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Your search for "Chip-on-Board (COB)" gave back 1683005 results.
The global IGBT Wire Bonding Equipment market was valued at US$ 824 million in 2023 and is anticipated to reach US$ 1321 million by 2030, witnessing...
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MRRPB5
November 2024
Price: USD 2,900.00
The global Copper Wire Bonding Equipment market was valued at US$ 436 million in 2023 and is anticipated to reach US$ 707 million by 2030, witnessing...
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MRRPB5
November 2024
Price: USD 2,900.00
Plastic leaded chip carriers (PLCC) sockets are a type of chip carrier used to form connections between integrated circuits (ICs) and printed circuit...
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MRRPB5
November 2024
Price: USD 3,950.00
An auxiliary power module is a type of electronic component that provides power to the main system while also performing auxiliary functions. These...
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MRRPB5
November 2024
Price: USD 3,950.00
The global Smartphone Compact Camera Module market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031...
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GIR
May 2025
Price: USD 3,480.00
A process wherein a semiconductor chip is packaged in a form suitable for the electronic device. Semiconductor packaging is a process of protecting...
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MRRPB5
August 2024
Price: USD 2,900.00
Encapsulants are materials used to encase or encapsulate semiconductor chips or dies within a protective housing or package. They are typically...
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MRRPB5
March 2024
Price: USD 2,900.00
Bismaleimide Triazine (BT) resin is basically a heat resistant thermoset resin. BT Resin is one of the most commonly used resin in manufacturing of...
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MRRPB5
September 2024
Price: USD 3,950.00
A High Accuracy die bonder is a system that places a semiconductor device onto the next level of interconnection, whether it be a substrate or a...
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MRRPB5
September 2024
Price: USD 2,900.00
The global market for Smartphone Compact Camera Module was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
March 2025
Price: USD 2,900.00
Plastic leaded chip carriers (PLCC) sockets are a type of chip carrier used to form connections between integrated circuits (ICs) and printed circuit...
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MRRPB5
July 2024
Price: USD 2,900.00
Crystal oscillators are indispensable in the entire air conditioning circuit, and there are control chips like microcontrollers on the circuit board...
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LPI
July 2024
Price: USD 3,660.00
A process wherein a semiconductor chip is packaged in a form suitable for the electronic device. Semiconductor packaging is a process of protecting...
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MRRPB5
September 2024
Price: USD 2,900.00
Peelable ultra-thin copper foil with carrier is a necessary base material for preparing chip packaging substrates and HDI boards. Its thickness is...
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LPI
July 2024
Price: USD 3,660.00
A multi-chip package is a type of electronic packaging that combines several integrated circuits (ICs) into a single device. An MCP is a single...
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MRRPB5
May 2024
Price: USD 2,900.00
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