Level Packaging Revenue by Type (2018-2029)
10.2 Asia Wafer Level Packaging Market Size by Application
10.2.1 Asia Wafer Level Packaging Sales by Application (2018-2029)
10.2.2 Asia Wafer Level Packaging Revenue by Application (2018-2029)
10.3 Asia Wafer Level Packaging Sales by Region
10.3.1 Asia Wafer Level Packaging Revenue by Region: 2018 VS 2022 VS 2029
10.3.2 Asia Wafer Level Packaging Revenue by Region (2018-2029)
10.3.3 Asia Wafer Level Packaging Sales by Region (2018-2029)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America Wafer Level Packaging Market Size by Type
11.1.1 Middle East, Africa and Latin America Wafer Level Packaging Sales by Type (2018-2029)
11.1.2 Middle East, Africa and Latin America Wafer Level Packaging Revenue by Type (2018-2029)
11.2 Middle East, Africa and Latin America Wafer Level Packaging Market Size by Application
11.2.1 Middle East, Africa and Latin America Wafer Level Packaging Sales by Application (2018-2029)
11.2.2 Middle East, Africa and Latin America Wafer Level Packaging Revenue by Application (2018-2029)
11.3 Middle East, Africa and Latin America Wafer Level Packaging Sales by Country
11.3.1 Middle East, Africa and Latin America Wafer Level Packaging Revenue by Country: 2018 VS 2022 VS 2029
11.3.2 Middle East, Africa and Latin America Wafer Level Packaging Revenue by Country (2018-2029)
11.3.3 Middle East, Africa and Latin America Wafer Level Packaging Sales by Country (2018-2029)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 Amkor Technology Inc
12.1.1 Amkor Technology Inc Company Information
12.1.2 Amkor Technology Inc Overview
12.1.3 Amkor Technology Inc Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.1.4 Amkor Technology Inc Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 Amkor Technology Inc Recent Developments
12.2 Fujitsu Ltd
12.2.1 Fujitsu Ltd Company Information
12.2.2 Fujitsu Ltd Overview
12.2.3 Fujitsu Ltd Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.2.4 Fujitsu Ltd Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Fujitsu Ltd Recent Developments
12.3 Jiangsu Changjiang Electronics
12.3.1 Jiangsu Changjiang Electronics Company Information
12.3.2 Jiangsu Changjiang Electronics Overview
12.3.3 Jiangsu Changjiang Electronics Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.3.4 Jiangsu Changjiang Electronics Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Jiangsu Changjiang Electronics Recent Developments
12.4 Deca Technologies
12.4.1 Deca Technologies Company Information
12.4.2 Deca Technologies Overview
12.4.3 Deca Technologies Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.4.4 Deca Technologies Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Deca Technologies Recent Developments
12.5 Qualcomm Inc
12.5.1 Qualcomm Inc Company Information
12.5.2 Qualcomm Inc Overview
12.5.3 Qualcomm Inc Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.5.4 Qualcomm Inc Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Qualcomm Inc Recent Developments
12.6 Toshiba Corp
12.6.1 Toshiba Corp Company Information
12.6.2 Toshiba Corp Overview
12.6.3 Toshiba Corp Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.6.4 Toshiba Corp Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Toshiba Corp Recent Developments
12.7 Tokyo Electron Ltd
12.7.1 Tokyo Electron Ltd Company Information
12.7.2 Tokyo Electron Ltd Overview
12.7.3 Tokyo Electron Ltd Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.7.4 Tokyo Electron Ltd Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 Tokyo Electron Ltd Recent Developments
12.8 Applied Materials, Inc
12.8.1 Applied Materials, Inc Company Information
12.8.2 Applied Materials, Inc Overview
12.8.3 Applied Materials, Inc Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.8.4 Applied Materials, Inc Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Applied Materials, Inc Recent Developments
12.9 ASML Holding NV
12.9.1 ASML Holding NV Company Information
12.9.2 ASML Holding NV Overview
12.9.3 ASML Holding NV Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.9.4 ASML Holding NV Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 ASML Holding NV Recent Developments
12.10 Lam Research Corp
12.10.1 Lam Research Corp Company Information
12.10.2 Lam Research Corp Overview
12.10.3 Lam Research Corp Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.10.4 Lam Research Corp Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Lam Research Corp Recent Developments
12.11 KLA-Tencor Corration
12.11.1 KLA-Tencor Corration Company Information
12.11.2 KLA-Tencor Corration Overview
12.11.3 KLA-Tencor Corration Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.11.4 KLA-Tencor Corration Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 KLA-Tencor Corration Recent Developments
12.12 China Wafer Level CSP Co. Ltd
12.12.1 China Wafer Level CSP Co. Ltd Company Information
12.12.2 China Wafer Level CSP Co. Ltd Overview
12.12.3 China Wafer Level CSP Co. Ltd Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.12.4 China Wafer Level CSP Co. Ltd Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 China Wafer Level CSP Co. Ltd Recent Developments
12.13 Marvell Technology Group Ltd
12.13.1 Marvell Technology Group Ltd Company Information
12.13.2 Marvell Technology Group Ltd Overview
12.13.3 Marvell Technology Group Ltd Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.13.4 Marvell Technology Group Ltd Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.13.5 Marvell Technology Group Ltd Recent Developments
12.14 Siliconware Precision Industries
12.14.1 Siliconware Precision Industries Company Information
12.14.2 Siliconware Precision Industries Overview
12.14.3 Siliconware Precision Industries Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.14.4 Siliconware Precision Industries Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.14.5 Siliconware Precision Industries Recent Developments
12.15 Nanium SA
12.15.1 Nanium SA Company Information
12.15.2 Nanium SA Overview
12.15.3 Nanium SA Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.15.4 Nanium SA Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.15.5 Nanium SA Recent Developments
12.16 STATS Chip
12.16.1 STATS Chip Company Information
12.16.2 STATS Chip Overview
12.16.3 STATS Chip Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.16.4 STATS Chip Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.16.5 STATS Chip Recent Developments
12.17 PAC Ltd
12.17.1 PAC Ltd Company Information
12.17.2 PAC Ltd Overview
12.17.3 PAC Ltd Wafer Level Packaging Sales, Price, Revenue and Gross Margin (2018-2023)
12.17.4 PAC Ltd Wafer Level Packaging Product Model Numbers, Pictures, Descriptions and Specifications
12.17.5 PAC Ltd Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Wafer Level Packaging Industry Chain Analysis
13.2 Wafer Level Packaging Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Wafer Level Packaging Production Mode & Process
13.4 Wafer Level Packaging Sales and Marketing
13.4.1 Wafer Level Packaging Sales Channels
13.4.2 Wafer Level Packaging Distributors
13.5 Wafer Level Packaging Customers
14 Wafer Level Packaging Market Dynamics
14.1 Wafer Level Packaging Industry Trends
14.2 Wafer Level Packaging Market Drivers
14.3 Wafer Level Packaging Market Challenges
14.4 Wafer Level Packaging Market Restraints
15 Key Finding in The Global Wafer Level Packaging Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
Amkor Technology Inc
Fujitsu Ltd
Jiangsu Changjiang Electronics
Deca Technologies
Qualcomm Inc
Toshiba Corp
Tokyo Electron Ltd
Applied Materials, Inc
ASML Holding NV
Lam Research Corp
KLA-Tencor Corration
China Wafer Level CSP Co. Ltd
Marvell Technology Group Ltd
Siliconware Precision Industries
Nanium SA
STATS Chip
PAC Ltd
听
听
*If Applicable.
