Multi-chip package (MCP) memory refers to a memory device that contains multiple memory chips in a package. The types included in the MCP memory can be NOR Flash, NAND Flash, DRAM, SRAM, etc.
The global market for Multi-Chip Package Memory was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Multi-Chip Package Memory, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Multi-Chip Package Memory by region & country, by Type, and by Application.
The Multi-Chip Package Memory market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Multi-Chip Package Memory.
Market Segmentation
By Company
Micron Technology
Cypress Semiconductor
Kingston Technology
Microsemi
Winbond Electronics
Macronix International
Kontron
ON Semiconductor
Samsung Electronics
Artesyn Technologies
Integrated Silicon Solution Inc
Segment by Type:
NOR Flash
NAND Flash
DRAM
SRAM
Segment by Application
Comsumer Electronics
Auto Industry
IoT
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Multi-Chip Package Memory manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Multi-Chip Package Memory in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Multi-Chip Package Memory in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Market Overview
1.1 Multi-Chip Package Memory Product Introduction
1.2 Global Multi-Chip Package Memory Market Size Forecast
1.2.1 Global Multi-Chip Package Memory Sales Value (2019-2030)
1.2.2 Global Multi-Chip Package Memory Sales Volume (2019-2030)
1.2.3 Global Multi-Chip Package Memory Sales Price (2019-2030)
1.3 Multi-Chip Package Memory Market Trends & Drivers
1.3.1 Multi-Chip Package Memory Industry Trends
1.3.2 Multi-Chip Package Memory Market Drivers & Opportunity
1.3.3 Multi-Chip Package Memory Market Challenges
1.3.4 Multi-Chip Package Memory Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Multi-Chip Package Memory Players Revenue Ranking (2023)
2.2 Global Multi-Chip Package Memory Revenue by Company (2019-2024)
2.3 Global Multi-Chip Package Memory Players Sales Volume Ranking (2023)
2.4 Global Multi-Chip Package Memory Sales Volume by Company Players (2019-2024)
2.5 Global Multi-Chip Package Memory Average Price by Company (2019-2024)
2.6 Key Manufacturers Multi-Chip Package Memory Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Multi-Chip Package Memory Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Multi-Chip Package Memory
2.9 Multi-Chip Package Memory Market Competitive Analysis
2.9.1 Multi-Chip Package Memory Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Multi-Chip Package Memory Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Multi-Chip Package Memory as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 NOR Flash
3.1.2 NAND Flash
3.1.3 DRAM
3.1.4 SRAM
3.2 Global Multi-Chip Package Memory Sales Value by Type
3.2.1 Global Multi-Chip Package Memory Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Multi-Chip Package Memory Sales Value, by Type (2019-2030)
3.2.3 Global Multi-Chip Package Memory Sales Value, by Type (%) (2019-2030)
3.3 Global Multi-Chip Package Memory Sales Volume by Type
3.3.1 Global Multi-Chip Package Memory Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Multi-Chip Package Memory Sales Volume, by Type (2019-2030)
3.3.3 Global Multi-Chip Package Memory Sales Volume, by Type (%) (2019-2030)
3.4 Global Multi-Chip Package Memory Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Comsumer Electronics
4.1.2 Auto Industry
4.1.3 IoT
4.1.4 Others
4.2 Global Multi-Chip Package Memory Sales Value by Application
4.2.1 Global Multi-Chip Package Memory Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Multi-Chip Package Memory Sales Value, by Application (2019-2030)
4.2.3 Global Multi-Chip Package Memory Sales Value, by Application (%) (2019-2030)
4.3 Global Multi-Chip Package Memory Sales Volume by Application
4.3.1 Global Multi-Chip Package Memory Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Multi-Chip Package Memory Sales Volume, by Application (2019-2030)
4.3.3 Global Multi-Chip Package Memory Sales Volume, by Application (%) (2019-2030)
4.4 Global Multi-Chip Package Memory Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Multi-Chip Package Memory Sales Value by Region
5.1.1 Global Multi-Chip Package Memory Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Multi-Chip Package Memory Sales Value by Region (2019-2024)
5.1.3 Global Multi-Chip Package Memory Sales Value by Region (2025-2030)
5.1.4 Global Multi-Chip Package Memory Sales Value by Region (%), (2019-2030)
5.2 Global Multi-Chip Package Memory Sales Volume by Region
5.2.1 Global Multi-Chip Package Memory Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Multi-Chip Package Memory Sales Volume by Region (2019-2024)
5.2.3 Global Multi-Chip Package Memory Sales Volume by Region (2025-2030)
5.2.4 Global Multi-Chip Package Memory Sales Volume by Region (%), (2019-2030)
5.3 Global Multi-Chip Package Memory Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Multi-Chip Package Memory Sales Value, 2019-2030
5.4.2 North America Multi-Chip Package Memory Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Multi-Chip Package Memory Sales Value, 2019-2030
5.5.2 Europe Multi-Chip Package Memory Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Multi-Chip Package Memory Sales Value, 2019-2030
5.6.2 Asia Pacific Multi-Chip Package Memory Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Multi-Chip Package Memory Sales Value, 2019-2030
5.7.2 South America Multi-Chip Package Memory Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Multi-Chip Package Memory Sales Value, 2019-2030
5.8.2 Middle East & Africa Multi-Chip Package Memory Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Multi-Chip Package Memory Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Multi-Chip Package Memory Sales Value
6.2.1 Key Countries/Regions Multi-Chip Package Memory Sales Value, 2019-2030
