Plating for Microelectronics - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB503243036

Publication Date:

March 25, 2024

Pages:

137

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

Semiconductors [2]

Computing & Electronics [3]

Description:

Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin later of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.
There are numerous metals commonly used as plating materials such as zinc, copper, chromium, and nickel. which impart wear and corrosion resistance, improve strength, and enhance solderability. Precious metal coatings are especially important to the electronics and semiconductor industries.
The global market for Plating for Microelectronics was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
In the Chinese market, The major manufacturers are Dow, Mitsubishi Materials, Corporation, Heraeus, Xiliong Science, AtoTech, Yamato Denki, Meltex, Ishihara Chemical, Raschig GmbH, Japan Pure Chemical, Coatech, Magneto Special Anedes, Vopelius Chemie AG, Moses Lake Industries and JCU International, etc.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Plating for Microelectronics, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Plating for Microelectronics by region & country, by Type, and by Application.
The Plating for Microelectronics market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Plating for Microelectronics.
Market Segmentation
By Company
DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International
Segment by Type:
Gold
Zinc
Nickel
Bronze
Tin
Copper
Others
Segment by Application
MEMS
PCB
IC
Photoelectron
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Plating for Microelectronics manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Plating for Microelectronics in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Plating for Microelectronics in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table Of Contents:

