Wafer-level packaging involves attaching the top and bottom outer layers of packaging, and the solder bumps, to integrated circuits while still in the wafer, and then wafer dicing. We statistics in the report are the equipment used in the wafer-level packaging process.
Market Analysis and Insights: Global Wafer Level Packaging Technologies Market
The global Wafer Level Packaging Technologies market is projected to grow from US$ 2860 million in 2024 to US$ 4707.5 million by 2030, at a Compound Annual Growth Rate (CAGR) of 8.7% during the forecast period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Covers:
This report presents an overview of global market for Wafer Level Packaging Technologies market size. Analyses of the global market trends, with historic market revenue data for 2019 - 2023, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Wafer Level Packaging Technologies, also provides the revenue of main regions and countries. Highlights of the upcoming market potential for Wafer Level Packaging Technologies, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Wafer Level Packaging Technologies revenue, market share and industry ranking of main companies, data from 2019 to 2024. Identification of the major stakeholders in the global Wafer Level Packaging Technologies market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, revenue, and growth rate, from 2019 to 2030. Evaluation and forecast the market size for Wafer Level Packaging Technologies revenue, projected growth trends, production technology, application and end-user industry.
Market Segmentation
By Company
Samsung Electro-Mechanics
TSMC
Amkor Technology
Orbotech
Advanced Semiconductor Engineering
Deca Technologies
STATS ChipPAC
Nepes
Segment by Type
Fan-In Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Segment by Application
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Revenue of Wafer Level Packaging Technologies in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world. This section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Wafer Level Packaging Technologies companies鈥� competitive landscape, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the revenue, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: North America (US & Canada) by Type, by Application and by country, revenue for each segment.
Chapter 7: Europe by Type, by Application and by country, revenue for each segment.
Chapter 8: China by Type, and by Application, revenue for each segment.
Chapter 9: Asia (excluding China) by Type, by Application and by region, revenue for each segment.
Chapter 10: Middle East, Africa, and Latin America by Type, by Application and by country, revenue for each segment.
Chapter 11: Provides profiles of key companies, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Wafer Level Packaging Technologies revenue, gross margin, and recent development, etc.
Chapter 12: Analyst's Viewpoints/Conclusions
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Wafer Level Packaging Technologies Market Size Growth Rate by Type, 2019 VS 2023 VS 2030
1.2.2 Fan-In Wafer-Level Packaging
1.2.3 Fan-Out Wafer-Level Packaging
1.3 Market by Application
1.3.1 Global Wafer Level Packaging Technologies Market Size Growth Rate by Application, 2019 VS 2023 VS 2030
1.3.2 CMOS Image Sensor
1.3.3 Wireless Connectivity
1.3.4 Logic and Memory IC
1.3.5 MEMS and Sensor
1.3.6 Analog and Mixed IC
1.3.7 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global Wafer Level Packaging Technologies Market Perspective (2019-2030)
2.2 Global Wafer Level Packaging Technologies Growth Trends by Region
2.2.1 Wafer Level Packaging Technologies Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Wafer Level Packaging Technologies Historic Market Size by Region (2019-2024)
2.2.3 Wafer Level Packaging Technologies Forecasted Market Size by Region (2025-2030)
2.3 Wafer Level Packaging Technologies Market Dynamics
2.3.1 Wafer Level Packaging Technologies Industry Trends
2.3.2 Wafer Level Packaging Technologies Market Drivers
2.3.3 Wafer Level Packaging Technologies Market Challenges
2.3.4 Wafer Level Packaging Technologies Market Restraints
3 Competition Landscape by Key Players
3.1 Global Revenue Wafer Level Packaging Technologies by Players
3.1.1 Global Wafer Level Packaging Technologies Revenue by Players (2019-2024)
3.1.2 Global Wafer Level Packaging Technologies Revenue Market Share by Players (2019-2024)
3.2 Global Wafer Level Packaging Technologies Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players of Wafer Level Packaging Technologies, Ranking by Revenue, 2022 VS 2023 VS 2024
