Packaging and testing belong to the back-end process, its purpose is to complete the semiconductor the chip is packaged and protected, and the pins are led out. At the same time, the reliability, stability is tested, and finally commercialized semiconductor products are formed.
The global market for IC Packaging and Testing Equipment was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
North American market for IC Packaging and Testing Equipment was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for IC Packaging and Testing Equipment was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Europe market for IC Packaging and Testing Equipment was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global key companies of IC Packaging and Testing Equipment include Amkor Technology, UTAC Holdings, Nepes, Unisem, JCET Group, Siliconware Precision Industries, KYEC, TongFu Microelectronics and ITEQ Corporation, etc. In 2023, the global five largest players hold a share approximately % in terms of revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for IC Packaging and Testing Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of IC Packaging and Testing Equipment by region & country, by Type, and by Application.
The IC Packaging and Testing Equipment market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding IC Packaging and Testing Equipment.
Market Segmentation
By Company
Amkor Technology
UTAC Holdings
Nepes
Unisem
JCET Group
Siliconware Precision Industries
KYEC
TongFu Microelectronics
ITEQ Corporation
Powertech Technology Inc. (PTI)
TSHT
Chipbond Technology
LCSP
Segment by Type:
IC Packaging Equipment
IC Packaging Testing Equipment
Segment by Application
IC
Advanced Packaging
MEMS
LED
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of IC Packaging and Testing Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of IC Packaging and Testing Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of IC Packaging and Testing Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 Market Overview
1.1 IC Packaging and Testing Equipment Product Introduction
1.2 Global IC Packaging and Testing Equipment Market Size Forecast
1.2.1 Global IC Packaging and Testing Equipment Sales Value (2019-2030)
1.2.2 Global IC Packaging and Testing Equipment Sales Volume (2019-2030)
1.2.3 Global IC Packaging and Testing Equipment Sales Price (2019-2030)
1.3 IC Packaging and Testing Equipment Market Trends & Drivers
1.3.1 IC Packaging and Testing Equipment Industry Trends
1.3.2 IC Packaging and Testing Equipment Market Drivers & Opportunity
1.3.3 IC Packaging and Testing Equipment Market Challenges
1.3.4 IC Packaging and Testing Equipment Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global IC Packaging and Testing Equipment Players Revenue Ranking (2023)
2.2 Global IC Packaging and Testing Equipment Revenue by Company (2019-2024)
2.3 Global IC Packaging and Testing Equipment Players Sales Volume Ranking (2023)
2.4 Global IC Packaging and Testing Equipment Sales Volume by Company Players (2019-2024)
2.5 Global IC Packaging and Testing Equipment Average Price by Company (2019-2024)
2.6 Key Manufacturers IC Packaging and Testing Equipment Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers IC Packaging and Testing Equipment Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of IC Packaging and Testing Equipment
2.9 IC Packaging and Testing Equipment Market Competitive Analysis
2.9.1 IC Packaging and Testing Equipment Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by IC Packaging and Testing Equipment Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in IC Packaging and Testing Equipment as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 IC Packaging Equipment
3.1.2 IC Packaging Testing Equipment
3.2 Global IC Packaging and Testing Equipment Sales Value by Type
3.2.1 Global IC Packaging and Testing Equipment Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global IC Packaging and Testing Equipment Sales Value, by Type (2019-2030)
3.2.3 Global IC Packaging and Testing Equipment Sales Value, by Type (%) (2019-2030)
3.3 Global IC Packaging and Testing Equipment Sales Volume by Type
3.3.1 Global IC Packaging and Testing Equipment Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global IC Packaging and Testing Equipment Sales Volume, by Type (2019-2030)
3.3.3 Global IC Packaging and Testing Equipment Sales Volume, by Type (%) (2019-2030)
3.4 Global IC Packaging and Testing Equipment Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 IC
4.1.2 Advanced Packaging
4.1.3 MEMS
4.1.4 LED
4.2 Global IC Packaging and Testing Equipment Sales Value by Application
