0 items USD 0.00Search
- Did you mean
- meet mirror
Your search for "MEMS mirrors" gave back 10785 results.
The most direct understanding of optical switch is a device used to open or close an optical circuit. It consists of mechanical, optomechanical, or...
颁补迟补濒辞驳:听
GIR
September 2024
Price: USD 3,480.00
MEMS optical switch is a micro-optical switch that made of the semiconductor material, which is generally used as movable micro-mirrors that can...
颁补迟补濒辞驳:听
MRRPB5
May 2023
Price: USD 2,900.00
The most direct understanding of optical switch is a device used to open or close an optical circuit. It consists of mechanical, optomechanical, or...
颁补迟补濒辞驳:听
MRRPB5
January 2023
Price: USD 2,900.00
The global Wafer Bonder market size is predicted to grow from US$ 314 million in 2025 to US$ 428 million in 2031; it is expected to grow at a CAGR of...
颁补迟补濒辞驳:听
LPI
January 2025
Price: USD 3,660.00
The global market for Wafer Bonder was valued at US$ 321 million in the year 2024 and is projected to reach a revised size of US$ 452 million by 2031...
颁补迟补濒辞驳:听
MRRPB5
April 2025
Price: USD 2,900.00
The global market for Wafer Bonder was valued at US$ 276 million in the year 2023 and is projected to reach a revised size of US$ 432 million by 2030...
颁补迟补濒辞驳:听
MRRPB5
December 2024
Price: USD 2,900.00
The global Thin Wafers Temporary Bonding Equipment market size was valued at US$ 134.8 million in 2023. With growing demand in downstream market, the...
颁补迟补濒辞驳:听
LPI
January 2024
Price: USD 3,660.00
Thin Wafers Temporary Bonding Equipment is to closely combine two mirror polished homogeneous or heterogeneous wafers through chemical and physical...
颁补迟补濒辞驳:听
GIR
September 2024
Price: USD 3,480.00
Wafer bonding machine is a device specifically used for the wafer bonding process, which refers to the close bonding of two mirror-polished...
颁补迟补濒辞驳:听
MRRPB5
February 2023
Price: USD 2,900.00
Thin Wafers Temporary Bonding Equipment is to closely combine two mirror polished homogeneous or heterogeneous wafers through chemical and physical...
颁补迟补濒辞驳:听
MRRPB5
January 2023
Price: USD 2,900.00
The global Wafer Bonder market size was valued at US$ 330 million in 2024 and is forecast to a readjusted size of USD 462 million by 2031 with a CAGR...
颁补迟补濒辞驳:听
GIR
July 2025
Price: USD 3,480.00
The global Automotive-grade Hybrid Solid-state LiDAR market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 2,900.00
The global Physical Vapor Deposition System market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030...
颁补迟补濒辞驳:听
GIR
November 2024
Price: USD 3,480.00
The Digital Light Processing (DLP) microdisplay chip is a micro-display technology that uses millions of tiny mirrors to control the direction of...
颁补迟补濒辞驳:听
LPI
November 2024
Price: USD 3,660.00
Wafer bonding is through chemical and physical effects of the two have mirror polished homogeneous or heterogeneous wafers closely together, after...
颁补迟补濒辞驳:听
MRRPB5
April 2024
Price: USD 3,950.00
听
