Wafer Level Chip Scale Package (WLCSP) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB511240934

Publication Date:

November 28, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global market for Wafer Level Chip Scale Package (WLCSP) was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Wafer Level Chip Scale Package (WLCSP), focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Wafer Level Chip Scale Package (WLCSP) by region & country, by Type, and by Application.
The Wafer Level Chip Scale Package (WLCSP) market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Level Chip Scale Package (WLCSP).
Market Segmentation
By Company
TSMC
Amkor Technology
Macronix
China Wafer Level CSP
JCET Group
Chipbond Technology Corporation
ASE Group
Huatian Technology (Kunshan) Electronics
Segment by Type:
Wafer Bumping
Shellcase
Segment by Application
Bluetooth
WLAN
PMIC/PMU
MOSFET
Camera
Other
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Wafer Level Chip Scale Package (WLCSP) manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Wafer Level Chip Scale Package (WLCSP) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Wafer Level Chip Scale Package (WLCSP) in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table Of Contents:

1 Market Overview
1.1 Wafer Level Chip Scale Package (WLCSP) Product Introduction
1.2 Global Wafer Level Chip Scale Package (WLCSP) Market Size Forecast
1.3 Wafer Level Chip Scale Package (WLCSP) Market Trends & Drivers
1.3.1 Wafer Level Chip Scale Package (WLCSP) Industry Trends
1.3.2 Wafer Level Chip Scale Package (WLCSP) Market Drivers & Opportunity
1.3.3 Wafer Level Chip Scale Package (WLCSP) Market Challenges
1.3.4 Wafer Level Chip Scale Package (WLCSP) Market Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Wafer Level Chip Scale Package (WLCSP) Players Revenue Ranking (2023)
2.2 Global Wafer Level Chip Scale Package (WLCSP) Revenue by Company (2019-2024)
2.3 Key Companies Wafer Level Chip Scale Package (WLCSP) Manufacturing Base Distribution and Headquarters
2.4 Key Companies Wafer Level Chip Scale Package (WLCSP) Product Offered
2.5 Key Companies Time to Begin Mass Production of Wafer Level Chip Scale Package (WLCSP)
2.6 Wafer Level Chip Scale Package (WLCSP) Market Competitive Analysis
2.6.1 Wafer Level Chip Scale Package (WLCSP) Market Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Wafer Level Chip Scale Package (WLCSP) Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Wafer Level Chip Scale Package (WLCSP) as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Wafer Bumping
3.1.2 Shellcase
3.2 Global Wafer Level Chip Scale Package (WLCSP) Sales Value by Type
3.2.1 Global Wafer Level Chip Scale Package (WLCSP) Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Wafer Level Chip Scale Package (WLCSP) Sales Value, by Type (2019-2030)
3.2.3 Global Wafer Level Chip Scale Package (WLCSP) Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Bluetooth
4.1.2 WLAN
4.1.3 PMIC/PMU
4.1.4 MOSFET
4.1.5 Camera
4.1.6 Other
4.2 Global Wafer Level Chip Scale Package (WLCSP) Sales Value by Application
4.2.1 Global Wafer Level Chip Scale Package (WLCSP) Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Wafer Level Chip Scale Package (WLCSP) Sales Value, by Application (2019-2030)
4.2.3 Global Wafer Level Chip Scale Package (WLCSP) Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Wafer Level Chip Scale Package (WLCSP) Sales Value by Region
5.1.1 Global Wafer Level Chip Scale Package (WLCSP) Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Wafer Level Chip Scale Package (WLCSP) Sales Value by Region (2019-2024)
5.1.3 Global Wafer Level Chip Scale Package (WLCSP) Sales Value by Region (2025-2030)
5.1.4 Global Wafer Level Chip Scale Package (WLCSP) Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Wafer Level Chip Scale Package (WLCSP) Sales Value, 2019-2030
5.2.2 North America Wafer Level Chip Scale Package (WLCSP) Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Wafer Level Chip Scale Package (WLCSP) Sales Value, 2019-2030
5.3.2 Europe Wafer Level Chip Scale Package (WLCSP) Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Wafer Level Chip Scale Package (WLCSP) Sales Value, 2019-2030
5.4.2 Asia Pacific Wafer Level Chip Scale Package (WLCSP) Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Wafer Level Chip Scale Package (WLCSP) Sales Value, 2019-2030
5.5.2 South America Wafer Level Chip Scale Package (WLCSP) Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Wafer Level Chip Scale Package (WLCSP) Sales Value, 2019-2030
5.6.2 Middle East & Africa Wafer Level Chip Scale Package (WLCSP) Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Wafer Level Chip Scale Package (WLCSP) Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Wafer Level Chip Scale Package (WLCSP) Sales Value
6.3 United States
6.3.1 United States Wafer Level Chip Scale Package (WLCSP) Sales Value, 2019-2030
