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Your search for "3D packaging" gave back 107384 results.
The global Brand Protection Packaging market size was valued at US$ million in 2023. With growing demand in downstream market, the Brand Protection...
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LPI
December 2024
Price: USD 3,660.00
The global FIBC Aluminum Foil Liner Bag market was valued at US$ 1608 million in 2023 and is anticipated to reach US$ 2358 million by 2030,...
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MRRPB5
November 2024
Price: USD 2,900.00
3D Integration is an advanced semiconductor packaging technology that involves stacking multiple layers of integrated circuits (ICs) on top of each...
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MRRPB5
May 2024
Price: USD 2,900.00
The global Tube and Stick Packaging market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a...
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GIR
July 2024
Price: USD 3,480.00
The global Tube and Stick Packaging market size was valued at US$ million in 2023. With growing demand in downstream market, the Tube and Stick...
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LPI
February 2024
Price: USD 3,660.00
The global 3D Chips (3D IC) market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of...
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GIR
October 2024
Price: USD 3,480.00
TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits...
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MRRPB5
November 2024
Price: USD 3,950.00
The global 3D Through Silicon Via (TSV) Device market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to...
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LPI
February 2025
Price: USD 3,660.00
The global market for Aluminium Moisture Barrier Bag was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
April 2025
Price: USD 2,900.00
3D TSV is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high performance interconnect...
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MRRPB5
May 2023
Price: USD 4,900.00
TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits...
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MRRPB5
June 2024
Price: USD 2,900.00
The global market for Aluminium Moisture Barrier Bag was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$...
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MRRPB5
October 2024
Price: USD 3,950.00
The global 3D IC and 2.5D IC market size was valued at US$ million in 2023. With growing demand in downstream market, the 3D IC and 2.5D IC is...
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LPI
February 2024
Price: USD 3,660.00
The global Aluminium Moisture Barrier Bag market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
July 2024
Price: USD 2,900.00
According to this study, the global Wafer Level Package market size will reach US$ 32390 million by 2030. Following a strong growth of 26.2 percent...
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LPI
August 2024
Price: USD 3,660.00
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