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Your search for "Bonding Wires" gave back 60204 results.
The global Gold Bonding Wires market was valued at US$ 3063.8 million in 2023 and is anticipated to reach US$ 3682.3 million by 2030, witnessing a...
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MRRPB5
May 2024
Price: USD 2,900.00
LED automatic wire bonding machine is a kind of equipment specially used for precise welding in the process of LED packaging and manufacturing...
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LPI
July 2024
Price: USD 3,660.00
As the connecting wire between the chip and the lead frame, bonding wire is an important basic material for integrated circuit packaging and testing...
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LPI
August 2024
Price: USD 3,660.00
The precious metal bonding wire is a special metal wire used in the field of semiconductor packaging. It has the characteristics of high conductivity...
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LPI
April 2024
Price: USD 3,660.00
The global Bonding Wires market size was valued at US$ 9366.3 million in 2023. With growing demand in downstream market, the Bonding Wires is...
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LPI
January 2024
Price: USD 3,660.00
The global Semiconductor Copper Bonding Wire market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Semiconductor Gold Bonding Wire market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Semiconductor Silver Bonding Wire market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a...
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MRRPB5
July 2024
Price: USD 2,900.00
Wire bonding machines are used in the semiconductor industry for making electrical connections between semiconductor chips (integrated circuits or...
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MRRPB5
June 2024
Price: USD 2,900.00
The global Thick Copper Bonding Wires market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast...
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GIR
March 2024
Price: USD 4,480.00
As the connecting wire between the chip and the lead frame, bonding wire is an important basic material for integrated circuit packaging and testing...
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MRRPB5
July 2024
Price: USD 2,900.00
Copper wire ultrasonic bonding machine is a special equipment used to connect copper wire to chips or circuit boards during the manufacturing process...
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LPI
July 2024
Price: USD 3,660.00
Wire Bonding Equipment is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the...
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MRRPB5
January 2024
Price: USD 2,900.00
Bonding wire is the material of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging...
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MRRPB5
January 2024
Price: USD 2,900.00
The global Bonding Wire for Semiconductor market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
June 2024
Price: USD 2,900.00
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