6.3.2 United States Wafer Level Chip Scale Package (WLCSP) Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Wafer Level Chip Scale Package (WLCSP) Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Wafer Level Chip Scale Package (WLCSP) Sales Value, 2019-2030
6.4.2 Europe Wafer Level Chip Scale Package (WLCSP) Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Wafer Level Chip Scale Package (WLCSP) Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Wafer Level Chip Scale Package (WLCSP) Sales Value, 2019-2030
6.5.2 China Wafer Level Chip Scale Package (WLCSP) Sales Value by Type (%), 2023 VS 2030
6.5.3 China Wafer Level Chip Scale Package (WLCSP) Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Wafer Level Chip Scale Package (WLCSP) Sales Value, 2019-2030
6.6.2 Japan Wafer Level Chip Scale Package (WLCSP) Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Wafer Level Chip Scale Package (WLCSP) Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Wafer Level Chip Scale Package (WLCSP) Sales Value, 2019-2030
6.7.2 South Korea Wafer Level Chip Scale Package (WLCSP) Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Wafer Level Chip Scale Package (WLCSP) Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Wafer Level Chip Scale Package (WLCSP) Sales Value, 2019-2030
6.8.2 Southeast Asia Wafer Level Chip Scale Package (WLCSP) Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Wafer Level Chip Scale Package (WLCSP) Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Wafer Level Chip Scale Package (WLCSP) Sales Value, 2019-2030
6.9.2 India Wafer Level Chip Scale Package (WLCSP) Sales Value by Type (%), 2023 VS 2030
6.9.3 India Wafer Level Chip Scale Package (WLCSP) Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 TSMC
7.1.1 TSMC Profile
7.1.2 TSMC Main Business
7.1.3 TSMC Wafer Level Chip Scale Package (WLCSP) Products, Services and Solutions
7.1.4 TSMC Wafer Level Chip Scale Package (WLCSP) Revenue (US$ Million) & (2019-2024)
7.1.5 TSMC Recent Developments
7.2 Amkor Technology
7.2.1 Amkor Technology Profile
7.2.2 Amkor Technology Main Business
7.2.3 Amkor Technology Wafer Level Chip Scale Package (WLCSP) Products, Services and Solutions
7.2.4 Amkor Technology Wafer Level Chip Scale Package (WLCSP) Revenue (US$ Million) & (2019-2024)
7.2.5 Amkor Technology Recent Developments
7.3 Macronix
7.3.1 Macronix Profile
7.3.2 Macronix Main Business
7.3.3 Macronix Wafer Level Chip Scale Package (WLCSP) Products, Services and Solutions
7.3.4 Macronix Wafer Level Chip Scale Package (WLCSP) Revenue (US$ Million) & (2019-2024)
7.3.5 China Wafer Level CSP Recent Developments
7.4 China Wafer Level CSP
7.4.1 China Wafer Level CSP Profile
7.4.2 China Wafer Level CSP Main Business
7.4.3 China Wafer Level CSP Wafer Level Chip Scale Package (WLCSP) Products, Services and Solutions
7.4.4 China Wafer Level CSP Wafer Level Chip Scale Package (WLCSP) Revenue (US$ Million) & (2019-2024)
7.4.5 China Wafer Level CSP Recent Developments
7.5 JCET Group
7.5.1 JCET Group Profile
7.5.2 JCET Group Main Business
7.5.3 JCET Group Wafer Level Chip Scale Package (WLCSP) Products, Services and Solutions
7.5.4 JCET Group Wafer Level Chip Scale Package (WLCSP) Revenue (US$ Million) & (2019-2024)
7.5.5 JCET Group Recent Developments
7.6 Chipbond Technology Corporation
7.6.1 Chipbond Technology Corporation Profile
7.6.2 Chipbond Technology Corporation Main Business
7.6.3 Chipbond Technology Corporation Wafer Level Chip Scale Package (WLCSP) Products, Services and Solutions
7.6.4 Chipbond Technology Corporation Wafer Level Chip Scale Package (WLCSP) Revenue (US$ Million) & (2019-2024)
7.6.5 Chipbond Technology Corporation Recent Developments
7.7 ASE Group
7.7.1 ASE Group Profile
7.7.2 ASE Group Main Business
7.7.3 ASE Group Wafer Level Chip Scale Package (WLCSP) Products, Services and Solutions
7.7.4 ASE Group Wafer Level Chip Scale Package (WLCSP) Revenue (US$ Million) & (2019-2024)
7.7.5 ASE Group Recent Developments
7.8 Huatian Technology (Kunshan) Electronics
7.8.1 Huatian Technology (Kunshan) Electronics Profile
7.8.2 Huatian Technology (Kunshan) Electronics Main Business
7.8.3 Huatian Technology (Kunshan) Electronics Wafer Level Chip Scale Package (WLCSP) Products, Services and Solutions
7.8.4 Huatian Technology (Kunshan) Electronics Wafer Level Chip Scale Package (WLCSP) Revenue (US$ Million) & (2019-2024)
7.8.5 Huatian Technology (Kunshan) Electronics Recent Developments
8 Industry Chain Analysis
8.1 Wafer Level Chip Scale Package (WLCSP) Industrial Chain
8.2 Wafer Level Chip Scale Package (WLCSP) Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Wafer Level Chip Scale Package (WLCSP) Sales Model
8.5.2 Sales Channel
8.5.3 Wafer Level Chip Scale Package (WLCSP) Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

TSMC
Amkor Technology
Macronix
China Wafer Level CSP
JCET Group
Chipbond Technology Corporation
ASE Group
Huatian Technology (Kunshan) Electronics

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