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Your search for "MEMS (Micro-Electro-Mechanical Systems)" gave back 527721 results.
MEMSmicro actuators, devices that convert electrical energy to mechanical motion, comprise more than 50% of the rapidly growing MEMS market. They are...
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MRRPB5
March 2023
Price: USD 2,900.00
Etching is a process in which layers from the surface of a wafer are removed using chemicals. An etch system shapes the thin film into a desired...
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MRRPB5
November 2024
Price: USD 3,950.00
Etching is a process in which layers from the surface of a wafer are removed using chemicals. An etch system shapes the thin film into a desired...
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MRRPB5
October 2024
Price: USD 3,950.00
Etching is a process in which layers from the surface of a wafer are removed using chemicals. An etch system shapes the thin film into a desired...
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MRRPB5
June 2024
Price: USD 2,900.00
The global market for Micro Switches was valued at US$ 832 million in the year 2024 and is projected to reach a revised size of US$ 982 million by...
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MRRPB5
June 2025
Price: USD 2,900.00
Fan-out panel level package (FOPLP) is well-known process to extend for Fan-Out Wafer Level Package (FOWLP) efficiently in terms of area-fill factor...
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MRRPB5
February 2023
Price: USD 2,900.00
Etching is a process in which layers from the surface of a wafer are removed using chemicals. An etch system shapes the thin film into a desired...
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MRRPB5
May 2023
Price: USD 2,900.00
Etching is a process in which layers from the surface of a wafer are removed using chemicals. An etch system shapes the thin film into a desired...
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MRRPB5
January 2023
Price: USD 4,000.00
The micro-nano mechanical tester is a metrological instrument used in the field of mechanics, focusing on mechanical property testing at the micro...
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MRRPB5
June 2024
Price: USD 2,900.00
The micro-nano mechanical tester is a metrological instrument used in the field of mechanics, focusing on mechanical property testing at the micro...
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GIR
August 2024
Price: USD 3,480.00
Fan-out panel level package (FOPLP) is well-known process to extend for Fan-Out Wafer Level Package (FOWLP) efficiently in terms of area-fill factor...
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MRRPB5
May 2024
Price: USD 2,900.00
The global Giant Magnetostrictive Materials market size is predicted to grow from US$ 189 million in 2025 to US$ 286 million in 2031; it is expected...
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LPI
March 2025
Price: USD 3,660.00
Fan-out wafer-level packaging (FOWLP) is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging(WLP)...
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MRRPB5
February 2023
Price: USD 2,900.00
Microelectromechanical systems (MEMS) are micrometer-scale devices that integrate electrical and mechanical elements with sizes ranging from...
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MRRPB5
October 2023
Price: USD 2,900.00
The global market for Laser Lithography Systems was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by...
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MRRPB5
April 2025
Price: USD 2,900.00

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