The global market for Outsourced Semiconductor Assembly and Test Service was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Outsourced Semiconductor Assembly and Test Service, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Outsourced Semiconductor Assembly and Test Service by region & country, by Type, and by Application.
The Outsourced Semiconductor Assembly and Test Service market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Outsourced Semiconductor Assembly and Test Service.
Market Segmentation
By Company
ASE
Amkor Technology
JCET
SPIL
Powertech Technology Inc.
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC
Segment by Type:
Assembly Service
Test Service
Segment by Application
Communications
Automotive
Computing
Consumer Electronics
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Outsourced Semiconductor Assembly and Test Service manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Outsourced Semiconductor Assembly and Test Service in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Outsourced Semiconductor Assembly and Test Service in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 Market Overview
1.1 Outsourced Semiconductor Assembly and Test Service Product Introduction
1.2 Global Outsourced Semiconductor Assembly and Test Service Market Size Forecast
1.3 Outsourced Semiconductor Assembly and Test Service Market Trends & Drivers
1.3.1 Outsourced Semiconductor Assembly and Test Service Industry Trends
1.3.2 Outsourced Semiconductor Assembly and Test Service Market Drivers & Opportunity
1.3.3 Outsourced Semiconductor Assembly and Test Service Market Challenges
1.3.4 Outsourced Semiconductor Assembly and Test Service Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Outsourced Semiconductor Assembly and Test Service Players Revenue Ranking (2023)
2.2 Global Outsourced Semiconductor Assembly and Test Service Revenue by Company (2019-2024)
2.3 Key Companies Outsourced Semiconductor Assembly and Test Service Manufacturing Base Distribution and Headquarters
2.4 Key Companies Outsourced Semiconductor Assembly and Test Service Product Offered
2.5 Key Companies Time to Begin Mass Production of Outsourced Semiconductor Assembly and Test Service
2.6 Outsourced Semiconductor Assembly and Test Service Market Competitive Analysis
2.6.1 Outsourced Semiconductor Assembly and Test Service Market Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Outsourced Semiconductor Assembly and Test Service Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Outsourced Semiconductor Assembly and Test Service as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Assembly Service
3.1.2 Test Service
3.2 Global Outsourced Semiconductor Assembly and Test Service Sales Value by Type
3.2.1 Global Outsourced Semiconductor Assembly and Test Service Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Outsourced Semiconductor Assembly and Test Service Sales Value, by Type (2019-2030)
3.2.3 Global Outsourced Semiconductor Assembly and Test Service Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Communications
4.1.2 Automotive
4.1.3 Computing
4.1.4 Consumer Electronics
4.1.5 Others
4.2 Global Outsourced Semiconductor Assembly and Test Service Sales Value by Application
4.2.1 Global Outsourced Semiconductor Assembly and Test Service Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Outsourced Semiconductor Assembly and Test Service Sales Value, by Application (2019-2030)
4.2.3 Global Outsourced Semiconductor Assembly and Test Service Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Outsourced Semiconductor Assembly and Test Service Sales Value by Region
5.1.1 Global Outsourced Semiconductor Assembly and Test Service Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Outsourced Semiconductor Assembly and Test Service Sales Value by Region (2019-2024)
5.1.3 Global Outsourced Semiconductor Assembly and Test Service Sales Value by Region (2025-2030)
5.1.4 Global Outsourced Semiconductor Assembly and Test Service Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Outsourced Semiconductor Assembly and Test Service Sales Value, 2019-2030
5.2.2 North America Outsourced Semiconductor Assembly and Test Service Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Outsourced Semiconductor Assembly and Test Service Sales Value, 2019-2030
5.3.2 Europe Outsourced Semiconductor Assembly and Test Service Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Outsourced Semiconductor Assembly and Test Service Sales Value, 2019-2030
5.4.2 Asia Pacific Outsourced Semiconductor Assembly and Test Service Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Outsourced Semiconductor Assembly and Test Service Sales Value, 2019-2030
5.5.2 South America Outsourced Semiconductor Assembly and Test Service Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Outsourced Semiconductor Assembly and Test Service Sales Value, 2019-2030
5.6.2 Middle East & Africa Outsourced Semiconductor Assembly and Test Service Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Outsourced Semiconductor Assembly and Test Service Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Outsourced Semiconductor Assembly and Test Service Sales Value
6.3 United States
6.3.1 United States Outsourced Semiconductor Assembly and Test Service Sales Value, 2019-2030
6.3.2 United States Outsourced Semiconductor Assembly and Test Service Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Outsourced Semiconductor Assembly and Test Service Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Outsourced Semiconductor Assembly and Test Service Sales Value, 2019-2030
6.4.2 Europe Outsourced Semiconductor Assembly and Test Service Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Outsourced Semiconductor Assembly and Test Service Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Outsourced Semiconductor Assembly and Test Service Sales Value, 2019-2030
6.5.2 China Outsourced Semiconductor Assembly and Test Service Sales Value by Type (%), 2023 VS 2030
6.5.3 China Outsourced Semiconductor Assembly and Test Service Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Outsourced Semiconductor Assembly and Test Service Sales Value, 2019-2030
6.6.2 Japan Outsourced Semiconductor Assembly and Test Service Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Outsourced Semiconductor Assembly and Test Service Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Outsourced Semiconductor Assembly and Test Service Sales Value, 2019-2030
6.7.2 South Korea Outsourced Semiconductor Assembly and Test Service Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Outsourced Semiconductor Assembly and Test Service Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Outsourced Semiconductor Assembly and Test Service Sales Value, 2019-2030
6.8.2 Southeast Asia Outsourced Semiconductor Assembly and Test Service Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Outsourced Semiconductor Assembly and Test Service Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Outsourced Semiconductor Assembly and Test Service Sales Value, 2019-2030
6.9.2 India Outsourced Semiconductor Assembly and Test Service Sales Value by Type (%), 2023 VS 2030
6.9.3 India Outsourced Semiconductor Assembly and Test Service Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 ASE
7.1.1 ASE Profile
7.1.2 ASE Main Business
7.1.3 ASE Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.1.4 ASE Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.1.5 ASE Recent Developments
7.2 Amkor Technology
7.2.1 Amkor Technology Profile
7.2.2 Amkor Technology Main Business
7.2.3 Amkor Technology Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.2.4 Amkor Technology Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.2.5 Amkor Technology Recent Developments
7.3 JCET
7.3.1 JCET Profile
7.3.2 JCET Main Business
7.3.3 JCET Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.3.4 JCET Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.3.5 SPIL Recent Developments
7.4 SPIL
7.4.1 SPIL Profile
7.4.2 SPIL Main Business
7.4.3 SPIL Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.4.4 SPIL Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.4.5 SPIL Recent Developments
