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Your search for "OSAT" gave back 901 results.
CSP, or Chip Scale Package, is a type of integrated circuit (IC) packaging that is designed to be roughly the same size as the semiconductor die it...
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MRRPB5
March 2024
Price: USD 2,900.00
BGA, or Ball Grid Array, packaging is a type of integrated circuit (IC) packaging used in electronics. In a BGA package, solder balls play a crucial...
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MRRPB5
March 2024
Price: USD 2,900.00
The global 12 inch Fully Automatic Tri-temp Prober market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the...
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GIR
March 2024
Price: USD 4,480.00
The global 300 mm Wafer Probing Machines market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
March 2024
Price: USD 2,900.00
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where...
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MRRPB5
March 2024
Price: USD 2,900.00
Fully Automatic Tri-temp Prober is an automatic prober with tri-temp test capability. It can test electrical performance of most 8/12-inch wafers...
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MRRPB5
March 2024
Price: USD 2,900.00
Ambient & High-temp Prober is an automatic prober with tri-temp test capability. It can test electrical performance of most 8/12-inch wafers...
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MRRPB5
March 2024
Price: USD 2,900.00
A Fully Automatic Probe Station, often referred to simply as an "Automatic Probe Station," is a specialized piece of equipment used in...
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MRRPB5
February 2024
Price: USD 2,900.00
For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing,...
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MRRPB5
February 2024
Price: USD 2,900.00
The global Dispensing Needle for Semiconductor market was valued at US$ 213 million in 2023 and is anticipated to reach US$ 313.8 million by 2030,...
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MRRPB5
January 2024
Price: USD 2,900.00
Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive...
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MRRPB5
January 2024
Price: USD 2,900.00
Wafer Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of...
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MRRPB5
January 2024
Price: USD 2,900.00
Wire Bonding Equipment is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the...
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MRRPB5
January 2024
Price: USD 2,900.00
Chip Handler in Semiconductors are primarily used to for sorting, testing and transferring chips with the simple electrical interface diagram: ATE 鈫�...
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MRRPB5
January 2024
Price: USD 2,900.00
Ball Bonder is one sort of semiconductor manufacturing machine, ball bonding is a type of wire bonding, and is the most common way to make the...
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MRRPB5
January 2024
Price: USD 2,900.00
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