3.4 Global Wafer Level Packaging Technologies Market Concentration Ratio
3.4.1 Global Wafer Level Packaging Technologies Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Wafer Level Packaging Technologies Revenue in 2023
3.5 Global Key Players of Wafer Level Packaging Technologies Head office and Area Served
3.6 Global Key Players of Wafer Level Packaging Technologies, Product and Application
3.7 Global Key Players of Wafer Level Packaging Technologies, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 Wafer Level Packaging Technologies Breakdown Data by Type
4.1 Global Wafer Level Packaging Technologies Historic Market Size by Type (2019-2024)
4.2 Global Wafer Level Packaging Technologies Forecasted Market Size by Type (2025-2030)
5 Wafer Level Packaging Technologies Breakdown Data by Application
5.1 Global Wafer Level Packaging Technologies Historic Market Size by Application (2019-2024)
5.2 Global Wafer Level Packaging Technologies Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Wafer Level Packaging Technologies Market Size (2019-2030)
6.2 North America Wafer Level Packaging Technologies Market Size by Type
6.2.1 North America Wafer Level Packaging Technologies Market Size by Type (2019-2024)
6.2.2 North America Wafer Level Packaging Technologies Market Size by Type (2025-2030)
6.2.3 North America Wafer Level Packaging Technologies Market Share by Type (2019-2030)
6.3 North America Wafer Level Packaging Technologies Market Size by Application
6.3.1 North America Wafer Level Packaging Technologies Market Size by Application (2019-2024)
6.3.2 North America Wafer Level Packaging Technologies Market Size by Application (2025-2030)
6.3.3 North America Wafer Level Packaging Technologies Market Share by Application (2019-2030)
6.4 North America Wafer Level Packaging Technologies Market Size by Country
6.4.1 North America Wafer Level Packaging Technologies Market Size by Country: 2019 VS 2023 VS 2030
6.4.2 North America Wafer Level Packaging Technologies Market Size by Country (2019-2024)
6.4.3 North America Wafer Level Packaging Technologies Market Size by Country (2025-2030)
6.4.4 U.S.
6.4.5 Canada
7 Europe
7.1 Europe Wafer Level Packaging Technologies Market Size (2019-2030)
7.2 Europe Wafer Level Packaging Technologies Market Size by Type
7.2.1 Europe Wafer Level Packaging Technologies Market Size by Type (2019-2024)
7.2.2 Europe Wafer Level Packaging Technologies Market Size by Type (2025-2030)
7.2.3 Europe Wafer Level Packaging Technologies Market Share by Type (2019-2030)
7.3 Europe Wafer Level Packaging Technologies Market Size by Application
7.3.1 Europe Wafer Level Packaging Technologies Market Size by Application (2019-2024)
7.3.2 Europe Wafer Level Packaging Technologies Market Size by Application (2025-2030)
7.3.3 Europe Wafer Level Packaging Technologies Market Share by Application (2019-2030)
7.4 Europe Wafer Level Packaging Technologies Market Size by Country
7.4.1 Europe Wafer Level Packaging Technologies Market Size by Country: 2019 VS 2023 VS 2030
7.4.2 Europe Wafer Level Packaging Technologies Market Size by Country (2019-2024)
7.4.3 Europe Wafer Level Packaging Technologies Market Size by Country (2025-2030)
7.4.3 Germany
7.4.4 France
7.4.5 U.K.
7.4.6 Italy
7.4.7 Russia
7.4.8 Nordic Countries
8 China
8.1 China Wafer Level Packaging Technologies Market Size (2019-2030)
8.2 China Wafer Level Packaging Technologies Market Size by Type
8.2.1 China Wafer Level Packaging Technologies Market Size by Type (2019-2024)
8.2.2 China Wafer Level Packaging Technologies Market Size by Type (2025-2030)
8.2.3 China Wafer Level Packaging Technologies Market Share by Type (2019-2030)
8.3 China Wafer Level Packaging Technologies Market Size by Application
8.3.1 China Wafer Level Packaging Technologies Market Size by Application (2019-2024)
8.3.2 China Wafer Level Packaging Technologies Market Size by Application (2025-2030)
8.3.3 China Wafer Level Packaging Technologies Market Share by Application (2019-2030)
9 Asia (excluding China)
9.1 Asia Wafer Level Packaging Technologies Market Size (2019-2030)
9.2 Asia Wafer Level Packaging Technologies Market Size by Type
9.2.1 Asia Wafer Level Packaging Technologies Market Size by Type (2019-2024)
9.2.2 Asia Wafer Level Packaging Technologies Market Size by Type (2025-2030)
9.2.3 Asia Wafer Level Packaging Technologies Market Share by Type (2019-2030)
9.3 Asia Wafer Level Packaging Technologies Market Size by Application
9.3.1 Asia Wafer Level Packaging Technologies Market Size by Application (2019-2024)
