IC chip packages refer to materials that contain semiconductor devices. Encapsulation is an enclosure that surrounds circuit material to protect it from corrosion or physical damage and to allow mounting of electrical contacts that connect it to a printed circuit board (PCB). IC chip packaging is capable of providing more and more I/O interconnects to smaller and smaller dies (bare chips).
The global market for IC Chip Packaging and Testing was estimated to be worth US$ 45100 million in 2023 and is forecast to a readjusted size of US$ 778.6 million by 2030 with a CAGR of 8.7% during the forecast period 2024-2030
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for IC Chip Packaging and Testing, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of IC Chip Packaging and Testing by region & country, by Type, and by Application.
The IC Chip Packaging and Testing market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Chip Packaging and Testing.
Market Segmentation
By Company
ASE
Amkor Technology
SPIL
Powertech Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC
J-Devices
ITEQ
HT-Tech
JCET
TongFu Microelectronics
Chipmore Technology
China Resources Microelectronics
Forehope Electronic
Wafer Level CSP
Chizhou HISEMI Electronic Technology
Keyang
Leadyo IC Testing
Segment by Type:
BGA
LGA
SiP
FC
Others
Segment by Application
Communications
Consumer Electronics
Electric Vehicles
Aerospace
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of IC Chip Packaging and Testing manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of IC Chip Packaging and Testing in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of IC Chip Packaging and Testing in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Market Overview
1.1 IC Chip Packaging and Testing Product Introduction
1.2 Global IC Chip Packaging and Testing Market Size Forecast
1.2.1 Global IC Chip Packaging and Testing Sales Value (2019-2030)
1.2.2 Global IC Chip Packaging and Testing Sales Volume (2019-2030)
1.2.3 Global IC Chip Packaging and Testing Sales Price (2019-2030)
1.3 IC Chip Packaging and Testing Market Trends & Drivers
1.3.1 IC Chip Packaging and Testing Industry Trends
1.3.2 IC Chip Packaging and Testing Market Drivers & Opportunity
1.3.3 IC Chip Packaging and Testing Market Challenges
1.3.4 IC Chip Packaging and Testing Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global IC Chip Packaging and Testing Players Revenue Ranking (2023)
2.2 Global IC Chip Packaging and Testing Revenue by Company (2019-2024)
2.3 Global IC Chip Packaging and Testing Players Sales Volume Ranking (2023)
2.4 Global IC Chip Packaging and Testing Sales Volume by Company Players (2019-2024)
2.5 Global IC Chip Packaging and Testing Average Price by Company (2019-2024)
2.6 Key Manufacturers IC Chip Packaging and Testing Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers IC Chip Packaging and Testing Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of IC Chip Packaging and Testing
2.9 IC Chip Packaging and Testing Market Competitive Analysis
2.9.1 IC Chip Packaging and Testing Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by IC Chip Packaging and Testing Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in IC Chip Packaging and Testing as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 BGA
3.1.2 LGA
3.1.3 SiP
3.1.4 FC
3.1.5 Others
3.2 Global IC Chip Packaging and Testing Sales Value by Type
3.2.1 Global IC Chip Packaging and Testing Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global IC Chip Packaging and Testing Sales Value, by Type (2019-2030)
3.2.3 Global IC Chip Packaging and Testing Sales Value, by Type (%) (2019-2030)
3.3 Global IC Chip Packaging and Testing Sales Volume by Type
3.3.1 Global IC Chip Packaging and Testing Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global IC Chip Packaging and Testing Sales Volume, by Type (2019-2030)
3.3.3 Global IC Chip Packaging and Testing Sales Volume, by Type (%) (2019-2030)
3.4 Global IC Chip Packaging and Testing Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Communications
4.1.2 Consumer Electronics
4.1.3 Electric Vehicles
4.1.4 Aerospace
4.1.5 Others
4.2 Global IC Chip Packaging and Testing Sales Value by Application
