The global market for Memory Package Substrate was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Memory Package Substrate, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Memory Package Substrate by region & country, by Type, and by Application.
The Memory Package Substrate market size, estimations, and forecasts are provided in terms of sales volume (K Sqm) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Memory Package Substrate.
Market Segmentation
By Company
Samsung Electro-Mechanics
Simmtech
Daeduck
Korea Circuit
Ibiden
Kyocera
ASE Group
Shinko
Fujitsu Global
Doosan Electronic
Toppan Printing
Unimicron
Kinsus
Nanya
Segment by Type:
WB BGA
FC BGA
3D IC
WL CSP
Segment by Application
Non-volatile Memory
Volatile MEmory
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Memory Package Substrate manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Memory Package Substrate in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Memory Package Substrate in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 Market Overview
1.1 Memory Package Substrate Product Introduction
1.2 Global Memory Package Substrate Market Size Forecast
1.2.1 Global Memory Package Substrate Sales Value (2019-2030)
1.2.2 Global Memory Package Substrate Sales Volume (2019-2030)
1.2.3 Global Memory Package Substrate Sales Price (2019-2030)
1.3 Memory Package Substrate Market Trends & Drivers
1.3.1 Memory Package Substrate Industry Trends
1.3.2 Memory Package Substrate Market Drivers & Opportunity
1.3.3 Memory Package Substrate Market Challenges
1.3.4 Memory Package Substrate Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Memory Package Substrate Players Revenue Ranking (2023)
2.2 Global Memory Package Substrate Revenue by Company (2019-2024)
2.3 Global Memory Package Substrate Players Sales Volume Ranking (2023)
2.4 Global Memory Package Substrate Sales Volume by Company Players (2019-2024)
2.5 Global Memory Package Substrate Average Price by Company (2019-2024)
2.6 Key Manufacturers Memory Package Substrate Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Memory Package Substrate Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Memory Package Substrate
2.9 Memory Package Substrate Market Competitive Analysis
2.9.1 Memory Package Substrate Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Memory Package Substrate Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Memory Package Substrate as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 WB BGA
3.1.2 FC BGA
3.1.3 3D IC
3.1.4 WL CSP
3.2 Global Memory Package Substrate Sales Value by Type
3.2.1 Global Memory Package Substrate Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Memory Package Substrate Sales Value, by Type (2019-2030)
3.2.3 Global Memory Package Substrate Sales Value, by Type (%) (2019-2030)
3.3 Global Memory Package Substrate Sales Volume by Type
3.3.1 Global Memory Package Substrate Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Memory Package Substrate Sales Volume, by Type (2019-2030)
3.3.3 Global Memory Package Substrate Sales Volume, by Type (%) (2019-2030)
3.4 Global Memory Package Substrate Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Non-volatile Memory
4.1.2 Volatile MEmory
4.2 Global Memory Package Substrate Sales Value by Application
4.2.1 Global Memory Package Substrate Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Memory Package Substrate Sales Value, by Application (2019-2030)
4.2.3 Global Memory Package Substrate Sales Value, by Application (%) (2019-2030)
4.3 Global Memory Package Substrate Sales Volume by Application
4.3.1 Global Memory Package Substrate Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Memory Package Substrate Sales Volume, by Application (2019-2030)
4.3.3 Global Memory Package Substrate Sales Volume, by Application (%) (2019-2030)
4.4 Global Memory Package Substrate Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Memory Package Substrate Sales Value by Region
5.1.1 Global Memory Package Substrate Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Memory Package Substrate Sales Value by Region (2019-2024)
5.1.3 Global Memory Package Substrate Sales Value by Region (2025-2030)
5.1.4 Global Memory Package Substrate Sales Value by Region (%), (2019-2030)
5.2 Global Memory Package Substrate Sales Volume by Region
5.2.1 Global Memory Package Substrate Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Memory Package Substrate Sales Volume by Region (2019-2024)
5.2.3 Global Memory Package Substrate Sales Volume by Region (2025-2030)
5.2.4 Global Memory Package Substrate Sales Volume by Region (%), (2019-2030)
5.3 Global Memory Package Substrate Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Memory Package Substrate Sales Value, 2019-2030
5.4.2 North America Memory Package Substrate Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Memory Package Substrate Sales Value, 2019-2030
5.5.2 Europe Memory Package Substrate Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Memory Package Substrate Sales Value, 2019-2030
5.6.2 Asia Pacific Memory Package Substrate Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Memory Package Substrate Sales Value, 2019-2030
5.7.2 South America Memory Package Substrate Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Memory Package Substrate Sales Value, 2019-2030
5.8.2 Middle East & Africa Memory Package Substrate Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Memory Package Substrate Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Memory Package Substrate Sales Value
6.2.1 Key Countries/Regions Memory Package Substrate Sales Value, 2019-2030
6.2.2 Key Countries/Regions Memory Package Substrate Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Memory Package Substrate Sales Value, 2019-2030
