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Your search for "OSAT" gave back 233 results.
The global market for Bonder was valued at US$ 2572 million in the year 2024 and is projected to reach a revised size of US$ 3748 million by 2031,...
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MRRPB5
May 2025
Price: USD 2,900.00
The global market for Chip Sorter was valued at US$ 2283 million in the year 2024 and is projected to reach a revised size of US$ 4848 million by...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for Semiconductor Chip Sorter was valued at US$ 2283 million in the year 2024 and is projected to reach a revised size of US$ 4848...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for Semiconductor Chip Test Probe Stations was valued at US$ 1268 million in the year 2024 and is projected to reach a revised size...
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MRRPB5
February 2025
Price: USD 2,900.00
The global IC Packaging and Testing Service market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow...
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LPI
February 2025
Price: USD 3,660.00
The global market for Semiconductor Packaging Testing Equipment was valued at US$ 14240 million in the year 2024 and is projected to reach a revised...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for IC Packaging and Testing Service was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for LSI Test Probe Card was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for Test Handler Systems was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031...
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MRRPB5
January 2025
Price: USD 2,900.00
The global market for Advanced Interconnect Packaging Inspection and Metrology Systems was valued at US$ 421 million in the year 2024 and is...
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MRRPB5
January 2025
Price: USD 2,900.00
The global market for Wafer Inspection and Metrology Systems for Advanced Packaging was valued at US$ 421 million in the year 2024 and is projected...
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MRRPB5
January 2025
Price: USD 2,900.00
Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive...
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MRRPB5
December 2024
Price: USD 4,900.00
Wafer Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of...
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MRRPB5
December 2024
Price: USD 4,900.00
Wire bonder is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of...
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MRRPB5
December 2024
Price: USD 4,900.00
The global market for Ultra High Purity Aluminum Sputtering Targets for IC Assembly and Testing was valued at US$ 73.5 million in the year 2024 and...
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MRRPB5
April 2025
Price: USD 2,900.00
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