Rigid IC Package Substrates - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB511248184

Publication Date:

November 5, 2024

Pages:

124

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global market for Rigid IC Package Substrates was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
North American market for Rigid IC Package Substrates was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Rigid IC Package Substrates was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Europe market for Rigid IC Package Substrates was valued at $ million in 2023 and will reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global key companies of Rigid IC Package Substrates include Unimicron, Ibiden, Semco, Nan Ya PCB Corporation, Shinko, Simmtech, Kinsus, Daeduck and LG Innotek, etc. In 2023, the global five largest players hold a share approximately % in terms of revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Rigid IC Package Substrates, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Rigid IC Package Substrates by region & country, by Type, and by Application.
The Rigid IC Package Substrates market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Rigid IC Package Substrates.
Market Segmentation
By Company
Unimicron
Ibiden
Semco
Nan Ya PCB Corporation
Shinko
Simmtech
Kinsus
Daeduck
LG Innotek
Kyocera
ASE Material
Shennan Circuit
AT&S
Korea Circuit
Segment by Type:
WB CSP
FC BGA
FC CSP
Others
Segment by Application
Smart Phone
PC
Wearable Device
Others
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Rigid IC Package Substrates manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Rigid IC Package Substrates in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Rigid IC Package Substrates in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table Of Contents:

