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Your search for "Industrial Computer" gave back 403428 results.
Fine Metal Mask (FMM) is a metal material board that is thinner than paper, and is a consumable core component for the production of organic light-...
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MRRPB5
October 2023
Price: USD 2,900.00
Copper-beryllium alloys are mainly based on copper with a beryllium addition. High strength beryllium copper alloys contain 0.4-2% of beryllium with...
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MRRPB5
May 2024
Price: USD 5,900.00
The global Semiconductor Grade Silicon market size is predicted to grow from US$ 7923 million in 2025 to US$ 11180 million in 2031; it is expected to...
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LPI
April 2025
Price: USD 3,660.00
The global Digital Offset Printing Plate market size is predicted to grow from US$ 2232 million in 2025 to US$ 1802 million in 2031; it is expected...
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LPI
July 2025
Price: USD 3,660.00
The global Digital Offset Printing Plate market size was US$ 2353 million in 2024 and is forecast to a readjusted size of US$ 1856 million by 2031...
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MRRPB5
March 2025
Price: USD 4,250.00
The global FR4 CCL Material market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR of...
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GIR
August 2025
Price: USD 3,480.00
The global Rollable Ultra Thin Glass (UTG) market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030...
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GIR
February 2024
Price: USD 3,480.00
The global Magnetic Materials market size is predicted to grow from US$ 8462 million in 2025 to US$ 14700 million in 2031; it is expected to grow at...
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LPI
January 2025
Price: USD 3,660.00
The global Bonding Wire for Semiconductor market size was valued at US$ million in 2023. With growing demand in downstream market, the Bonding Wire...
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LPI
October 2024
Price: USD 3,660.00
The global Aluminum Silicon (AlSi) Bonding Wire market size was valued at USD 133.8 million in 2023 and is forecast to a readjusted size of USD 192.8...
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GIR
October 2024
Price: USD 3,480.00
The global Multilayer Printed-wiring Board market size was valued at US$ 28840 million in 2023. With growing demand in downstream market, the...
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LPI
January 2024
Price: USD 3,660.00
Multilayer PCB is made up of three or more conductive layers(copper foil layer), these layers are pressed together and form multilayer PCB. Copper...
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MRRPB5
April 2024
Price: USD 3,950.00
The global Solder Paste market size was US$ 1294 million in 2024 and is forecast to a readjusted size of US$ 1813 million by 2031 with a CAGR of 5.0...
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MRRPB5
April 2025
Price: USD 4,250.00
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during...
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MRRPB5
June 2024
Price: USD 5,900.00
The global Semiconductor Conductive Adhesive market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by...
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GIR
July 2025
Price: USD 3,480.00
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