6.3.2 United States Memory Package Substrate Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Memory Package Substrate Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Memory Package Substrate Sales Value, 2019-2030
6.4.2 Europe Memory Package Substrate Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Memory Package Substrate Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Memory Package Substrate Sales Value, 2019-2030
6.5.2 China Memory Package Substrate Sales Value by Type (%), 2023 VS 2030
6.5.3 China Memory Package Substrate Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Memory Package Substrate Sales Value, 2019-2030
6.6.2 Japan Memory Package Substrate Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Memory Package Substrate Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Memory Package Substrate Sales Value, 2019-2030
6.7.2 South Korea Memory Package Substrate Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Memory Package Substrate Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Memory Package Substrate Sales Value, 2019-2030
6.8.2 Southeast Asia Memory Package Substrate Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Memory Package Substrate Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Memory Package Substrate Sales Value, 2019-2030
6.9.2 India Memory Package Substrate Sales Value by Type (%), 2023 VS 2030
6.9.3 India Memory Package Substrate Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Samsung Electro-Mechanics
7.1.1 Samsung Electro-Mechanics Company Information
7.1.2 Samsung Electro-Mechanics Introduction and Business Overview
7.1.3 Samsung Electro-Mechanics Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Samsung Electro-Mechanics Memory Package Substrate Product Offerings
7.1.5 Samsung Electro-Mechanics Recent Development
7.2 Simmtech
7.2.1 Simmtech Company Information
7.2.2 Simmtech Introduction and Business Overview
7.2.3 Simmtech Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Simmtech Memory Package Substrate Product Offerings
7.2.5 Simmtech Recent Development
7.3 Daeduck
7.3.1 Daeduck Company Information
7.3.2 Daeduck Introduction and Business Overview
7.3.3 Daeduck Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Daeduck Memory Package Substrate Product Offerings
7.3.5 Daeduck Recent Development
7.4 Korea Circuit
7.4.1 Korea Circuit Company Information
7.4.2 Korea Circuit Introduction and Business Overview
7.4.3 Korea Circuit Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Korea Circuit Memory Package Substrate Product Offerings
7.4.5 Korea Circuit Recent Development
7.5 Ibiden
7.5.1 Ibiden Company Information
7.5.2 Ibiden Introduction and Business Overview
7.5.3 Ibiden Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Ibiden Memory Package Substrate Product Offerings
7.5.5 Ibiden Recent Development
7.6 Kyocera
7.6.1 Kyocera Company Information
7.6.2 Kyocera Introduction and Business Overview
7.6.3 Kyocera Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Kyocera Memory Package Substrate Product Offerings
7.6.5 Kyocera Recent Development
7.7 ASE Group
7.7.1 ASE Group Company Information
7.7.2 ASE Group Introduction and Business Overview
7.7.3 ASE Group Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.7.4 ASE Group Memory Package Substrate Product Offerings
7.7.5 ASE Group Recent Development
7.8 Shinko
7.8.1 Shinko Company Information
7.8.2 Shinko Introduction and Business Overview
7.8.3 Shinko Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.8.4 Shinko Memory Package Substrate Product Offerings
7.8.5 Shinko Recent Development
7.9 Fujitsu Global
7.9.1 Fujitsu Global Company Information
7.9.2 Fujitsu Global Introduction and Business Overview
7.9.3 Fujitsu Global Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Fujitsu Global Memory Package Substrate Product Offerings
7.9.5 Fujitsu Global Recent Development
7.10 Doosan Electronic
7.10.1 Doosan Electronic Company Information
7.10.2 Doosan Electronic Introduction and Business Overview
7.10.3 Doosan Electronic Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Doosan Electronic Memory Package Substrate Product Offerings
7.10.5 Doosan Electronic Recent Development
7.11 Toppan Printing
7.11.1 Toppan Printing Company Information
7.11.2 Toppan Printing Introduction and Business Overview
7.11.3 Toppan Printing Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.11.4 Toppan Printing Memory Package Substrate Product Offerings
7.11.5 Toppan Printing Recent Development
7.12 Unimicron
7.12.1 Unimicron Company Information
7.12.2 Unimicron Introduction and Business Overview
7.12.3 Unimicron Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.12.4 Unimicron Memory Package Substrate Product Offerings
7.12.5 Unimicron Recent Development
7.13 Kinsus
7.13.1 Kinsus Company Information
7.13.2 Kinsus Introduction and Business Overview
7.13.3 Kinsus Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.13.4 Kinsus Memory Package Substrate Product Offerings
7.13.5 Kinsus Recent Development
7.14 Nanya
7.14.1 Nanya Company Information
7.14.2 Nanya Introduction and Business Overview
7.14.3 Nanya Memory Package Substrate Sales, Revenue and Gross Margin (2019-2024)
7.14.4 Nanya Memory Package Substrate Product Offerings
7.14.5 Nanya Recent Development
8 Industry Chain Analysis
8.1 Memory Package Substrate Industrial Chain
8.2 Memory Package Substrate Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Memory Package Substrate Sales Model
8.5.2 Sales Channel
8.5.3 Memory Package Substrate Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Samsung Electro-Mechanics
Simmtech
Daeduck
Korea Circuit
Ibiden
Kyocera
ASE Group
Shinko
Fujitsu Global
Doosan Electronic
Toppan Printing
Unimicron
Kinsus
Nanya
听
听
*If Applicable.
