Multiple Chip Package (MCP) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB510243988

Publication Date:

October 25, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global market for Multiple Chip Package (MCP) was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Multiple Chip Package (MCP), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Multiple Chip Package (MCP) by region & country, by Type, and by Application.
The Multiple Chip Package (MCP) market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Multiple Chip Package (MCP).
Market Segmentation
By Company
Dosilicon
Samsung
Texas Instruments
Infineon (Cypress)
Micron Technology
Macronix
Winbond Electronics Corp
Segment by Type:
e.MMC-Based MCP
UFS-Based MCP (uMCP)
NAND-Based MCP
Segment by Application
Electronic Products
Industrial Manufacture
Medical Industry
Communications Industry
Other
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Multiple Chip Package (MCP) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Multiple Chip Package (MCP) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Multiple Chip Package (MCP) in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Market Overview
1.1 Multiple Chip Package (MCP) Product Introduction
1.2 Global Multiple Chip Package (MCP) Market Size Forecast
1.2.1 Global Multiple Chip Package (MCP) Sales Value (2019-2030)
1.2.2 Global Multiple Chip Package (MCP) Sales Volume (2019-2030)
1.2.3 Global Multiple Chip Package (MCP) Sales Price (2019-2030)
1.3 Multiple Chip Package (MCP) Market Trends & Drivers
1.3.1 Multiple Chip Package (MCP) Industry Trends
1.3.2 Multiple Chip Package (MCP) Market Drivers & Opportunity
1.3.3 Multiple Chip Package (MCP) Market Challenges
1.3.4 Multiple Chip Package (MCP) Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Multiple Chip Package (MCP) Players Revenue Ranking (2023)
2.2 Global Multiple Chip Package (MCP) Revenue by Company (2019-2024)
2.3 Global Multiple Chip Package (MCP) Players Sales Volume Ranking (2023)
2.4 Global Multiple Chip Package (MCP) Sales Volume by Company Players (2019-2024)
2.5 Global Multiple Chip Package (MCP) Average Price by Company (2019-2024)
2.6 Key Manufacturers Multiple Chip Package (MCP) Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Multiple Chip Package (MCP) Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Multiple Chip Package (MCP)
2.9 Multiple Chip Package (MCP) Market Competitive Analysis
2.9.1 Multiple Chip Package (MCP) Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Multiple Chip Package (MCP) Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Multiple Chip Package (MCP) as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 e.MMC-Based MCP
3.1.2 UFS-Based MCP (uMCP)
3.1.3 NAND-Based MCP
3.2 Global Multiple Chip Package (MCP) Sales Value by Type
3.2.1 Global Multiple Chip Package (MCP) Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Multiple Chip Package (MCP) Sales Value, by Type (2019-2030)
3.2.3 Global Multiple Chip Package (MCP) Sales Value, by Type (%) (2019-2030)
3.3 Global Multiple Chip Package (MCP) Sales Volume by Type
3.3.1 Global Multiple Chip Package (MCP) Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Multiple Chip Package (MCP) Sales Volume, by Type (2019-2030)
3.3.3 Global Multiple Chip Package (MCP) Sales Volume, by Type (%) (2019-2030)
3.4 Global Multiple Chip Package (MCP) Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Electronic Products
4.1.2 Industrial Manufacture
4.1.3 Medical Industry
4.1.4 Communications Industry
4.1.5 Other
4.2 Global Multiple Chip Package (MCP) Sales Value by Application
4.2.1 Global Multiple Chip Package (MCP) Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Multiple Chip Package (MCP) Sales Value, by Application (2019-2030)
4.2.3 Global Multiple Chip Package (MCP) Sales Value, by Application (%) (2019-2030)
4.3 Global Multiple Chip Package (MCP) Sales Volume by Application
4.3.1 Global Multiple Chip Package (MCP) Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Multiple Chip Package (MCP) Sales Volume, by Application (2019-2030)
4.3.3 Global Multiple Chip Package (MCP) Sales Volume, by Application (%) (2019-2030)
4.4 Global Multiple Chip Package (MCP) Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Multiple Chip Package (MCP) Sales Value by Region
5.1.1 Global Multiple Chip Package (MCP) Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Multiple Chip Package (MCP) Sales Value by Region (2019-2024)
5.1.3 Global Multiple Chip Package (MCP) Sales Value by Region (2025-2030)
5.1.4 Global Multiple Chip Package (MCP) Sales Value by Region (%), (2019-2030)
5.2 Global Multiple Chip Package (MCP) Sales Volume by Region
5.2.1 Global Multiple Chip Package (MCP) Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Multiple Chip Package (MCP) Sales Volume by Region (2019-2024)
5.2.3 Global Multiple Chip Package (MCP) Sales Volume by Region (2025-2030)
5.2.4 Global Multiple Chip Package (MCP) Sales Volume by Region (%), (2019-2030)
5.3 Global Multiple Chip Package (MCP) Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Multiple Chip Package (MCP) Sales Value, 2019-2030
5.4.2 North America Multiple Chip Package (MCP) Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Multiple Chip Package (MCP) Sales Value, 2019-2030
5.5.2 Europe Multiple Chip Package (MCP) Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Multiple Chip Package (MCP) Sales Value, 2019-2030
5.6.2 Asia Pacific Multiple Chip Package (MCP) Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Multiple Chip Package (MCP) Sales Value, 2019-2030
5.7.2 South America Multiple Chip Package (MCP) Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Multiple Chip Package (MCP) Sales Value, 2019-2030
5.8.2 Middle East & Africa Multiple Chip Package (MCP) Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Multiple Chip Package (MCP) Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Multiple Chip Package (MCP) Sales Value
6.2.1 Key Countries/Regions Multiple Chip Package (MCP) Sales Value, 2019-2030
