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Your search for "Bonding Wires" gave back 61736 results.
The global Automatic Wire Wedge Bonder Equipment market was valued at US$ 64 million in 2023 and is anticipated to reach US$ 78 million by 2030,...
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MRRPB5
May 2024
Price: USD 2,900.00
A Ball Wire Bonder is a specialized machine used in semiconductor assembly and packaging to create electrical connections between semiconductor chips...
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MRRPB5
August 2024
Price: USD 2,900.00
The global Microelectronic Solder Wire market is projected to reach US$ 4579.1 million in 2029, increasing from US$ 3659.9 million in 2022, with the...
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MRRPB5
October 2023
Price: USD 2,900.00
The global market for Wedge Bonding Tools was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030...
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MRRPB5
November 2024
Price: USD 3,950.00
The global Automatic Wire Bonders market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a...
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GIR
December 2024
Price: USD 3,480.00
The global Microelectronic Solder Wire market size was valued at US$ 3993 million in 2024 and is forecast to a readjusted size of USD 4973 million by...
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GIR
July 2025
Price: USD 3,480.00
Wire bonder is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of...
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MRRPB5
February 2023
Price: USD 2,900.00
Wire bonder is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of...
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MRRPB5
December 2024
Price: USD 4,900.00
Market Analysis and Insights: Global Bonded Broadband Service Market The global Bonded Broadband Service market is projected to grow from US$ million...
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MRRPB5
November 2024
Price: USD 4,900.00
The global Wire Bonder and Die Bonder market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a...
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LPI
February 2025
Price: USD 3,660.00
The global market for Lead Alloy Solder Wire was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by...
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MRRPB5
April 2025
Price: USD 2,900.00
Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This...
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MRRPB5
February 2024
Price: USD 2,900.00
The global Automatic Wire Wedge Bonder Equipment market size is predicted to grow from US$ 67.7 million in 2025 to US$ 81.4 million in 2031; it is...
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LPI
February 2025
Price: USD 3,660.00
The global Wedge Bonding Tools market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
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MRRPB5
May 2024
Price: USD 2,900.00
The global market for Wire Bonder and Die Bonder was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million...
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MRRPB5
January 2025
Price: USD 2,900.00
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