Outsourced Semiconductor Assembly and Testing - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB511248474

Publication Date:

November 8, 2024

Pages:

116

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

IT Services [2]

Computing & Electronics [3]

Description:

OSAT stands for Outsourced Semiconductor Assembly and Test. This report focuses on OSAT Providers. Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services.The OSATs are merchant vendors. IDMs and foundries with internal packaging operations also outsource a certain percentage of their IC-packaging production to the OSATs. The fabless companies also outsource their packaging to the OSATs and/or foundries.
The global market for Outsourced Semiconductor Assembly and Testing was estimated to be worth US$ 36680 million in 2023 and is forecast to a readjusted size of US$ 56090 million by 2030 with a CAGR of 6.3% during the forecast period 2024-2030
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Outsourced Semiconductor Assembly and Testing, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Outsourced Semiconductor Assembly and Testing by region & country, by Type, and by Application.
The Outsourced Semiconductor Assembly and Testing market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Outsourced Semiconductor Assembly and Testing.
Market Segmentation
By Company
ASE Technology Holding
Amkor Technology
Jiangsu Changjiang Electronics Technology
Powertech Technology Inc.
Tianshui Huatian Technology Co., LTD.
TongFu Microelectronics Co., LTD.
King Yuan Electronics Co., Ltd.
STATS ChipPAC
Siliconware Precision Industries
Unisem Group
UTAC Group
Chipbond Technology Corporation
ChipMOS Technologies
Segment by Type:
Outsourced Semiconductor Testing
Outsourced Semiconductor Assembly
Segment by Application
Automotive
Consumer Electronics
Industrial
Telecommunication
Others
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Outsourced Semiconductor Assembly and Testing manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Outsourced Semiconductor Assembly and Testing in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Outsourced Semiconductor Assembly and Testing in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table Of Contents:

1 Market Overview
1.1 Outsourced Semiconductor Assembly and Testing Product Introduction
1.2 Global Outsourced Semiconductor Assembly and Testing Market Size Forecast
1.3 Outsourced Semiconductor Assembly and Testing Market Trends & Drivers
1.3.1 Outsourced Semiconductor Assembly and Testing Industry Trends
1.3.2 Outsourced Semiconductor Assembly and Testing Market Drivers & Opportunity
1.3.3 Outsourced Semiconductor Assembly and Testing Market Challenges
1.3.4 Outsourced Semiconductor Assembly and Testing Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Outsourced Semiconductor Assembly and Testing Players Revenue Ranking (2023)
2.2 Global Outsourced Semiconductor Assembly and Testing Revenue by Company (2019-2024)
2.3 Key Companies Outsourced Semiconductor Assembly and Testing Manufacturing Base Distribution and Headquarters
2.4 Key Companies Outsourced Semiconductor Assembly and Testing Product Offered
2.5 Key Companies Time to Begin Mass Production of Outsourced Semiconductor Assembly and Testing
2.6 Outsourced Semiconductor Assembly and Testing Market Competitive Analysis
2.6.1 Outsourced Semiconductor Assembly and Testing Market Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Outsourced Semiconductor Assembly and Testing Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Outsourced Semiconductor Assembly and Testing as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Outsourced Semiconductor Testing
3.1.2 Outsourced Semiconductor Assembly
3.2 Global Outsourced Semiconductor Assembly and Testing Sales Value by Type
3.2.1 Global Outsourced Semiconductor Assembly and Testing Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Outsourced Semiconductor Assembly and Testing Sales Value, by Type (2019-2030)
3.2.3 Global Outsourced Semiconductor Assembly and Testing Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Automotive
4.1.2 Consumer Electronics
4.1.3 Industrial
4.1.4 Telecommunication
4.1.5 Others
4.2 Global Outsourced Semiconductor Assembly and Testing Sales Value by Application
4.2.1 Global Outsourced Semiconductor Assembly and Testing Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Outsourced Semiconductor Assembly and Testing Sales Value, by Application (2019-2030)
4.2.3 Global Outsourced Semiconductor Assembly and Testing Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Outsourced Semiconductor Assembly and Testing Sales Value by Region
5.1.1 Global Outsourced Semiconductor Assembly and Testing Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Outsourced Semiconductor Assembly and Testing Sales Value by Region (2019-2024)
5.1.3 Global Outsourced Semiconductor Assembly and Testing Sales Value by Region (2025-2030)
5.1.4 Global Outsourced Semiconductor Assembly and Testing Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Outsourced Semiconductor Assembly and Testing Sales Value, 2019-2030
5.2.2 North America Outsourced Semiconductor Assembly and Testing Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Outsourced Semiconductor Assembly and Testing Sales Value, 2019-2030
5.3.2 Europe Outsourced Semiconductor Assembly and Testing Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Outsourced Semiconductor Assembly and Testing Sales Value, 2019-2030
5.4.2 Asia Pacific Outsourced Semiconductor Assembly and Testing Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Outsourced Semiconductor Assembly and Testing Sales Value, 2019-2030
5.5.2 South America Outsourced Semiconductor Assembly and Testing Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Outsourced Semiconductor Assembly and Testing Sales Value, 2019-2030
5.6.2 Middle East & Africa Outsourced Semiconductor Assembly and Testing Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Outsourced Semiconductor Assembly and Testing Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Outsourced Semiconductor Assembly and Testing Sales Value
6.3 United States
6.3.1 United States Outsourced Semiconductor Assembly and Testing Sales Value, 2019-2030
6.3.2 United States Outsourced Semiconductor Assembly and Testing Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Outsourced Semiconductor Assembly and Testing Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Outsourced Semiconductor Assembly and Testing Sales Value, 2019-2030
6.4.2 Europe Outsourced Semiconductor Assembly and Testing Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Outsourced Semiconductor Assembly and Testing Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Outsourced Semiconductor Assembly and Testing Sales Value, 2019-2030
6.5.2 China Outsourced Semiconductor Assembly and Testing Sales Value by Type (%), 2023 VS 2030
6.5.3 China Outsourced Semiconductor Assembly and Testing Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Outsourced Semiconductor Assembly and Testing Sales Value, 2019-2030
6.6.2 Japan Outsourced Semiconductor Assembly and Testing Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Outsourced Semiconductor Assembly and Testing Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Outsourced Semiconductor Assembly and Testing Sales Value, 2019-2030
6.7.2 South Korea Outsourced Semiconductor Assembly and Testing Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Outsourced Semiconductor Assembly and Testing Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Outsourced Semiconductor Assembly and Testing Sales Value, 2019-2030