4.2.1 Global IC Packaging and Testing Equipment Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global IC Packaging and Testing Equipment Sales Value, by Application (2019-2030)
4.2.3 Global IC Packaging and Testing Equipment Sales Value, by Application (%) (2019-2030)
4.3 Global IC Packaging and Testing Equipment Sales Volume by Application
4.3.1 Global IC Packaging and Testing Equipment Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global IC Packaging and Testing Equipment Sales Volume, by Application (2019-2030)
4.3.3 Global IC Packaging and Testing Equipment Sales Volume, by Application (%) (2019-2030)
4.4 Global IC Packaging and Testing Equipment Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global IC Packaging and Testing Equipment Sales Value by Region
5.1.1 Global IC Packaging and Testing Equipment Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global IC Packaging and Testing Equipment Sales Value by Region (2019-2024)
5.1.3 Global IC Packaging and Testing Equipment Sales Value by Region (2025-2030)
5.1.4 Global IC Packaging and Testing Equipment Sales Value by Region (%), (2019-2030)
5.2 Global IC Packaging and Testing Equipment Sales Volume by Region
5.2.1 Global IC Packaging and Testing Equipment Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global IC Packaging and Testing Equipment Sales Volume by Region (2019-2024)
5.2.3 Global IC Packaging and Testing Equipment Sales Volume by Region (2025-2030)
5.2.4 Global IC Packaging and Testing Equipment Sales Volume by Region (%), (2019-2030)
5.3 Global IC Packaging and Testing Equipment Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America IC Packaging and Testing Equipment Sales Value, 2019-2030
5.4.2 North America IC Packaging and Testing Equipment Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe IC Packaging and Testing Equipment Sales Value, 2019-2030
5.5.2 Europe IC Packaging and Testing Equipment Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific IC Packaging and Testing Equipment Sales Value, 2019-2030
5.6.2 Asia Pacific IC Packaging and Testing Equipment Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America IC Packaging and Testing Equipment Sales Value, 2019-2030
5.7.2 South America IC Packaging and Testing Equipment Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa IC Packaging and Testing Equipment Sales Value, 2019-2030
5.8.2 Middle East & Africa IC Packaging and Testing Equipment Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions IC Packaging and Testing Equipment Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions IC Packaging and Testing Equipment Sales Value
6.2.1 Key Countries/Regions IC Packaging and Testing Equipment Sales Value, 2019-2030
6.2.2 Key Countries/Regions IC Packaging and Testing Equipment Sales Volume, 2019-2030
6.3 United States
6.3.1 United States IC Packaging and Testing Equipment Sales Value, 2019-2030
6.3.2 United States IC Packaging and Testing Equipment Sales Value by Type (%), 2023 VS 2030
6.3.3 United States IC Packaging and Testing Equipment Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe IC Packaging and Testing Equipment Sales Value, 2019-2030
6.4.2 Europe IC Packaging and Testing Equipment Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe IC Packaging and Testing Equipment Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China IC Packaging and Testing Equipment Sales Value, 2019-2030
6.5.2 China IC Packaging and Testing Equipment Sales Value by Type (%), 2023 VS 2030
6.5.3 China IC Packaging and Testing Equipment Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan IC Packaging and Testing Equipment Sales Value, 2019-2030
6.6.2 Japan IC Packaging and Testing Equipment Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan IC Packaging and Testing Equipment Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea IC Packaging and Testing Equipment Sales Value, 2019-2030
6.7.2 South Korea IC Packaging and Testing Equipment Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea IC Packaging and Testing Equipment Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia IC Packaging and Testing Equipment Sales Value, 2019-2030
6.8.2 Southeast Asia IC Packaging and Testing Equipment Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia IC Packaging and Testing Equipment Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India IC Packaging and Testing Equipment Sales Value, 2019-2030
6.9.2 India IC Packaging and Testing Equipment Sales Value by Type (%), 2023 VS 2030
6.9.3 India IC Packaging and Testing Equipment Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Amkor Technology
