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Your search for "3D packaging" gave back 16820 results.
According to this study, the global 3D Packaging market size will reach US$ million by 2030. The global market for semiconductor was estimated at US...
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LPI
August 2024
Price: USD 3,660.00
A System in a Package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked...
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MRRPB5
January 2023
Price: USD 2,900.00
The global 3D IC and 2.5D IC Packaging market was valued at US$ 100020 million in 2023 and is anticipated to reach US$ 268230 million by 2030,...
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MRRPB5
January 2024
Price: USD 2,900.00
The global 2.5D Heterogeneous and 3D Wafer-Level Stack Packaging Technology market was valued at US$ million in 2023 and is anticipated to reach US$...
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MRRPB5
July 2024
Price: USD 2,900.00
Currently, 3D Packaging using Through Silicon Via technology (3D TSV) is one of the hottest topics in the semiconductor ecosystem. 3D TSV is vertical...
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MRRPB5
October 2023
Price: USD 2,900.00
A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components...
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MRRPB5
March 2023
Price: USD 4,900.00
A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components...
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MRRPB5
March 2023
Price: USD 2,900.00
IC packaging refers to the material that contains a semiconductor device. The package is a case that surrounds the circuit material to protect it...
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MRRPB5
June 2024
Price: USD 2,900.00
The global 3D IC and 2.5D IC Packaging market was valued at US$ 100020 million in 2022 and is anticipated to reach US$ 268230 million by 2029,...
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MRRPB5
January 2023
Price: USD 2,900.00
Highlights The global 3D Packaging market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of %...
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MRRPB5
April 2023
Price: USD 2,900.00
3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip...
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MRRPB5
January 2023
Price: USD 2,900.00
In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die...
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MRRPB5
April 2023
Price: USD 2,900.00
Three-dimensional integrated interposer (3D-IC) is an advanced semiconductor packaging technology that forms a tightly integrated three-dimensional...
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LPI
April 2024
Price: USD 3,660.00
The global 3D Integrated Adapter Board market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast...
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GIR
March 2024
Price: USD 4,480.00
Three-dimensional integrated interposer (3D-IC) is an advanced semiconductor packaging technology that forms a tightly integrated three-dimensional...
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MRRPB5
March 2024
Price: USD 2,900.00
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