Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Research Report 2023

Publication ID:

PB510232617

Publication Date:

October 16, 2023

Pages:

101

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) market is projected to reach US$ 3618.6 million in 2029, increasing from US$ 2601 million in 2022, with the CAGR of 4.9% during the period of 2023 to 2029.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) market with multiple angles, which provides sufficient supports to readers鈥� strategy and decision making.
By Company
SPTS Technologies
Atomica
ASE
JCET Group
Xintec
Microsystems
X-FAB
ISIT
LioniX International
MicraSilQ
STMicroelectronics
Bosch Sensortec
InvenSense
Analog Devices (ADI)
Knowles Corporation
Teledyne DALSA
FormFactor
SUSS MicroTec
Segment by Type
Optical Based
Infrared Type
Segment by Application
Consumer Electronics
Automotive Electronics
Industrial
Healthcare
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers鈥� Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers鈥� Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Overview
1.1 Product Definition
1.2 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Segment by Type
1.2.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Optical Based
1.2.3 Infrared Type
1.3 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Segment by Application
1.3.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Automotive Electronics
1.3.4 Industrial
1.3.5 Healthcare
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Estimates and Forecasts (2018-2029)
1.4.4 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Market Share by Manufacturers (2018-2023)
2.2 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems), Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems), Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems), Product Offered and Application
2.8 Global Key Manufacturers of Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems), Date of Enter into This Industry
2.9 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Competitive Situation and Trends
2.9.1 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production by Region
3.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value by Region (2018-2029)
3.2.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) by Region (2024-2029)
3.3 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production by Region (2018-2029)
3.4.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) by Region (2024-2029)
3.5 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Price Analysis by Region (2018-2023)
3.6 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value Estimates and Forecasts (2018-2029)
4 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Consumption by Region
4.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Consumption by Region (2018-2029)
4.2.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Consumption by Region (2018-2023)
4.2.2 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production by Type (2018-2029)
5.1.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production by Type (2018-2023)
5.1.2 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production by Type (2024-2029)
5.1.3 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Market Share by Type (2018-2029)
5.2 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value by Type (2018-2029)
5.2.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value by Type (2018-2023)
5.2.2 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value by Type (2024-2029)
5.2.3 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value Market Share by Type (2018-2029)
5.3 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Price by Type (2018-2029)
6 Segment by Application
6.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production by Application (2018-2029)
6.1.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production by Application (2018-2023)
6.1.2 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production by Application (2024-2029)
6.1.3 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Market Share by Application (2018-2029)
6.2 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value by Application (2018-2029)
6.2.1 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value by Application (2018-2023)
6.2.2 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value by Application (2024-2029)
6.2.3 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Value Market Share by Application (2018-2029)
6.3 Global Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Price by Application (2018-2029)
7 Key Companies Profiled
7.1 SPTS Technologies
7.1.1 SPTS Technologies Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.1.2 SPTS Technologies Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.1.3 SPTS Technologies Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.1.4 SPTS Technologies Main Business and Markets Served
7.1.5 SPTS Technologies Recent Developments/Updates
7.2 Atomica
7.2.1 Atomica Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.2.2 Atomica Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.2.3 Atomica Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Atomica Main Business and Markets Served
7.2.5 Atomica Recent Developments/Updates
7.3 ASE
7.3.1 ASE Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.3.2 ASE Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.3.3 ASE Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.3.4 ASE Main Business and Markets Served
7.3.5 ASE Recent Developments/Updates
7.4 JCET Group
7.4.1 JCET Group Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.4.2 JCET Group Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.4.3 JCET Group Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.4.4 JCET Group Main Business and Markets Served
