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Your search for "Chip Scale Package" gave back 26476 results.
The global Die Attach Machine market size is predicted to grow from US$ 1321 million in 2024 to US$ 1716 million in 2030; it is expected to grow at a...
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LPI
March 2025
Price: USD 3,660.00
The global market for Bright PET Chips was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031,...
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MRRPB5
April 2025
Price: USD 2,900.00
The global market for Contactless IC Card Chip was valued at US$ 4387 million in the year 2024 and is projected to reach a revised size of US$ 7391...
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MRRPB5
April 2025
Price: USD 2,900.00
The global Contactless IC Card Chip market size was valued at US$ 4318 million in 2024 and is forecast to a readjusted size of USD 7031 million by...
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GIR
January 2025
Price: USD 3,480.00
The global market for Substrates for Semiconductor Test Probe Card was valued at US$ 147 million in the year 2024 and is projected to reach a revised...
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MRRPB5
March 2025
Price: USD 2,900.00
The global Die Attach Machine market size was valued at US$ 1338 million in 2023 and is forecast to a readjusted size of USD 1778 million by 2030...
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GIR
July 2025
Price: USD 3,480.00
The global market for Die Attach Machine was valued at US$ 1300 million in the year 2023 and is projected to reach a revised size of US$ 1738 million...
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MRRPB5
January 2025
Price: USD 2,900.00
The global market for Copper Sintering Paste was valued at US$ 7.1 million in the year 2024 and is projected to reach a revised size of US$ 73.1...
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MRRPB5
February 2025
Price: USD 2,900.00
The global Weigh Scale IC market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from...
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LPI
February 2025
Price: USD 3,660.00
The global market for Weigh Scale IC was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031,...
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MRRPB5
February 2025
Price: USD 2,900.00
The global Frequency Select MEMS Oscillator (FSMO) market size is predicted to grow from US$ 1380 million in 2025 to US$ 2805 million in 2031; it is...
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LPI
August 2025
Price: USD 3,660.00
The global Advanced Packaging Inspection Systems market size is predicted to grow from US$ 446 million in 2025 to US$ 783 million in 2031; it is...
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LPI
January 2025
Price: USD 3,660.00
the global Wafer Temporary Bonder market size was valued at US$ 181 million in 2024 and is forecast to a readjusted size of USD 266 million by 2031...
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GIR
March 2025
Price: USD 3,480.00
The global market for Wafer Temporary Bonder was valued at US$ 176 million in the year 2024 and is projected to reach a revised size of US$ 260...
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MRRPB5
February 2025
Price: USD 2,900.00
The global Frequency Select MEMS Oscillator (FSMO) market size was valued at US$ 1180 million in 2024 and is forecast to a readjusted size of USD...
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GIR
February 2025
Price: USD 3,480.00
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