1 Market Overview
1.1 Plating for Microelectronics Product Introduction
1.2 Global Plating for Microelectronics Market Size Forecast
1.3 Plating for Microelectronics Market Trends & Drivers
1.3.1 Plating for Microelectronics Industry Trends
1.3.2 Plating for Microelectronics Market Drivers & Opportunity
1.3.3 Plating for Microelectronics Market Challenges
1.3.4 Plating for Microelectronics Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Plating for Microelectronics Players Revenue Ranking (2023)
2.2 Global Plating for Microelectronics Revenue by Company (2019-2024)
2.3 Key Companies Plating for Microelectronics Manufacturing Base Distribution and Headquarters
2.4 Key Companies Plating for Microelectronics Product Offered
2.5 Key Companies Time to Begin Mass Production of Plating for Microelectronics
2.6 Plating for Microelectronics Market Competitive Analysis
2.6.1 Plating for Microelectronics Market Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Plating for Microelectronics Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Plating for Microelectronics as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Gold
3.1.2 Zinc
3.1.3 Nickel
3.1.4 Bronze
3.1.5 Tin
3.1.6 Copper
3.1.7 Others
3.2 Global Plating for Microelectronics Sales Value by Type
3.2.1 Global Plating for Microelectronics Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Plating for Microelectronics Sales Value, by Type (2019-2030)
3.2.3 Global Plating for Microelectronics Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 MEMS
4.1.2 PCB
4.1.3 IC
4.1.4 Photoelectron
4.1.5 Others
4.2 Global Plating for Microelectronics Sales Value by Application
4.2.1 Global Plating for Microelectronics Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Plating for Microelectronics Sales Value, by Application (2019-2030)
4.2.3 Global Plating for Microelectronics Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Plating for Microelectronics Sales Value by Region
5.1.1 Global Plating for Microelectronics Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Plating for Microelectronics Sales Value by Region (2019-2024)
5.1.3 Global Plating for Microelectronics Sales Value by Region (2025-2030)
5.1.4 Global Plating for Microelectronics Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Plating for Microelectronics Sales Value, 2019-2030
5.2.2 North America Plating for Microelectronics Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Plating for Microelectronics Sales Value, 2019-2030
5.3.2 Europe Plating for Microelectronics Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Plating for Microelectronics Sales Value, 2019-2030
5.4.2 Asia Pacific Plating for Microelectronics Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Plating for Microelectronics Sales Value, 2019-2030
5.5.2 South America Plating for Microelectronics Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Plating for Microelectronics Sales Value, 2019-2030
5.6.2 Middle East & Africa Plating for Microelectronics Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Plating for Microelectronics Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Plating for Microelectronics Sales Value
6.3 United States
6.3.1 United States Plating for Microelectronics Sales Value, 2019-2030
6.3.2 United States Plating for Microelectronics Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Plating for Microelectronics Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Plating for Microelectronics Sales Value, 2019-2030
6.4.2 Europe Plating for Microelectronics Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Plating for Microelectronics Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Plating for Microelectronics Sales Value, 2019-2030
6.5.2 China Plating for Microelectronics Sales Value by Type (%), 2023 VS 2030
6.5.3 China Plating for Microelectronics Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Plating for Microelectronics Sales Value, 2019-2030
6.6.2 Japan Plating for Microelectronics Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Plating for Microelectronics Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Plating for Microelectronics Sales Value, 2019-2030
6.7.2 South Korea Plating for Microelectronics Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Plating for Microelectronics Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Plating for Microelectronics Sales Value, 2019-2030
6.8.2 Southeast Asia Plating for Microelectronics Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Plating for Microelectronics Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Plating for Microelectronics Sales Value, 2019-2030
6.9.2 India Plating for Microelectronics Sales Value by Type (%), 2023 VS 2030
6.9.3 India Plating for Microelectronics Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 DOW
7.1.1 DOW Profile
7.1.2 DOW Main Business
7.1.3 DOW Plating for Microelectronics Products, Services and Solutions
7.1.4 DOW Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.1.5 DOW Recent Developments
7.2 Mitsubishi Materials Corporation
7.2.1 Mitsubishi Materials Corporation Profile
7.2.2 Mitsubishi Materials Corporation Main Business
7.2.3 Mitsubishi Materials Corporation Plating for Microelectronics Products, Services and Solutions
7.2.4 Mitsubishi Materials Corporation Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.2.5 Mitsubishi Materials Corporation Recent Developments
7.3 Heraeus
7.3.1 Heraeus Profile
7.3.2 Heraeus Main Business
7.3.3 Heraeus Plating for Microelectronics Products, Services and Solutions
7.3.4 Heraeus Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.3.5 XiLong Scientific Recent Developments
7.4 XiLong Scientific
7.4.1 XiLong Scientific Profile
7.4.2 XiLong Scientific Main Business
7.4.3 XiLong Scientific Plating for Microelectronics Products, Services and Solutions
7.4.4 XiLong Scientific Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.4.5 XiLong Scientific Recent Developments
7.5 Atotech
7.5.1 Atotech Profile
7.5.2 Atotech Main Business
7.5.3 Atotech Plating for Microelectronics Products, Services and Solutions
7.5.4 Atotech Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.5.5 Atotech Recent Developments
7.6 Yamato Denki
7.6.1 Yamato Denki Profile
7.6.2 Yamato Denki Main Business
7.6.3 Yamato Denki Plating for Microelectronics Products, Services and Solutions
7.6.4 Yamato Denki Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.6.5 Yamato Denki Recent Developments
7.7 Meltex
7.7.1 Meltex Profile
7.7.2 Meltex Main Business
7.7.3 Meltex Plating for Microelectronics Products, Services and Solutions
7.7.4 Meltex Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.7.5 Meltex Recent Developments
7.8 Ishihara Chemical
7.8.1 Ishihara Chemical Profile
7.8.2 Ishihara Chemical Main Business
7.8.3 Ishihara Chemical Plating for Microelectronics Products, Services and Solutions
7.8.4 Ishihara Chemical Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.8.5 Ishihara Chemical Recent Developments
7.9 Raschig GmbH
7.9.1 Raschig GmbH Profile
7.9.2 Raschig GmbH Main Business
7.9.3 Raschig GmbH Plating for Microelectronics Products, Services and Solutions
7.9.4 Raschig GmbH Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.9.5 Raschig GmbH Recent Developments
7.10 Japan Pure Chemical
7.10.1 Japan Pure Chemical Profile
7.10.2 Japan Pure Chemical Main Business
7.10.3 Japan Pure Chemical Plating for Microelectronics Products, Services and Solutions
7.10.4 Japan Pure Chemical Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.10.5 Japan Pure Chemical Recent Developments
7.11 Coatech
7.11.1 Coatech Profile
7.11.2 Coatech Main Business
7.11.3 Coatech Plating for Microelectronics Products, Services and Solutions
7.11.4 Coatech Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.11.5 Coatech Recent Developments
7.12 MAGNETO special anodes
7.12.1 MAGNETO special anodes Profile
7.12.2 MAGNETO special anodes Main Business
7.12.3 MAGNETO special anodes Plating for Microelectronics Products, Services and Solutions
7.12.4 MAGNETO special anodes Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.12.5 MAGNETO special anodes Recent Developments
7.13 Vopelius Chemie AG
7.13.1 Vopelius Chemie AG Profile
7.13.2 Vopelius Chemie AG Main Business
7.13.3 Vopelius Chemie AG Plating for Microelectronics Products, Services and Solutions
7.13.4 Vopelius Chemie AG Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.13.5 Vopelius Chemie AG Recent Developments
7.14 Moses Lake Industries
7.14.1 Moses Lake Industries Profile
7.14.2 Moses Lake Industries Main Business
7.14.3 Moses Lake Industries Plating for Microelectronics Products, Services and Solutions
7.14.4 Moses Lake Industries Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.14.5 Moses Lake Industries Recent Developments
7.15 JCU International
7.15.1 JCU International Profile
7.15.2 JCU International Main Business
7.15.3 JCU International Plating for Microelectronics Products, Services and Solutions
7.15.4 JCU International Plating for Microelectronics Revenue (US$ Million) & (2019-2024)
7.15.5 JCU International Recent Developments
8 Industry Chain Analysis
8.1 Plating for Microelectronics Industrial Chain
8.2 Plating for Microelectronics Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Plating for Microelectronics Sales Model
8.5.2 Sales Channel
8.5.3 Plating for Microelectronics Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

DOW
Mitsubishi Materials Corporation
Heraeus
XiLong Scientific
Atotech
Yamato Denki
Meltex
Ishihara Chemical
Raschig GmbH
Japan Pure Chemical
Coatech
MAGNETO special anodes
Vopelius Chemie AG
Moses Lake Industries
JCU International

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