4.2.1 Global IC Chip Packaging and Testing Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global IC Chip Packaging and Testing Sales Value, by Application (2019-2030)
4.2.3 Global IC Chip Packaging and Testing Sales Value, by Application (%) (2019-2030)
4.3 Global IC Chip Packaging and Testing Sales Volume by Application
4.3.1 Global IC Chip Packaging and Testing Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global IC Chip Packaging and Testing Sales Volume, by Application (2019-2030)
4.3.3 Global IC Chip Packaging and Testing Sales Volume, by Application (%) (2019-2030)
4.4 Global IC Chip Packaging and Testing Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global IC Chip Packaging and Testing Sales Value by Region
5.1.1 Global IC Chip Packaging and Testing Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global IC Chip Packaging and Testing Sales Value by Region (2019-2024)
5.1.3 Global IC Chip Packaging and Testing Sales Value by Region (2025-2030)
5.1.4 Global IC Chip Packaging and Testing Sales Value by Region (%), (2019-2030)
5.2 Global IC Chip Packaging and Testing Sales Volume by Region
5.2.1 Global IC Chip Packaging and Testing Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global IC Chip Packaging and Testing Sales Volume by Region (2019-2024)
5.2.3 Global IC Chip Packaging and Testing Sales Volume by Region (2025-2030)
5.2.4 Global IC Chip Packaging and Testing Sales Volume by Region (%), (2019-2030)
5.3 Global IC Chip Packaging and Testing Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America IC Chip Packaging and Testing Sales Value, 2019-2030
5.4.2 North America IC Chip Packaging and Testing Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe IC Chip Packaging and Testing Sales Value, 2019-2030
5.5.2 Europe IC Chip Packaging and Testing Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific IC Chip Packaging and Testing Sales Value, 2019-2030
5.6.2 Asia Pacific IC Chip Packaging and Testing Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America IC Chip Packaging and Testing Sales Value, 2019-2030
5.7.2 South America IC Chip Packaging and Testing Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa IC Chip Packaging and Testing Sales Value, 2019-2030
5.8.2 Middle East & Africa IC Chip Packaging and Testing Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions IC Chip Packaging and Testing Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions IC Chip Packaging and Testing Sales Value
6.2.1 Key Countries/Regions IC Chip Packaging and Testing Sales Value, 2019-2030
6.2.2 Key Countries/Regions IC Chip Packaging and Testing Sales Volume, 2019-2030
6.3 United States
6.3.1 United States IC Chip Packaging and Testing Sales Value, 2019-2030
6.3.2 United States IC Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.3.3 United States IC Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe IC Chip Packaging and Testing Sales Value, 2019-2030
6.4.2 Europe IC Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe IC Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China IC Chip Packaging and Testing Sales Value, 2019-2030
6.5.2 China IC Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.5.3 China IC Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan IC Chip Packaging and Testing Sales Value, 2019-2030
6.6.2 Japan IC Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan IC Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea IC Chip Packaging and Testing Sales Value, 2019-2030
6.7.2 South Korea IC Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea IC Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia IC Chip Packaging and Testing Sales Value, 2019-2030
6.8.2 Southeast Asia IC Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia IC Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India IC Chip Packaging and Testing Sales Value, 2019-2030
6.9.2 India IC Chip Packaging and Testing Sales Value by Type (%), 2023 VS 2030
6.9.3 India IC Chip Packaging and Testing Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 ASE
7.1.1 ASE Company Information
7.1.2 ASE Introduction and Business Overview
7.1.3 ASE IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.1.4 ASE IC Chip Packaging and Testing Product Offerings