7.1.1 Amkor Technology Company Information
7.1.2 Amkor Technology Introduction and Business Overview
7.1.3 Amkor Technology IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Amkor Technology IC Packaging and Testing Equipment Product Offerings
7.1.5 Amkor Technology Recent Development
7.2 UTAC Holdings
7.2.1 UTAC Holdings Company Information
7.2.2 UTAC Holdings Introduction and Business Overview
7.2.3 UTAC Holdings IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.2.4 UTAC Holdings IC Packaging and Testing Equipment Product Offerings
7.2.5 UTAC Holdings Recent Development
7.3 Nepes
7.3.1 Nepes Company Information
7.3.2 Nepes Introduction and Business Overview
7.3.3 Nepes IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Nepes IC Packaging and Testing Equipment Product Offerings
7.3.5 Nepes Recent Development
7.4 Unisem
7.4.1 Unisem Company Information
7.4.2 Unisem Introduction and Business Overview
7.4.3 Unisem IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Unisem IC Packaging and Testing Equipment Product Offerings
7.4.5 Unisem Recent Development
7.5 JCET Group
7.5.1 JCET Group Company Information
7.5.2 JCET Group Introduction and Business Overview
7.5.3 JCET Group IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.5.4 JCET Group IC Packaging and Testing Equipment Product Offerings
7.5.5 JCET Group Recent Development
7.6 Siliconware Precision Industries
7.6.1 Siliconware Precision Industries Company Information
7.6.2 Siliconware Precision Industries Introduction and Business Overview
7.6.3 Siliconware Precision Industries IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Siliconware Precision Industries IC Packaging and Testing Equipment Product Offerings
7.6.5 Siliconware Precision Industries Recent Development
7.7 KYEC
7.7.1 KYEC Company Information
7.7.2 KYEC Introduction and Business Overview
7.7.3 KYEC IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.7.4 KYEC IC Packaging and Testing Equipment Product Offerings
7.7.5 KYEC Recent Development
7.8 TongFu Microelectronics
7.8.1 TongFu Microelectronics Company Information
7.8.2 TongFu Microelectronics Introduction and Business Overview
7.8.3 TongFu Microelectronics IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.8.4 TongFu Microelectronics IC Packaging and Testing Equipment Product Offerings
7.8.5 TongFu Microelectronics Recent Development
7.9 ITEQ Corporation
7.9.1 ITEQ Corporation Company Information
7.9.2 ITEQ Corporation Introduction and Business Overview
7.9.3 ITEQ Corporation IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.9.4 ITEQ Corporation IC Packaging and Testing Equipment Product Offerings
7.9.5 ITEQ Corporation Recent Development
7.10 Powertech Technology Inc. (PTI)
7.10.1 Powertech Technology Inc. (PTI) Company Information
7.10.2 Powertech Technology Inc. (PTI) Introduction and Business Overview
7.10.3 Powertech Technology Inc. (PTI) IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Powertech Technology Inc. (PTI) IC Packaging and Testing Equipment Product Offerings
7.10.5 Powertech Technology Inc. (PTI) Recent Development
7.11 TSHT
7.11.1 TSHT Company Information
7.11.2 TSHT Introduction and Business Overview
7.11.3 TSHT IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.11.4 TSHT IC Packaging and Testing Equipment Product Offerings
7.11.5 TSHT Recent Development
7.12 Chipbond Technology
7.12.1 Chipbond Technology Company Information
7.12.2 Chipbond Technology Introduction and Business Overview
7.12.3 Chipbond Technology IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.12.4 Chipbond Technology IC Packaging and Testing Equipment Product Offerings
7.12.5 Chipbond Technology Recent Development
7.13 LCSP
7.13.1 LCSP Company Information
7.13.2 LCSP Introduction and Business Overview
7.13.3 LCSP IC Packaging and Testing Equipment Sales, Revenue and Gross Margin (2019-2024)
7.13.4 LCSP IC Packaging and Testing Equipment Product Offerings
7.13.5 LCSP Recent Development
8 Industry Chain Analysis
8.1 IC Packaging and Testing Equipment Industrial Chain
8.2 IC Packaging and Testing Equipment Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 IC Packaging and Testing Equipment Sales Model
8.5.2 Sales Channel
8.5.3 IC Packaging and Testing Equipment Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Amkor Technology
UTAC Holdings
Nepes
Unisem
JCET Group
Siliconware Precision Industries
KYEC
TongFu Microelectronics
ITEQ Corporation
Powertech Technology Inc. (PTI)
TSHT
Chipbond Technology
LCSP
听
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*If Applicable.