6.2.2 Key Countries/Regions Multiple Chip Package (MCP) Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Multiple Chip Package (MCP) Sales Value, 2019-2030
6.3.2 United States Multiple Chip Package (MCP) Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Multiple Chip Package (MCP) Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Multiple Chip Package (MCP) Sales Value, 2019-2030
6.4.2 Europe Multiple Chip Package (MCP) Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Multiple Chip Package (MCP) Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Multiple Chip Package (MCP) Sales Value, 2019-2030
6.5.2 China Multiple Chip Package (MCP) Sales Value by Type (%), 2023 VS 2030
6.5.3 China Multiple Chip Package (MCP) Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Multiple Chip Package (MCP) Sales Value, 2019-2030
6.6.2 Japan Multiple Chip Package (MCP) Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Multiple Chip Package (MCP) Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Multiple Chip Package (MCP) Sales Value, 2019-2030
6.7.2 South Korea Multiple Chip Package (MCP) Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Multiple Chip Package (MCP) Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Multiple Chip Package (MCP) Sales Value, 2019-2030
6.8.2 Southeast Asia Multiple Chip Package (MCP) Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Multiple Chip Package (MCP) Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Multiple Chip Package (MCP) Sales Value, 2019-2030
6.9.2 India Multiple Chip Package (MCP) Sales Value by Type (%), 2023 VS 2030
6.9.3 India Multiple Chip Package (MCP) Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Dosilicon
7.1.1 Dosilicon Company Information
7.1.2 Dosilicon Introduction and Business Overview
7.1.3 Dosilicon Multiple Chip Package (MCP) Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Dosilicon Multiple Chip Package (MCP) Product Offerings
7.1.5 Dosilicon Recent Development
7.2 Samsung
7.2.1 Samsung Company Information
7.2.2 Samsung Introduction and Business Overview
7.2.3 Samsung Multiple Chip Package (MCP) Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Samsung Multiple Chip Package (MCP) Product Offerings
7.2.5 Samsung Recent Development
7.3 Texas Instruments
7.3.1 Texas Instruments Company Information
7.3.2 Texas Instruments Introduction and Business Overview
7.3.3 Texas Instruments Multiple Chip Package (MCP) Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Texas Instruments Multiple Chip Package (MCP) Product Offerings
7.3.5 Texas Instruments Recent Development
7.4 Infineon (Cypress)
7.4.1 Infineon (Cypress) Company Information
7.4.2 Infineon (Cypress) Introduction and Business Overview
7.4.3 Infineon (Cypress) Multiple Chip Package (MCP) Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Infineon (Cypress) Multiple Chip Package (MCP) Product Offerings
7.4.5 Infineon (Cypress) Recent Development
7.5 Micron Technology
7.5.1 Micron Technology Company Information
7.5.2 Micron Technology Introduction and Business Overview
7.5.3 Micron Technology Multiple Chip Package (MCP) Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Micron Technology Multiple Chip Package (MCP) Product Offerings
7.5.5 Micron Technology Recent Development
7.6 Macronix
7.6.1 Macronix Company Information
7.6.2 Macronix Introduction and Business Overview
7.6.3 Macronix Multiple Chip Package (MCP) Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Macronix Multiple Chip Package (MCP) Product Offerings
7.6.5 Macronix Recent Development
7.7 Winbond Electronics Corp
7.7.1 Winbond Electronics Corp Company Information
7.7.2 Winbond Electronics Corp Introduction and Business Overview
7.7.3 Winbond Electronics Corp Multiple Chip Package (MCP) Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Winbond Electronics Corp Multiple Chip Package (MCP) Product Offerings
7.7.5 Winbond Electronics Corp Recent Development
8 Industry Chain Analysis
8.1 Multiple Chip Package (MCP) Industrial Chain
8.2 Multiple Chip Package (MCP) Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Multiple Chip Package (MCP) Sales Model
8.5.2 Sales Channel
8.5.3 Multiple Chip Package (MCP) Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

Dosilicon
Samsung
Texas Instruments
Infineon (Cypress)
Micron Technology
Macronix
Winbond Electronics Corp

License Types:

Single User License (PDF)

This license allows for use of a publication by one person.
This person may print out a single copy of the publication.
This person can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
This person cannot share the publication (or any information contained therein) with any other person or persons.
Unless a Enterprise License is purchased, a Single User License must be purchased for every person that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Site License (PDF)*

This license allows for use of a publication by all users within one corporate location, e.g. a regional office.
These users may print out a single copy of the publication.
These users can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
These users cannot share the publication (or any information contained therein) with any other person or persons outside the corporate location for which the publication is purchased.
Unless a Enterprise License is purchased, a Site User License must be purchased for every corporate location by an organization that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Global License (PDF)*

This license allows for use of a publication by unlimited users within the purchasing organization e.g. all employees of a single company.
Each of these people may use the publication on any computer, and may print out the report, but may not share the publication (or any information contained therein) with any other person or persons outside of the organization.
These employees of purchasing organization can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.

*If Applicable.

91制片厂