6.2.2 Key Countries/Regions Multi-Chip Package Memory Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Multi-Chip Package Memory Sales Value, 2019-2030
6.3.2 United States Multi-Chip Package Memory Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Multi-Chip Package Memory Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Multi-Chip Package Memory Sales Value, 2019-2030
6.4.2 Europe Multi-Chip Package Memory Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Multi-Chip Package Memory Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Multi-Chip Package Memory Sales Value, 2019-2030
6.5.2 China Multi-Chip Package Memory Sales Value by Type (%), 2023 VS 2030
6.5.3 China Multi-Chip Package Memory Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Multi-Chip Package Memory Sales Value, 2019-2030
6.6.2 Japan Multi-Chip Package Memory Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Multi-Chip Package Memory Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Multi-Chip Package Memory Sales Value, 2019-2030
6.7.2 South Korea Multi-Chip Package Memory Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Multi-Chip Package Memory Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Multi-Chip Package Memory Sales Value, 2019-2030
6.8.2 Southeast Asia Multi-Chip Package Memory Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Multi-Chip Package Memory Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Multi-Chip Package Memory Sales Value, 2019-2030
6.9.2 India Multi-Chip Package Memory Sales Value by Type (%), 2023 VS 2030
6.9.3 India Multi-Chip Package Memory Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Micron Technology
7.1.1 Micron Technology Company Information
7.1.2 Micron Technology Introduction and Business Overview
7.1.3 Micron Technology Multi-Chip Package Memory Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Micron Technology Multi-Chip Package Memory Product Offerings
7.1.5 Micron Technology Recent Development
7.2 Cypress Semiconductor
7.2.1 Cypress Semiconductor Company Information
7.2.2 Cypress Semiconductor Introduction and Business Overview
7.2.3 Cypress Semiconductor Multi-Chip Package Memory Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Cypress Semiconductor Multi-Chip Package Memory Product Offerings
7.2.5 Cypress Semiconductor Recent Development
7.3 Kingston Technology
7.3.1 Kingston Technology Company Information
7.3.2 Kingston Technology Introduction and Business Overview
7.3.3 Kingston Technology Multi-Chip Package Memory Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Kingston Technology Multi-Chip Package Memory Product Offerings
7.3.5 Kingston Technology Recent Development
7.4 Microsemi
7.4.1 Microsemi Company Information
7.4.2 Microsemi Introduction and Business Overview
7.4.3 Microsemi Multi-Chip Package Memory Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Microsemi Multi-Chip Package Memory Product Offerings
7.4.5 Microsemi Recent Development
7.5 Winbond Electronics
7.5.1 Winbond Electronics Company Information
7.5.2 Winbond Electronics Introduction and Business Overview
7.5.3 Winbond Electronics Multi-Chip Package Memory Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Winbond Electronics Multi-Chip Package Memory Product Offerings
7.5.5 Winbond Electronics Recent Development
7.6 Macronix International
7.6.1 Macronix International Company Information
7.6.2 Macronix International Introduction and Business Overview
7.6.3 Macronix International Multi-Chip Package Memory Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Macronix International Multi-Chip Package Memory Product Offerings
7.6.5 Macronix International Recent Development
7.7 Kontron
7.7.1 Kontron Company Information
7.7.2 Kontron Introduction and Business Overview
7.7.3 Kontron Multi-Chip Package Memory Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Kontron Multi-Chip Package Memory Product Offerings
7.7.5 Kontron Recent Development
7.8 ON Semiconductor
7.8.1 ON Semiconductor Company Information
7.8.2 ON Semiconductor Introduction and Business Overview
7.8.3 ON Semiconductor Multi-Chip Package Memory Sales, Revenue and Gross Margin (2019-2024)
7.8.4 ON Semiconductor Multi-Chip Package Memory Product Offerings
7.8.5 ON Semiconductor Recent Development
7.9 Samsung Electronics
7.9.1 Samsung Electronics Company Information
7.9.2 Samsung Electronics Introduction and Business Overview
7.9.3 Samsung Electronics Multi-Chip Package Memory Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Samsung Electronics Multi-Chip Package Memory Product Offerings
7.9.5 Samsung Electronics Recent Development
7.10 Artesyn Technologies
7.10.1 Artesyn Technologies Company Information
7.10.2 Artesyn Technologies Introduction and Business Overview
7.10.3 Artesyn Technologies Multi-Chip Package Memory Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Artesyn Technologies Multi-Chip Package Memory Product Offerings
7.10.5 Artesyn Technologies Recent Development
7.11 Integrated Silicon Solution Inc
7.11.1 Integrated Silicon Solution Inc Company Information
7.11.2 Integrated Silicon Solution Inc Introduction and Business Overview
7.11.3 Integrated Silicon Solution Inc Multi-Chip Package Memory Sales, Revenue and Gross Margin (2019-2024)
7.11.4 Integrated Silicon Solution Inc Multi-Chip Package Memory Product Offerings
7.11.5 Integrated Silicon Solution Inc Recent Development
8 Industry Chain Analysis
8.1 Multi-Chip Package Memory Industrial Chain
8.2 Multi-Chip Package Memory Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Multi-Chip Package Memory Sales Model
8.5.2 Sales Channel
8.5.3 Multi-Chip Package Memory Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Micron Technology
Cypress Semiconductor
Kingston Technology
Microsemi
Winbond Electronics
Macronix International
Kontron
ON Semiconductor
Samsung Electronics
Artesyn Technologies
Integrated Silicon Solution Inc
听
听
*If Applicable.