7.1.5 ASE Recent Development
7.2 Amkor Technology
7.2.1 Amkor Technology Company Information
7.2.2 Amkor Technology Introduction and Business Overview
7.2.3 Amkor Technology IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Amkor Technology IC Chip Packaging and Testing Product Offerings
7.2.5 Amkor Technology Recent Development
7.3 SPIL
7.3.1 SPIL Company Information
7.3.2 SPIL Introduction and Business Overview
7.3.3 SPIL IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.3.4 SPIL IC Chip Packaging and Testing Product Offerings
7.3.5 SPIL Recent Development
7.4 Powertech Technology
7.4.1 Powertech Technology Company Information
7.4.2 Powertech Technology Introduction and Business Overview
7.4.3 Powertech Technology IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Powertech Technology IC Chip Packaging and Testing Product Offerings
7.4.5 Powertech Technology Recent Development
7.5 UTAC
7.5.1 UTAC Company Information
7.5.2 UTAC Introduction and Business Overview
7.5.3 UTAC IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.5.4 UTAC IC Chip Packaging and Testing Product Offerings
7.5.5 UTAC Recent Development
7.6 Chipbond Technology
7.6.1 Chipbond Technology Company Information
7.6.2 Chipbond Technology Introduction and Business Overview
7.6.3 Chipbond Technology IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Chipbond Technology IC Chip Packaging and Testing Product Offerings
7.6.5 Chipbond Technology Recent Development
7.7 Hana Micron
7.7.1 Hana Micron Company Information
7.7.2 Hana Micron Introduction and Business Overview
7.7.3 Hana Micron IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Hana Micron IC Chip Packaging and Testing Product Offerings
7.7.5 Hana Micron Recent Development
7.8 OSE
7.8.1 OSE Company Information
7.8.2 OSE Introduction and Business Overview
7.8.3 OSE IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.8.4 OSE IC Chip Packaging and Testing Product Offerings
7.8.5 OSE Recent Development
7.9 Walton Advanced Engineering
7.9.1 Walton Advanced Engineering Company Information
7.9.2 Walton Advanced Engineering Introduction and Business Overview
7.9.3 Walton Advanced Engineering IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Walton Advanced Engineering IC Chip Packaging and Testing Product Offerings
7.9.5 Walton Advanced Engineering Recent Development
7.10 NEPES
7.10.1 NEPES Company Information
7.10.2 NEPES Introduction and Business Overview
7.10.3 NEPES IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.10.4 NEPES IC Chip Packaging and Testing Product Offerings
7.10.5 NEPES Recent Development
7.11 Unisem
7.11.1 Unisem Company Information
7.11.2 Unisem Introduction and Business Overview
7.11.3 Unisem IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.11.4 Unisem IC Chip Packaging and Testing Product Offerings
7.11.5 Unisem Recent Development
7.12 ChipMOS Technologies
7.12.1 ChipMOS Technologies Company Information
7.12.2 ChipMOS Technologies Introduction and Business Overview
7.12.3 ChipMOS Technologies IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.12.4 ChipMOS Technologies IC Chip Packaging and Testing Product Offerings
7.12.5 ChipMOS Technologies Recent Development
7.13 Signetics
7.13.1 Signetics Company Information
7.13.2 Signetics Introduction and Business Overview
7.13.3 Signetics IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.13.4 Signetics IC Chip Packaging and Testing Product Offerings
7.13.5 Signetics Recent Development
7.14 Carsem
7.14.1 Carsem Company Information
7.14.2 Carsem Introduction and Business Overview
7.14.3 Carsem IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.14.4 Carsem IC Chip Packaging and Testing Product Offerings
7.14.5 Carsem Recent Development
7.15 KYEC
7.15.1 KYEC Company Information
7.15.2 KYEC Introduction and Business Overview
7.15.3 KYEC IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.15.4 KYEC IC Chip Packaging and Testing Product Offerings
7.15.5 KYEC Recent Development
7.16 J-Devices
7.16.1 J-Devices Company Information
7.16.2 J-Devices Introduction and Business Overview
7.16.3 J-Devices IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.16.4 J-Devices IC Chip Packaging and Testing Product Offerings