7.4.5 JCET Group Recent Developments/Updates
7.5 Xintec
7.5.1 Xintec Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.5.2 Xintec Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.5.3 Xintec Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Xintec Main Business and Markets Served
7.5.5 Xintec Recent Developments/Updates
7.6 Microsystems
7.6.1 Microsystems Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.6.2 Microsystems Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.6.3 Microsystems Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Microsystems Main Business and Markets Served
7.6.5 Microsystems Recent Developments/Updates
7.7 X-FAB
7.7.1 X-FAB Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.7.2 X-FAB Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.7.3 X-FAB Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.7.4 X-FAB Main Business and Markets Served
7.7.5 X-FAB Recent Developments/Updates
7.8 ISIT
7.8.1 ISIT Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.8.2 ISIT Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.8.3 ISIT Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.8.4 ISIT Main Business and Markets Served
7.7.5 ISIT Recent Developments/Updates
7.9 LioniX International
7.9.1 LioniX International Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.9.2 LioniX International Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.9.3 LioniX International Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.9.4 LioniX International Main Business and Markets Served
7.9.5 LioniX International Recent Developments/Updates
7.10 MicraSilQ
7.10.1 MicraSilQ Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.10.2 MicraSilQ Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.10.3 MicraSilQ Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.10.4 MicraSilQ Main Business and Markets Served
7.10.5 MicraSilQ Recent Developments/Updates
7.11 STMicroelectronics
7.11.1 STMicroelectronics Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.11.2 STMicroelectronics Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.11.3 STMicroelectronics Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.11.4 STMicroelectronics Main Business and Markets Served
7.11.5 STMicroelectronics Recent Developments/Updates
7.12 Bosch Sensortec
7.12.1 Bosch Sensortec Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.12.2 Bosch Sensortec Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.12.3 Bosch Sensortec Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Bosch Sensortec Main Business and Markets Served
7.12.5 Bosch Sensortec Recent Developments/Updates
7.13 InvenSense
7.13.1 InvenSense Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.13.2 InvenSense Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.13.3 InvenSense Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.13.4 InvenSense Main Business and Markets Served
7.13.5 InvenSense Recent Developments/Updates
7.14 Analog Devices (ADI)
7.14.1 Analog Devices (ADI) Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.14.2 Analog Devices (ADI) Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.14.3 Analog Devices (ADI) Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Analog Devices (ADI) Main Business and Markets Served
7.14.5 Analog Devices (ADI) Recent Developments/Updates
7.15 Knowles Corporation
7.15.1 Knowles Corporation Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.15.2 Knowles Corporation Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.15.3 Knowles Corporation Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Knowles Corporation Main Business and Markets Served
7.15.5 Knowles Corporation Recent Developments/Updates
7.16 Teledyne DALSA
7.16.1 Teledyne DALSA Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.16.2 Teledyne DALSA Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.16.3 Teledyne DALSA Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.16.4 Teledyne DALSA Main Business and Markets Served
7.16.5 Teledyne DALSA Recent Developments/Updates
7.17 FormFactor
7.17.1 FormFactor Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.17.2 FormFactor Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.17.3 FormFactor Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.17.4 FormFactor Main Business and Markets Served
7.17.5 FormFactor Recent Developments/Updates
7.18 SUSS MicroTec
7.18.1 SUSS MicroTec Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Corporation Information
7.18.2 SUSS MicroTec Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Product Portfolio
7.18.3 SUSS MicroTec Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production, Value, Price and Gross Margin (2018-2023)
7.18.4 SUSS MicroTec Main Business and Markets Served
7.18.5 SUSS MicroTec Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Industry Chain Analysis
8.2 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Production Mode & Process
8.4 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Sales and Marketing
8.4.1 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Sales Channels
8.4.2 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Distributors
8.5 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Customers
9 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Dynamics
9.1 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Industry Trends
9.2 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Drivers
9.3 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Challenges
9.4 Wafer Level Packaging of MEMS(Micro Electro Mechanical Systems) Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

SPTS Technologies
Atomica
ASE
JCET Group
Xintec
Microsystems
X-FAB
ISIT
LioniX International
MicraSilQ
STMicroelectronics
Bosch Sensortec
InvenSense
Analog Devices (ADI)
Knowles Corporation
Teledyne DALSA
FormFactor
SUSS MicroTec

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