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Your search for "OSAT" gave back 901 results.
Wafer TCB (Thermocompression Bonding) bonders are advanced tools used in the semiconductor industry to bond wafers using the thermocompression...
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MRRPB5
June 2024
Price: USD 2,900.00
Advanced Packaging Interconnect Electroplating Solutions refer to specialized chemical solutions used in the electroplating process to create...
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MRRPB5
June 2024
Price: USD 2,900.00
Semiconductor Back-End Inspection and Metrology Equipment refers to the machinery and tools used in the final stages of semiconductor manufacturing,...
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LPI
June 2024
Price: USD 3,660.00
A wafer-level packaging inspection and metrology system is a specialized tool used in the semiconductor industry to inspect, measure, and...
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LPI
May 2024
Price: USD 3,660.00
Wafer inspection and metrology equipment for advanced packaging refer to specialized tools and systems used in the semiconductor industry to inspect...
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LPI
May 2024
Price: USD 3,660.00
The global High-Speed Flip Chip Bonder market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of...
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MRRPB5
May 2024
Price: USD 2,900.00
The global High-Accuracy Flip Chip Bonder market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
May 2024
Price: USD 2,900.00
The global Automated Chip Handler market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
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MRRPB5
May 2024
Price: USD 2,900.00
Die bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1...
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MRRPB5
May 2024
Price: USD 2,900.00
High Speed Die Sorter is mainly used in the semiconductor manufacturing process to quickly sort and sort cut chips. They can process large numbers of...
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MRRPB5
May 2024
Price: USD 2,900.00
Automated Die Sorter refers to a machine used in the semiconductor manufacturing process that automatically sorts die or chips from a wafer based on...
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MRRPB5
May 2024
Price: USD 2,900.00
Die Test Handler is a type of equipment used in the semiconductor manufacturing industry to automate the process of testing individual dies or chips...
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MRRPB5
May 2024
Price: USD 2,900.00
Advanced packaging metrology equipment refers to specialized tools and systems used in the semiconductor industry to measure, characterize, and...
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GIR
May 2024
Price: USD 3,480.00
Ultrapure water is produced by removing impurities from drinking, river or process water, which contains virtually no impurities other than hydrogen...
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LPI
May 2024
Price: USD 3,660.00
Automotive electronics encompasses a variety of products 鈥� from body electronics and access systems to engine, lighting and infotainment components...
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MRRPB5
May 2024
Price: USD 3,950.00
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