7.16.5 J-Devices Recent Development
7.17 ITEQ
7.17.1 ITEQ Company Information
7.17.2 ITEQ Introduction and Business Overview
7.17.3 ITEQ IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.17.4 ITEQ IC Chip Packaging and Testing Product Offerings
7.17.5 ITEQ Recent Development
7.18 HT-Tech
7.18.1 HT-Tech Company Information
7.18.2 HT-Tech Introduction and Business Overview
7.18.3 HT-Tech IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.18.4 HT-Tech IC Chip Packaging and Testing Product Offerings
7.18.5 HT-Tech Recent Development
7.19 JCET
7.19.1 JCET Company Information
7.19.2 JCET Introduction and Business Overview
7.19.3 JCET IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.19.4 JCET IC Chip Packaging and Testing Product Offerings
7.19.5 JCET Recent Development
7.20 TongFu Microelectronics
7.20.1 TongFu Microelectronics Company Information
7.20.2 TongFu Microelectronics Introduction and Business Overview
7.20.3 TongFu Microelectronics IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.20.4 TongFu Microelectronics IC Chip Packaging and Testing Product Offerings
7.20.5 TongFu Microelectronics Recent Development
7.21 Chipmore Technology
7.21.1 Chipmore Technology Company Information
7.21.2 Chipmore Technology Introduction and Business Overview
7.21.3 Chipmore Technology IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.21.4 Chipmore Technology IC Chip Packaging and Testing Product Offerings
7.21.5 Chipmore Technology Recent Development
7.22 China Resources Microelectronics
7.22.1 China Resources Microelectronics Company Information
7.22.2 China Resources Microelectronics Introduction and Business Overview
7.22.3 China Resources Microelectronics IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.22.4 China Resources Microelectronics IC Chip Packaging and Testing Product Offerings
7.22.5 China Resources Microelectronics Recent Development
7.23 Forehope Electronic
7.23.1 Forehope Electronic Company Information
7.23.2 Forehope Electronic Introduction and Business Overview
7.23.3 Forehope Electronic IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.23.4 Forehope Electronic IC Chip Packaging and Testing Product Offerings
7.23.5 Forehope Electronic Recent Development
7.24 Wafer Level CSP
7.24.1 Wafer Level CSP Company Information
7.24.2 Wafer Level CSP Introduction and Business Overview
7.24.3 Wafer Level CSP IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.24.4 Wafer Level CSP IC Chip Packaging and Testing Product Offerings
7.24.5 Wafer Level CSP Recent Development
7.25 Chizhou HISEMI Electronic Technology
7.25.1 Chizhou HISEMI Electronic Technology Company Information
7.25.2 Chizhou HISEMI Electronic Technology Introduction and Business Overview
7.25.3 Chizhou HISEMI Electronic Technology IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.25.4 Chizhou HISEMI Electronic Technology IC Chip Packaging and Testing Product Offerings
7.25.5 Chizhou HISEMI Electronic Technology Recent Development
7.26 Keyang
7.26.1 Keyang Company Information
7.26.2 Keyang Introduction and Business Overview
7.26.3 Keyang IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.26.4 Keyang IC Chip Packaging and Testing Product Offerings
7.26.5 Keyang Recent Development
7.27 Leadyo IC Testing
7.27.1 Leadyo IC Testing Company Information
7.27.2 Leadyo IC Testing Introduction and Business Overview
7.27.3 Leadyo IC Testing IC Chip Packaging and Testing Sales, Revenue and Gross Margin (2019-2024)
7.27.4 Leadyo IC Testing IC Chip Packaging and Testing Product Offerings
7.27.5 Leadyo IC Testing Recent Development
8 Industry Chain Analysis
8.1 IC Chip Packaging and Testing Industrial Chain
8.2 IC Chip Packaging and Testing Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 IC Chip Packaging and Testing Sales Model
8.5.2 Sales Channel
8.5.3 IC Chip Packaging and Testing Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
ASE
Amkor Technology
SPIL
Powertech Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC
J-Devices
ITEQ
HT-Tech
JCET
TongFu Microelectronics
Chipmore Technology
China Resources Microelectronics
Forehope Electronic
Wafer Level CSP
Chizhou HISEMI Electronic Technology
Keyang
Leadyo IC Testing
听
听
*If Applicable.
