Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages.
The global market for Semiconductor Bonding Wire was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Semiconductor Bonding Wire, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Semiconductor Bonding Wire by region & country, by Type, and by Application.
The Semiconductor Bonding Wire market size, estimations, and forecasts are provided in terms of sales volume (Kiloton) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Bonding Wire.
Market Segmentation
By Company
Heraeus
Tanaka
Sumitomo Metal Mining
MK Electron
AMETEK
Doublink Solders
Yantai Zhaojin Kanfort
Tatsuta Electric Wire & Cable
Kangqiang Electronics
The Prince & Izant
Segment by Type:
Aluminum Bonding Wires
Copper Bonding Wires
Others
Segment by Application
Semiconductor Packaging
PCB
Other
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Semiconductor Bonding Wire manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Semiconductor Bonding Wire in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Semiconductor Bonding Wire in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 Market Overview
1.1 Semiconductor Bonding Wire Product Introduction
1.2 Global Semiconductor Bonding Wire Market Size Forecast
1.2.1 Global Semiconductor Bonding Wire Sales Value (2019-2030)
1.2.2 Global Semiconductor Bonding Wire Sales Volume (2019-2030)
1.2.3 Global Semiconductor Bonding Wire Sales Price (2019-2030)
1.3 Semiconductor Bonding Wire Market Trends & Drivers
1.3.1 Semiconductor Bonding Wire Industry Trends
1.3.2 Semiconductor Bonding Wire Market Drivers & Opportunity
1.3.3 Semiconductor Bonding Wire Market Challenges
1.3.4 Semiconductor Bonding Wire Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Semiconductor Bonding Wire Players Revenue Ranking (2023)
2.2 Global Semiconductor Bonding Wire Revenue by Company (2019-2024)
2.3 Global Semiconductor Bonding Wire Players Sales Volume Ranking (2023)
2.4 Global Semiconductor Bonding Wire Sales Volume by Company Players (2019-2024)
2.5 Global Semiconductor Bonding Wire Average Price by Company (2019-2024)
2.6 Key Manufacturers Semiconductor Bonding Wire Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Semiconductor Bonding Wire Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Semiconductor Bonding Wire
2.9 Semiconductor Bonding Wire Market Competitive Analysis
2.9.1 Semiconductor Bonding Wire Market Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Semiconductor Bonding Wire Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Semiconductor Bonding Wire as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Aluminum Bonding Wires
3.1.2 Copper Bonding Wires
3.1.3 Others
3.2 Global Semiconductor Bonding Wire Sales Value by Type
3.2.1 Global Semiconductor Bonding Wire Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Semiconductor Bonding Wire Sales Value, by Type (2019-2030)
3.2.3 Global Semiconductor Bonding Wire Sales Value, by Type (%) (2019-2030)
3.3 Global Semiconductor Bonding Wire Sales Volume by Type
3.3.1 Global Semiconductor Bonding Wire Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Semiconductor Bonding Wire Sales Volume, by Type (2019-2030)
3.3.3 Global Semiconductor Bonding Wire Sales Volume, by Type (%) (2019-2030)
3.4 Global Semiconductor Bonding Wire Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Semiconductor Packaging
4.1.2 PCB
4.1.3 Other
4.2 Global Semiconductor Bonding Wire Sales Value by Application
4.2.1 Global Semiconductor Bonding Wire Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Semiconductor Bonding Wire Sales Value, by Application (2019-2030)
4.2.3 Global Semiconductor Bonding Wire Sales Value, by Application (%) (2019-2030)
4.3 Global Semiconductor Bonding Wire Sales Volume by Application
4.3.1 Global Semiconductor Bonding Wire Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Semiconductor Bonding Wire Sales Volume, by Application (2019-2030)
4.3.3 Global Semiconductor Bonding Wire Sales Volume, by Application (%) (2019-2030)
4.4 Global Semiconductor Bonding Wire Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Semiconductor Bonding Wire Sales Value by Region
5.1.1 Global Semiconductor Bonding Wire Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Semiconductor Bonding Wire Sales Value by Region (2019-2024)
5.1.3 Global Semiconductor Bonding Wire Sales Value by Region (2025-2030)
5.1.4 Global Semiconductor Bonding Wire Sales Value by Region (%), (2019-2030)
5.2 Global Semiconductor Bonding Wire Sales Volume by Region
5.2.1 Global Semiconductor Bonding Wire Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Semiconductor Bonding Wire Sales Volume by Region (2019-2024)
5.2.3 Global Semiconductor Bonding Wire Sales Volume by Region (2025-2030)
5.2.4 Global Semiconductor Bonding Wire Sales Volume by Region (%), (2019-2030)
5.3 Global Semiconductor Bonding Wire Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Semiconductor Bonding Wire Sales Value, 2019-2030
5.4.2 North America Semiconductor Bonding Wire Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Semiconductor Bonding Wire Sales Value, 2019-2030
5.5.2 Europe Semiconductor Bonding Wire Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Semiconductor Bonding Wire Sales Value, 2019-2030
5.6.2 Asia Pacific Semiconductor Bonding Wire Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Semiconductor Bonding Wire Sales Value, 2019-2030
5.7.2 South America Semiconductor Bonding Wire Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Semiconductor Bonding Wire Sales Value, 2019-2030