6.8.2 Southeast Asia Outsourced Semiconductor Assembly and Testing Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Outsourced Semiconductor Assembly and Testing Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Outsourced Semiconductor Assembly and Testing Sales Value, 2019-2030
6.9.2 India Outsourced Semiconductor Assembly and Testing Sales Value by Type (%), 2023 VS 2030
6.9.3 India Outsourced Semiconductor Assembly and Testing Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 ASE Technology Holding
7.1.1 ASE Technology Holding Profile
7.1.2 ASE Technology Holding Main Business
7.1.3 ASE Technology Holding Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.1.4 ASE Technology Holding Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.1.5 ASE Technology Holding Recent Developments
7.2 Amkor Technology
7.2.1 Amkor Technology Profile
7.2.2 Amkor Technology Main Business
7.2.3 Amkor Technology Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.2.4 Amkor Technology Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.2.5 Amkor Technology Recent Developments
7.3 Jiangsu Changjiang Electronics Technology
7.3.1 Jiangsu Changjiang Electronics Technology Profile
7.3.2 Jiangsu Changjiang Electronics Technology Main Business
7.3.3 Jiangsu Changjiang Electronics Technology Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.3.4 Jiangsu Changjiang Electronics Technology Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.3.5 Powertech Technology Inc. Recent Developments
7.4 Powertech Technology Inc.
7.4.1 Powertech Technology Inc. Profile
7.4.2 Powertech Technology Inc. Main Business
7.4.3 Powertech Technology Inc. Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.4.4 Powertech Technology Inc. Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.4.5 Powertech Technology Inc. Recent Developments
7.5 Tianshui Huatian Technology Co., LTD.
7.5.1 Tianshui Huatian Technology Co., LTD. Profile
7.5.2 Tianshui Huatian Technology Co., LTD. Main Business
7.5.3 Tianshui Huatian Technology Co., LTD. Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.5.4 Tianshui Huatian Technology Co., LTD. Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.5.5 Tianshui Huatian Technology Co., LTD. Recent Developments
7.6 TongFu Microelectronics Co., LTD.
7.6.1 TongFu Microelectronics Co., LTD. Profile
7.6.2 TongFu Microelectronics Co., LTD. Main Business
7.6.3 TongFu Microelectronics Co., LTD. Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.6.4 TongFu Microelectronics Co., LTD. Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.6.5 TongFu Microelectronics Co., LTD. Recent Developments
7.7 King Yuan Electronics Co., Ltd.
7.7.1 King Yuan Electronics Co., Ltd. Profile
7.7.2 King Yuan Electronics Co., Ltd. Main Business
7.7.3 King Yuan Electronics Co., Ltd. Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.7.4 King Yuan Electronics Co., Ltd. Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.7.5 King Yuan Electronics Co., Ltd. Recent Developments
7.8 STATS ChipPAC
7.8.1 STATS ChipPAC Profile
7.8.2 STATS ChipPAC Main Business
7.8.3 STATS ChipPAC Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.8.4 STATS ChipPAC Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.8.5 STATS ChipPAC Recent Developments
7.9 Siliconware Precision Industries
7.9.1 Siliconware Precision Industries Profile
7.9.2 Siliconware Precision Industries Main Business
7.9.3 Siliconware Precision Industries Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.9.4 Siliconware Precision Industries Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.9.5 Siliconware Precision Industries Recent Developments
7.10 Unisem Group
7.10.1 Unisem Group Profile
7.10.2 Unisem Group Main Business
7.10.3 Unisem Group Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.10.4 Unisem Group Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.10.5 Unisem Group Recent Developments
7.11 UTAC Group
7.11.1 UTAC Group Profile
7.11.2 UTAC Group Main Business
7.11.3 UTAC Group Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.11.4 UTAC Group Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.11.5 UTAC Group Recent Developments
7.12 Chipbond Technology Corporation
7.12.1 Chipbond Technology Corporation Profile
7.12.2 Chipbond Technology Corporation Main Business
7.12.3 Chipbond Technology Corporation Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.12.4 Chipbond Technology Corporation Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.12.5 Chipbond Technology Corporation Recent Developments
7.13 ChipMOS Technologies
7.13.1 ChipMOS Technologies Profile
7.13.2 ChipMOS Technologies Main Business
7.13.3 ChipMOS Technologies Outsourced Semiconductor Assembly and Testing Products, Services and Solutions
7.13.4 ChipMOS Technologies Outsourced Semiconductor Assembly and Testing Revenue (US$ Million) & (2019-2024)
7.13.5 ChipMOS Technologies Recent Developments
8 Industry Chain Analysis
8.1 Outsourced Semiconductor Assembly and Testing Industrial Chain
8.2 Outsourced Semiconductor Assembly and Testing Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Outsourced Semiconductor Assembly and Testing Sales Model
8.5.2 Sales Channel
8.5.3 Outsourced Semiconductor Assembly and Testing Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

ASE Technology Holding
Amkor Technology
Jiangsu Changjiang Electronics Technology
Powertech Technology Inc.
Tianshui Huatian Technology Co., LTD.
TongFu Microelectronics Co., LTD.
King Yuan Electronics Co., Ltd.
STATS ChipPAC
Siliconware Precision Industries
Unisem Group
UTAC Group
Chipbond Technology Corporation
ChipMOS Technologies

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