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- chip scale packaging
Your search for "Chip Scale Package" gave back 31809 results.
The global Chip Scale Package Epoxy Resin market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031...
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GIR
May 2025
Price: USD 3,480.00
Chip Scale Package Epoxy Resin is an epoxy resin material specially used for packaging and protecting chips. It has the functions of fixing,...
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MRRPB5
August 2024
Price: USD 2,900.00
Traditional LEDs usually undergo from the chip/die manufacturing to packaging processes where the die would be attached to an interposer such as a...
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LPI
May 2024
Price: USD 3,660.00
Traditional LEDs usually undergo from the chip/die manufacturing to packaging processes where the die would be attached to an interposer such as a...
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MRRPB5
February 2023
Price: USD 2,900.00
The global market for Chip Scale Adhesive was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031...
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MRRPB5
February 2025
Price: USD 2,900.00
The global Chip Scale Adhesive market size was valued at US$ million in 2023. With growing demand in downstream market, the Chip Scale Adhesive is...
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LPI
October 2024
Price: USD 3,660.00
Chip-scale adhesives enable strong bonds and fast cure times, and the adhesive material secures components and packages to substrates, as well as...
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MRRPB5
April 2024
Price: USD 2,900.00
Chip-scale adhesives enable strong bonds and fast cure times, and the adhesive material secures components and packages to substrates, as well as...
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MRRPB5
February 2023
Price: USD 2,900.00
The global Underfill Adhesives market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR...
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GIR
August 2024
Price: USD 3,480.00
The global Electronic Circuit Board Underfill Material market size was valued at USD million in 2023 and is forecast to a readjusted size of USD...
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GIR
June 2024
Price: USD 3,480.00
The global Underfill Materials market size was valued at USD 1204.5 million in 2023 and is forecast to a readjusted size of USD 1587.1 million by...
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GIR
July 2024
Price: USD 3,480.00
The global Circuit Board Chips Protecting Encapsulant market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Underfill Materials market size was valued at US$ 1145.1 million in 2023. With growing demand in downstream market, the Underfill...
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LPI
March 2024
Price: USD 3,660.00
The global market for IC Package Substrate Material was valued at US$ 6950 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
Underfill materials are necessary composite formulations made of organic polymers and inorganic fillers. These materials find their application in...
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MRRPB5
January 2024
Price: USD 2,900.00
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