1 Market Overview
1.1 Rigid IC Package Substrates Product Introduction
1.2 Global Rigid IC Package Substrates Market Size Forecast
1.2.1 Global Rigid IC Package Substrates Sales Value (2019-2030)
1.2.2 Global Rigid IC Package Substrates Sales Volume (2019-2030)
1.2.3 Global Rigid IC Package Substrates Sales Price (2019-2030)
1.3 Rigid IC Package Substrates Market Trends & Drivers
1.3.1 Rigid IC Package Substrates Industry Trends
1.3.2 Rigid IC Package Substrates Market Drivers & Opportunity
1.3.3 Rigid IC Package Substrates Market Challenges
1.3.4 Rigid IC Package Substrates Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Rigid IC Package Substrates Players Revenue Ranking (2023)
2.2 Global Rigid IC Package Substrates Revenue by Company (2019-2024)
2.3 Global Rigid IC Package Substrates Players Sales Volume Ranking (2023)
2.4 Global Rigid IC Package Substrates Sales Volume by Company Players (2019-2024)
2.5 Global Rigid IC Package Substrates Average Price by Company (2019-2024)
2.6 Key Manufacturers Rigid IC Package Substrates Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Rigid IC Package Substrates Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Rigid IC Package Substrates
2.9 Rigid IC Package Substrates Market Competitive Analysis
2.9.1 Rigid IC Package Substrates Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Rigid IC Package Substrates Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Rigid IC Package Substrates as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 WB CSP
3.1.2 FC BGA
3.1.3 FC CSP
3.1.4 Others
3.2 Global Rigid IC Package Substrates Sales Value by Type
3.2.1 Global Rigid IC Package Substrates Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Rigid IC Package Substrates Sales Value, by Type (2019-2030)
3.2.3 Global Rigid IC Package Substrates Sales Value, by Type (%) (2019-2030)
3.3 Global Rigid IC Package Substrates Sales Volume by Type
3.3.1 Global Rigid IC Package Substrates Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Rigid IC Package Substrates Sales Volume, by Type (2019-2030)
3.3.3 Global Rigid IC Package Substrates Sales Volume, by Type (%) (2019-2030)
3.4 Global Rigid IC Package Substrates Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Smart Phone
4.1.2 PC
4.1.3 Wearable Device
4.1.4 Others
4.2 Global Rigid IC Package Substrates Sales Value by Application
4.2.1 Global Rigid IC Package Substrates Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Rigid IC Package Substrates Sales Value, by Application (2019-2030)
4.2.3 Global Rigid IC Package Substrates Sales Value, by Application (%) (2019-2030)
4.3 Global Rigid IC Package Substrates Sales Volume by Application
4.3.1 Global Rigid IC Package Substrates Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Rigid IC Package Substrates Sales Volume, by Application (2019-2030)
4.3.3 Global Rigid IC Package Substrates Sales Volume, by Application (%) (2019-2030)
4.4 Global Rigid IC Package Substrates Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Rigid IC Package Substrates Sales Value by Region
5.1.1 Global Rigid IC Package Substrates Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Rigid IC Package Substrates Sales Value by Region (2019-2024)
5.1.3 Global Rigid IC Package Substrates Sales Value by Region (2025-2030)
5.1.4 Global Rigid IC Package Substrates Sales Value by Region (%), (2019-2030)
5.2 Global Rigid IC Package Substrates Sales Volume by Region
5.2.1 Global Rigid IC Package Substrates Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Rigid IC Package Substrates Sales Volume by Region (2019-2024)
5.2.3 Global Rigid IC Package Substrates Sales Volume by Region (2025-2030)
5.2.4 Global Rigid IC Package Substrates Sales Volume by Region (%), (2019-2030)
5.3 Global Rigid IC Package Substrates Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Rigid IC Package Substrates Sales Value, 2019-2030
5.4.2 North America Rigid IC Package Substrates Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Rigid IC Package Substrates Sales Value, 2019-2030
5.5.2 Europe Rigid IC Package Substrates Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Rigid IC Package Substrates Sales Value, 2019-2030
5.6.2 Asia Pacific Rigid IC Package Substrates Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Rigid IC Package Substrates Sales Value, 2019-2030
5.7.2 South America Rigid IC Package Substrates Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Rigid IC Package Substrates Sales Value, 2019-2030
5.8.2 Middle East & Africa Rigid IC Package Substrates Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Rigid IC Package Substrates Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Rigid IC Package Substrates Sales Value
6.2.1 Key Countries/Regions Rigid IC Package Substrates Sales Value, 2019-2030
6.2.2 Key Countries/Regions Rigid IC Package Substrates Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Rigid IC Package Substrates Sales Value, 2019-2030
6.3.2 United States Rigid IC Package Substrates Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Rigid IC Package Substrates Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Rigid IC Package Substrates Sales Value, 2019-2030
6.4.2 Europe Rigid IC Package Substrates Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Rigid IC Package Substrates Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Rigid IC Package Substrates Sales Value, 2019-2030
6.5.2 China Rigid IC Package Substrates Sales Value by Type (%), 2023 VS 2030
6.5.3 China Rigid IC Package Substrates Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Rigid IC Package Substrates Sales Value, 2019-2030
6.6.2 Japan Rigid IC Package Substrates Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Rigid IC Package Substrates Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Rigid IC Package Substrates Sales Value, 2019-2030
6.7.2 South Korea Rigid IC Package Substrates Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Rigid IC Package Substrates Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Rigid IC Package Substrates Sales Value, 2019-2030
6.8.2 Southeast Asia Rigid IC Package Substrates Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Rigid IC Package Substrates Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Rigid IC Package Substrates Sales Value, 2019-2030
6.9.2 India Rigid IC Package Substrates Sales Value by Type (%), 2023 VS 2030
6.9.3 India Rigid IC Package Substrates Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Unimicron
7.1.1 Unimicron Company Information
7.1.2 Unimicron Introduction and Business Overview
7.1.3 Unimicron Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Unimicron Rigid IC Package Substrates Product Offerings
7.1.5 Unimicron Recent Development
7.2 Ibiden
7.2.1 Ibiden Company Information
7.2.2 Ibiden Introduction and Business Overview
7.2.3 Ibiden Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Ibiden Rigid IC Package Substrates Product Offerings
7.2.5 Ibiden Recent Development
7.3 Semco
7.3.1 Semco Company Information
7.3.2 Semco Introduction and Business Overview
7.3.3 Semco Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Semco Rigid IC Package Substrates Product Offerings
7.3.5 Semco Recent Development
7.4 Nan Ya PCB Corporation
7.4.1 Nan Ya PCB Corporation Company Information
7.4.2 Nan Ya PCB Corporation Introduction and Business Overview
7.4.3 Nan Ya PCB Corporation Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Nan Ya PCB Corporation Rigid IC Package Substrates Product Offerings
7.4.5 Nan Ya PCB Corporation Recent Development
7.5 Shinko
7.5.1 Shinko Company Information
7.5.2 Shinko Introduction and Business Overview
7.5.3 Shinko Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Shinko Rigid IC Package Substrates Product Offerings
7.5.5 Shinko Recent Development
7.6 Simmtech
7.6.1 Simmtech Company Information
7.6.2 Simmtech Introduction and Business Overview
7.6.3 Simmtech Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Simmtech Rigid IC Package Substrates Product Offerings
7.6.5 Simmtech Recent Development
7.7 Kinsus
7.7.1 Kinsus Company Information
7.7.2 Kinsus Introduction and Business Overview
7.7.3 Kinsus Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Kinsus Rigid IC Package Substrates Product Offerings
7.7.5 Kinsus Recent Development
7.8 Daeduck
7.8.1 Daeduck Company Information
7.8.2 Daeduck Introduction and Business Overview
7.8.3 Daeduck Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.8.4 Daeduck Rigid IC Package Substrates Product Offerings
7.8.5 Daeduck Recent Development
7.9 LG Innotek
7.9.1 LG Innotek Company Information
7.9.2 LG Innotek Introduction and Business Overview
7.9.3 LG Innotek Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.9.4 LG Innotek Rigid IC Package Substrates Product Offerings
7.9.5 LG Innotek Recent Development
7.10 Kyocera
7.10.1 Kyocera Company Information
7.10.2 Kyocera Introduction and Business Overview
7.10.3 Kyocera Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Kyocera Rigid IC Package Substrates Product Offerings
7.10.5 Kyocera Recent Development
7.11 ASE Material
7.11.1 ASE Material Company Information
7.11.2 ASE Material Introduction and Business Overview
7.11.3 ASE Material Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.11.4 ASE Material Rigid IC Package Substrates Product Offerings
7.11.5 ASE Material Recent Development
7.12 Shennan Circuit
7.12.1 Shennan Circuit Company Information
7.12.2 Shennan Circuit Introduction and Business Overview
7.12.3 Shennan Circuit Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.12.4 Shennan Circuit Rigid IC Package Substrates Product Offerings
7.12.5 Shennan Circuit Recent Development
7.13 AT&S
7.13.1 AT&S Company Information
7.13.2 AT&S Introduction and Business Overview
7.13.3 AT&S Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.13.4 AT&S Rigid IC Package Substrates Product Offerings
7.13.5 AT&S Recent Development
7.14 Korea Circuit
7.14.1 Korea Circuit Company Information
7.14.2 Korea Circuit Introduction and Business Overview
7.14.3 Korea Circuit Rigid IC Package Substrates Sales, Revenue and Gross Margin (2019-2024)
7.14.4 Korea Circuit Rigid IC Package Substrates Product Offerings
7.14.5 Korea Circuit Recent Development
8 Industry Chain Analysis
8.1 Rigid IC Package Substrates Industrial Chain
8.2 Rigid IC Package Substrates Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Rigid IC Package Substrates Sales Model
8.5.2 Sales Channel
8.5.3 Rigid IC Package Substrates Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

Unimicron
Ibiden
Semco
Nan Ya PCB Corporation
Shinko
Simmtech
Kinsus
Daeduck
LG Innotek
Kyocera
ASE Material
Shennan Circuit
AT&S
Korea Circuit

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