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Your search for "IC packaging and test" gave back 672 results.
The global market for Semiconductor Wafer Defect Inspection Equipment was valued at US$ 7507 million in the year 2023 and is projected to reach a...
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MRRPB5
January 2025
Price: USD 2,900.00
The global Fully Automatic Wafer Probe Equipment market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by...
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GIR
April 2024
Price: USD 3,480.00
A Fully Automatic Wafer Probe Equipment, is a specialized piece of equipment used in semiconductor and microelectronics testing and characterization...
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MRRPB5
March 2024
Price: USD 2,900.00
The global market for Ultrasonic Scanning Acoustic Microscopy was valued at US$ 150 million in the year 2024 and is projected to reach a revised size...
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MRRPB5
March 2025
Price: USD 2,900.00
The global Automatic Wire Bonders market size was valued at US$ million in 2023. With growing demand in downstream market, the Automatic Wire Bonders...
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LPI
December 2024
Price: USD 3,660.00
The global GaAs Epitaxial Wafer market size is predicted to grow from US$ 476 million in 2025 to US$ 792 million in 2031; it is expected to grow at a...
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LPI
April 2025
Price: USD 3,660.00
Wire bonder is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of...
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MRRPB5
March 2024
Price: USD 2,900.00
Wire Bonding Equipment is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the...
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MRRPB5
January 2024
Price: USD 2,900.00
Wire Bonding Equipment is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the...
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MRRPB5
April 2023
Price: USD 2,900.00
Wire bonder is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of...
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MRRPB5
February 2023
Price: USD 2,900.00
The global Wafer Frame market size was valued at US$ 121.1 million in 2023. With growing demand in downstream market, the Wafer Frame is forecast to...
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LPI
January 2024
Price: USD 3,660.00
Sputtering is the process of forming a thin film when the object is attached to the target substrate by the sputtering and scattering, and the...
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MRRPB5
December 2024
Price: USD 4,900.00
The wafer ring frame is widely used for in-process wafer handling during wafer back-grinding operation, wafer dicing and pick & place operation...
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MRRPB5
April 2024
Price: USD 3,950.00
The wafer ring frame is widely used for in-process wafer handling during wafer back-grinding operation, wafer dicing and pick & place operation...
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GIR
September 2024
Price: USD 3,480.00
The wafer ring frame is widely used for in-process wafer handling during wafer back-grinding operation, wafer dicing and pick & place operation...
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MRRPB5
February 2023
Price: USD 2,900.00
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