7.5 Powertech Technology Inc.
7.5.1 Powertech Technology Inc. Profile
7.5.2 Powertech Technology Inc. Main Business
7.5.3 Powertech Technology Inc. Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.5.4 Powertech Technology Inc. Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.5.5 Powertech Technology Inc. Recent Developments
7.6 TongFu Microelectronics
7.6.1 TongFu Microelectronics Profile
7.6.2 TongFu Microelectronics Main Business
7.6.3 TongFu Microelectronics Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.6.4 TongFu Microelectronics Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.6.5 TongFu Microelectronics Recent Developments
7.7 Tianshui Huatian Technology
7.7.1 Tianshui Huatian Technology Profile
7.7.2 Tianshui Huatian Technology Main Business
7.7.3 Tianshui Huatian Technology Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.7.4 Tianshui Huatian Technology Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.7.5 Tianshui Huatian Technology Recent Developments
7.8 UTAC
7.8.1 UTAC Profile
7.8.2 UTAC Main Business
7.8.3 UTAC Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.8.4 UTAC Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.8.5 UTAC Recent Developments
7.9 Chipbond Technology
7.9.1 Chipbond Technology Profile
7.9.2 Chipbond Technology Main Business
7.9.3 Chipbond Technology Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.9.4 Chipbond Technology Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.9.5 Chipbond Technology Recent Developments
7.10 Hana Micron
7.10.1 Hana Micron Profile
7.10.2 Hana Micron Main Business
7.10.3 Hana Micron Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.10.4 Hana Micron Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.10.5 Hana Micron Recent Developments
7.11 OSE
7.11.1 OSE Profile
7.11.2 OSE Main Business
7.11.3 OSE Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.11.4 OSE Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.11.5 OSE Recent Developments
7.12 Walton Advanced Engineering
7.12.1 Walton Advanced Engineering Profile
7.12.2 Walton Advanced Engineering Main Business
7.12.3 Walton Advanced Engineering Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.12.4 Walton Advanced Engineering Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.12.5 Walton Advanced Engineering Recent Developments
7.13 NEPES
7.13.1 NEPES Profile
7.13.2 NEPES Main Business
7.13.3 NEPES Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.13.4 NEPES Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.13.5 NEPES Recent Developments
7.14 Unisem
7.14.1 Unisem Profile
7.14.2 Unisem Main Business
7.14.3 Unisem Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.14.4 Unisem Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.14.5 Unisem Recent Developments
7.15 ChipMOS Technologies
7.15.1 ChipMOS Technologies Profile
7.15.2 ChipMOS Technologies Main Business
7.15.3 ChipMOS Technologies Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.15.4 ChipMOS Technologies Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.15.5 ChipMOS Technologies Recent Developments
7.16 Signetics
7.16.1 Signetics Profile
7.16.2 Signetics Main Business
7.16.3 Signetics Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.16.4 Signetics Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.16.5 Signetics Recent Developments
7.17 Carsem
7.17.1 Carsem Profile
7.17.2 Carsem Main Business
7.17.3 Carsem Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.17.4 Carsem Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.17.5 Carsem Recent Developments
7.18 KYEC
7.18.1 KYEC Profile
7.18.2 KYEC Main Business
7.18.3 KYEC Outsourced Semiconductor Assembly and Test Service Products, Services and Solutions
7.18.4 KYEC Outsourced Semiconductor Assembly and Test Service Revenue (US$ Million) & (2019-2024)
7.18.5 KYEC Recent Developments
8 Industry Chain Analysis
8.1 Outsourced Semiconductor Assembly and Test Service Industrial Chain
8.2 Outsourced Semiconductor Assembly and Test Service Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Outsourced Semiconductor Assembly and Test Service Sales Model
8.5.2 Sales Channel
8.5.3 Outsourced Semiconductor Assembly and Test Service Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
ASE
Amkor Technology
JCET
SPIL
Powertech Technology Inc.
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS Technologies
Signetics
Carsem
KYEC
听
听
*If Applicable.