9.3.2 Asia Wafer Level Packaging Technologies Market Size by Application (2025-2030)
9.3.3 Asia Wafer Level Packaging Technologies Market Share by Application (2019-2030)
9.4 Asia Wafer Level Packaging Technologies Market Size by Region
9.4.1 Asia Wafer Level Packaging Technologies Market Size by Region: 2019 VS 2023 VS 2030
9.4.2 Asia Wafer Level Packaging Technologies Market Size by Region (2019-2024)
9.4.3 Asia Wafer Level Packaging Technologies Market Size by Region (2025-2030)
9.4.4 Japan
9.4.5 South Korea
9.4.6 China Taiwan
9.4.7 Southeast Asia
9.4.8 India
9.4.9 Australia
10 Middle East, Africa, and Latin America
10.1 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Size (2019-2030)
10.2 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Size by Type
10.2.1 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Size by Type (2019-2024)
10.2.2 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Size by Type (2025-2030)
10.2.3 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Share by Type (2019-2030)
10.3 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Size by Application
10.3.1 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Size by Application (2019-2024)
10.3.2 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Size by Application (2025-2030)
10.3.3 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Share by Application (2019-2030)
10.4 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Size by Country
10.4.1 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Size by Country: 2019 VS 2023 VS 2030
10.4.2 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Size by Country (2019-2024)
10.4.3 Middle East, Africa, and Latin America Wafer Level Packaging Technologies Market Size by Country (2025-2030)
10.4.4 Brazil
10.4.5 Mexico
10.4.6 Turkey
10.4.7 Saudi Arabia
10.4.8 Israel
10.4.9 GCC Countries
11 Key Players Profiles
11.1 Samsung Electro-Mechanics
11.1.1 Samsung Electro-Mechanics Company Details
11.1.2 Samsung Electro-Mechanics Business Overview
11.1.3 Samsung Electro-Mechanics Wafer Level Packaging Technologies Introduction
11.1.4 Samsung Electro-Mechanics Revenue in Wafer Level Packaging Technologies Business (2019-2024)
11.1.5 Samsung Electro-Mechanics Recent Developments
11.2 TSMC
11.2.1 TSMC Company Details
11.2.2 TSMC Business Overview
11.2.3 TSMC Wafer Level Packaging Technologies Introduction
11.2.4 TSMC Revenue in Wafer Level Packaging Technologies Business (2019-2024)
11.2.5 TSMC Recent Developments
11.3 Amkor Technology
11.3.1 Amkor Technology Company Details
11.3.2 Amkor Technology Business Overview
11.3.3 Amkor Technology Wafer Level Packaging Technologies Introduction
11.3.4 Amkor Technology Revenue in Wafer Level Packaging Technologies Business (2019-2024)
11.3.5 Amkor Technology Recent Developments
11.4 Orbotech
11.4.1 Orbotech Company Details
11.4.2 Orbotech Business Overview
11.4.3 Orbotech Wafer Level Packaging Technologies Introduction
11.4.4 Orbotech Revenue in Wafer Level Packaging Technologies Business (2019-2024)
11.4.5 Orbotech Recent Developments
11.5 Advanced Semiconductor Engineering
11.5.1 Advanced Semiconductor Engineering Company Details
11.5.2 Advanced Semiconductor Engineering Business Overview
11.5.3 Advanced Semiconductor Engineering Wafer Level Packaging Technologies Introduction
11.5.4 Advanced Semiconductor Engineering Revenue in Wafer Level Packaging Technologies Business (2019-2024)
11.5.5 Advanced Semiconductor Engineering Recent Developments
11.6 Deca Technologies
11.6.1 Deca Technologies Company Details
11.6.2 Deca Technologies Business Overview
11.6.3 Deca Technologies Wafer Level Packaging Technologies Introduction
11.6.4 Deca Technologies Revenue in Wafer Level Packaging Technologies Business (2019-2024)
11.6.5 Deca Technologies Recent Developments
11.7 STATS ChipPAC
11.7.1 STATS ChipPAC Company Details
11.7.2 STATS ChipPAC Business Overview
11.7.3 STATS ChipPAC Wafer Level Packaging Technologies Introduction
11.7.4 STATS ChipPAC Revenue in Wafer Level Packaging Technologies Business (2019-2024)
11.7.5 STATS ChipPAC Recent Developments
11.8 Nepes
11.8.1 Nepes Company Details
11.8.2 Nepes Business Overview
11.8.3 Nepes Wafer Level Packaging Technologies Introduction
11.8.4 Nepes Revenue in Wafer Level Packaging Technologies Business (2019-2024)
11.8.5 Nepes Recent Developments
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Samsung Electro-Mechanics
TSMC
Amkor Technology
Orbotech
Advanced Semiconductor Engineering
Deca Technologies
STATS ChipPAC
Nepes
听
听
*If Applicable.
