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Your search for "OSAT" gave back 909 results.
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where...
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MRRPB5
January 2023
Price: USD 2,900.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
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MRRPB5
January 2023
Price: USD 2,900.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
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MRRPB5
January 2023
Price: USD 4,000.00
The global market for Wire Wedge Bonder Equipment was valued at US$ 81.7 million in the year 2024 and is projected to reach a revised size of US$ 100...
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MRRPB5
May 2025
Price: USD 2,900.00
The global market for Die Sorting Equipment was valued at US$ 355 million in the year 2024 and is projected to reach a revised size of US$ 520...
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MRRPB5
April 2025
Price: USD 2,900.00
Automotive electronics encompasses a variety of products 鈥� from body electronics and access systems to engine, lighting and infotainment components...
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MRRPB5
August 2024
Price: USD 2,900.00
Automotive electronics encompasses a variety of products 鈥� from body electronics and access systems to engine, lighting and infotainment components...
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MRRPB5
August 2024
Price: USD 2,900.00
Automotive electronics encompasses a variety of products 鈥� from body electronics and access systems to engine, lighting and infotainment components...
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MRRPB5
August 2024
Price: USD 2,900.00
The global Semiconductor Dielectric Etching Equipment (SDEE) market size was valued at USD million in 2023 and is forecast to a readjusted size of...
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GIR
July 2024
Price: USD 3,480.00
The global 200 mm Wafer Probing Machines market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030...
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GIR
March 2024
Price: USD 3,480.00
The global Wire Wedge Bonder Equipment market size was valued at US$ 81.8 million in 2024 and is forecast to a readjusted size of USD 100 million by...
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GIR
February 2025
Price: USD 3,480.00
The global Wedge Weld Lead Bonding Machine market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030...
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GIR
February 2024
Price: USD 3,480.00
The global Semiconductor Packaging and Test Equipment market size is predicted to grow from US$ 12730 million in 2025 to US$ 18290 million in 2031;...
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LPI
January 2025
Price: USD 3,660.00
The global Die Sorting Equipment market size was valued at US$ 365 million in 2024 and is forecast to a readjusted size of USD 531 million by 2031...
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GIR
July 2025
Price: USD 3,480.00
The global market for Flip Chip Bonder was valued at US$ 297 million in the year 2024 and is projected to reach a revised size of US$ 322 million by...
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MRRPB5
January 2025
Price: USD 2,900.00
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