0 items USD 0.00Search
Your search for "Chip-on-Board (COB)" gave back 1683628 results.
During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting...
颁补迟补濒辞驳:听
GIR
September 2024
Price: USD 3,480.00
The global Wet Film Photoresist market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
颁补迟补濒辞驳:听
MRRPB5
May 2024
Price: USD 2,900.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 2,900.00
The global Electronic Grade Tetramethylammonium Chloride market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
颁补迟补濒辞驳:听
MRRPB5
April 2024
Price: USD 2,900.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
颁补迟补濒辞驳:听
GIR
September 2024
Price: USD 3,480.00
The global Semiconductor Photomask market was valued at US$ 6050 million in 2023 and is anticipated to reach US$ 8227 million by 2030, witnessing a...
颁补迟补濒辞驳:听
MRRPB5
November 2024
Price: USD 2,900.00
Silicon carbide MOSFET has the characteristics of low on-off resistance and small switch loss, which can reduce device loss and improve system...
颁补迟补濒辞驳:听
MRRPB5
March 2023
Price: USD 2,900.00
The global Photomask market was valued at US$ 6050 million in 2023 and is anticipated to reach US$ 8227 million by 2030, witnessing a CAGR of 4.5%...
颁补迟补濒辞驳:听
MRRPB5
November 2024
Price: USD 2,900.00
The global LED Display Screen Unit market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast period...
颁补迟补濒辞驳:听
GIR
March 2024
Price: USD 4,480.00
During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting...
颁补迟补濒辞驳:听
MRRPB5
January 2023
Price: USD 2,900.00
Wire bonding is the method of making interconnections between an integrated circuit or other semiconductor device and its packaging during...
颁补迟补濒辞驳:听
MRRPB5
December 2024
Price: USD 4,900.00
Row is a multi - line socket, commonly known as the plug board, row plug, the scientific name of the cable extension components or extension socket...
颁补迟补濒辞驳:听
MRRPB5
December 2024
Price: USD 4,900.00
The global Wet Film Photoresist market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of %...
颁补迟补濒辞驳:听
MRRPB5
May 2023
Price: USD 2,900.00
A 4K interactive flat panel is an electronic device that utilizes a high-definition 4K LCD screen (with a resolution of 3840脳2160 pixels or above) as...
颁补迟补濒辞驳:听
MRRPB5
October 2024
Price: USD 2,900.00
Highlights The global Semiconductor Electronic Design Automation (EDA) market was valued at US$ million in 2022 and is anticipated to reach US$...
颁补迟补濒辞驳:听
MRRPB5
March 2023
Price: USD 2,900.00
听
