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Your search for "Chip-on-Board (COB)" gave back 1684043 results.
3C SMD (Surface-Mount Device) power inductors are high-performance components designed for power management in a wide range of electronic...
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LPI
July 2024
Price: USD 3,660.00
A die bonder is a system that places a semiconductor device onto the next level of interconnection, whether it be a substrate or a board. The global...
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MRRPB5
June 2024
Price: USD 2,900.00
The global Unmanaged Industrial Ethernet Switches market size was valued at USD 418.9 million in 2023 and is forecast to a readjusted size of USD 561...
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GIR
July 2024
Price: USD 3,480.00
The global Soft Solder Die Bonder market was valued at US$ 247 million in 2023 and is anticipated to reach US$ 366 million by 2030, witnessing a CAGR...
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MRRPB5
November 2024
Price: USD 2,900.00
Thermo-mechanical pulping, or TMP, is a high-yield, energy- and resource-efficient technology for splitting larger wood chips into individual...
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MRRPB5
June 2024
Price: USD 2,900.00
Gain Modulated Field Effect Transistor (GEMFET) is a power semiconductor device and majorly finds application in switch, pulse modulation and phase...
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LPI
May 2024
Price: USD 3,660.00
Used To Provide Insulation And Smoothness. It Is Used As A Cover Coat For Electrode Wiring On Ceramic Substrates And A Coating Material For Circuit...
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MRRPB5
June 2024
Price: USD 2,900.00
Automated test equipment (ATE) consists of a variety of instruments or cards for testing memory, digital, and mixed-signal at the wafer and Packaged...
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MRRPB5
August 2024
Price: USD 2,900.00
Thin-film substrate technology uses semiconductor and microsystem technology processes to produce circuit boards on ceramic or organic materials. The...
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MRRPB5
May 2024
Price: USD 2,900.00
Electronic communication functional filling materials are a type of functional fillers with excellent performance. They can be filled in electronic...
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MRRPB5
August 2024
Price: USD 2,900.00
Thick film substrates are electronic circuit boards generally made from ceramics. The ceramic is screened with conductor, insulator and resistor...
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MRRPB5
May 2024
Price: USD 2,900.00
The global CSP Packaging Solder Ball market size was valued at USD 85 million in 2023 and is forecast to a readjusted size of USD 131.4 million by...
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GIR
April 2024
Price: USD 3,480.00
CSP, or Chip Scale Package, is a type of integrated circuit (IC) packaging that is designed to be roughly the same size as the semiconductor die it...
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MRRPB5
March 2024
Price: USD 2,900.00
An ultra-pure copper sputtering target is a high-purity copper material that is used in the sputtering process to deposit thin films of copper onto a...
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MRRPB5
October 2024
Price: USD 3,950.00
Artificial wood panels are sheet materials that contain a significant proportion of wood in one of a variety of forms (strips, veneers, chips,...
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MRRPB5
March 2024
Price: USD 2,900.00
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