5.8.2 Middle East & Africa Semiconductor Bonding Wire Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Semiconductor Bonding Wire Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Semiconductor Bonding Wire Sales Value
6.2.1 Key Countries/Regions Semiconductor Bonding Wire Sales Value, 2019-2030
6.2.2 Key Countries/Regions Semiconductor Bonding Wire Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Semiconductor Bonding Wire Sales Value, 2019-2030
6.3.2 United States Semiconductor Bonding Wire Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Semiconductor Bonding Wire Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Semiconductor Bonding Wire Sales Value, 2019-2030
6.4.2 Europe Semiconductor Bonding Wire Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Semiconductor Bonding Wire Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Semiconductor Bonding Wire Sales Value, 2019-2030
6.5.2 China Semiconductor Bonding Wire Sales Value by Type (%), 2023 VS 2030
6.5.3 China Semiconductor Bonding Wire Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Semiconductor Bonding Wire Sales Value, 2019-2030
6.6.2 Japan Semiconductor Bonding Wire Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Semiconductor Bonding Wire Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Semiconductor Bonding Wire Sales Value, 2019-2030
6.7.2 South Korea Semiconductor Bonding Wire Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Semiconductor Bonding Wire Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Semiconductor Bonding Wire Sales Value, 2019-2030
6.8.2 Southeast Asia Semiconductor Bonding Wire Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Semiconductor Bonding Wire Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Semiconductor Bonding Wire Sales Value, 2019-2030
6.9.2 India Semiconductor Bonding Wire Sales Value by Type (%), 2023 VS 2030
6.9.3 India Semiconductor Bonding Wire Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Heraeus
7.1.1 Heraeus Company Information
7.1.2 Heraeus Introduction and Business Overview
7.1.3 Heraeus Semiconductor Bonding Wire Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Heraeus Semiconductor Bonding Wire Product Offerings
7.1.5 Heraeus Recent Development
7.2 Tanaka
7.2.1 Tanaka Company Information
7.2.2 Tanaka Introduction and Business Overview
7.2.3 Tanaka Semiconductor Bonding Wire Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Tanaka Semiconductor Bonding Wire Product Offerings
7.2.5 Tanaka Recent Development
7.3 Sumitomo Metal Mining
7.3.1 Sumitomo Metal Mining Company Information
7.3.2 Sumitomo Metal Mining Introduction and Business Overview
7.3.3 Sumitomo Metal Mining Semiconductor Bonding Wire Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Sumitomo Metal Mining Semiconductor Bonding Wire Product Offerings
7.3.5 Sumitomo Metal Mining Recent Development
7.4 MK Electron
7.4.1 MK Electron Company Information
7.4.2 MK Electron Introduction and Business Overview
7.4.3 MK Electron Semiconductor Bonding Wire Sales, Revenue and Gross Margin (2019-2024)
7.4.4 MK Electron Semiconductor Bonding Wire Product Offerings
7.4.5 MK Electron Recent Development
7.5 AMETEK
7.5.1 AMETEK Company Information
7.5.2 AMETEK Introduction and Business Overview
7.5.3 AMETEK Semiconductor Bonding Wire Sales, Revenue and Gross Margin (2019-2024)
7.5.4 AMETEK Semiconductor Bonding Wire Product Offerings
7.5.5 AMETEK Recent Development
7.6 Doublink Solders
7.6.1 Doublink Solders Company Information
7.6.2 Doublink Solders Introduction and Business Overview
7.6.3 Doublink Solders Semiconductor Bonding Wire Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Doublink Solders Semiconductor Bonding Wire Product Offerings
7.6.5 Doublink Solders Recent Development
7.7 Yantai Zhaojin Kanfort
7.7.1 Yantai Zhaojin Kanfort Company Information
7.7.2 Yantai Zhaojin Kanfort Introduction and Business Overview
7.7.3 Yantai Zhaojin Kanfort Semiconductor Bonding Wire Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Yantai Zhaojin Kanfort Semiconductor Bonding Wire Product Offerings
7.7.5 Yantai Zhaojin Kanfort Recent Development
7.8 Tatsuta Electric Wire & Cable
7.8.1 Tatsuta Electric Wire & Cable Company Information
7.8.2 Tatsuta Electric Wire & Cable Introduction and Business Overview
7.8.3 Tatsuta Electric Wire & Cable Semiconductor Bonding Wire Sales, Revenue and Gross Margin (2019-2024)
7.8.4 Tatsuta Electric Wire & Cable Semiconductor Bonding Wire Product Offerings
7.8.5 Tatsuta Electric Wire & Cable Recent Development
7.9 Kangqiang Electronics
7.9.1 Kangqiang Electronics Company Information
7.9.2 Kangqiang Electronics Introduction and Business Overview
7.9.3 Kangqiang Electronics Semiconductor Bonding Wire Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Kangqiang Electronics Semiconductor Bonding Wire Product Offerings
7.9.5 Kangqiang Electronics Recent Development
7.10 The Prince & Izant
7.10.1 The Prince & Izant Company Information
7.10.2 The Prince & Izant Introduction and Business Overview
7.10.3 The Prince & Izant Semiconductor Bonding Wire Sales, Revenue and Gross Margin (2019-2024)
7.10.4 The Prince & Izant Semiconductor Bonding Wire Product Offerings
7.10.5 The Prince & Izant Recent Development
8 Industry Chain Analysis
8.1 Semiconductor Bonding Wire Industrial Chain
8.2 Semiconductor Bonding Wire Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Semiconductor Bonding Wire Sales Model
8.5.2 Sales Channel
8.5.3 Semiconductor Bonding Wire Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Heraeus
Tanaka
Sumitomo Metal Mining
MK Electron
AMETEK
Doublink Solders
Yantai Zhaojin Kanfort
Tatsuta Electric Wire & Cable
Kangqiang Electronics
The Prince & Izant
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*If Applicable.
