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- fan-out chip on substrate (focus)
Your search for "Fan-Out Chip on Substrate (FOCoS)" gave back 335211 results.
The packaging substrate is the largest part of the packaging material cost, and it mainly plays the role of carrying and protecting the chip and...
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MRRPB5
October 2024
Price: USD 3,950.00
The packaging substrate is the largest part of the packaging material cost, and it mainly plays the role of carrying and protecting the chip and...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Low-alpha Beam High Purity Silica market size was valued at US$ 87 million in 2023. With growing demand in downstream market, the Low-...
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LPI
October 2024
Price: USD 3,660.00
COF grade flexible copper foil substrate, namely Chip On Film's flexible copper foil substrate, is a die soft film assembly technology that...
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LPI
May 2024
Price: USD 3,660.00
Low-alpha beam high purity silica refers to high-purity silica wafers used in semiconductor manufacturing for low alpha particle emission. The global...
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MRRPB5
October 2023
Price: USD 2,900.00
Die bonding paste, also known as die attach paste or die attach adhesive, is a specialized material used in semiconductor packaging to bond...
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MRRPB5
April 2024
Price: USD 2,900.00
Coir substrate, also known as coconut coir or coconut fiber substrate, is a natural, renewable growing medium used in horticulture, agriculture, and...
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LPI
July 2024
Price: USD 3,660.00
The global market for Low-alpha Beam High Purity Silica was valued at US$ 107 million in the year 2024 and is projected to reach a revised size of US...
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MRRPB5
March 2025
Price: USD 2,900.00
The global Chip Bonding Materials market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR...
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LPI
August 2024
Price: USD 3,660.00
The global Thick Film Substrates market size was valued at US$ million in 2023. With growing demand in downstream market, the Thick Film Substrates...
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LPI
September 2024
Price: USD 3,660.00
Low-alpha beam high purity silica refers to high-purity silica wafers used in semiconductor manufacturing for low alpha particle emission. The global...
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MRRPB5
April 2024
Price: USD 2,900.00
The global market for IC Package Substrate Material was valued at US$ 6950 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
Extreme Ultraviolet (EUV) Photomask Substrates are complex multilayer film stacks. The global Extreme Ultraviolet (EUV) Photomask Substrates market...
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LPI
April 2024
Price: USD 3,660.00
The global Aluminium Nitride Substrate market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a...
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LPI
January 2025
Price: USD 3,660.00
The global Thick Film Circuit Substrates market size was valued at US$ million in 2023. With growing demand in downstream market, the Thick Film...
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LPI
September 2024
Price: USD 3,660.00
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