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Your search for "OSAT" gave back 904 results.
The global Die Attach Systems market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR) of...
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MRRPB5
May 2023
Price: USD 4,900.00
Before the wafer is thinned, a layer of adhesive film will be pasted on the front of the wafer. The function of this layer of film is to fix the chip...
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MRRPB5
November 2023
Price: USD 2,900.00
Wire bonder is a machine that is used for making interconnects between any other semiconductor device or ICs (Integrated Circuits) at the time of...
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MRRPB5
February 2023
Price: USD 2,900.00
Dedicated To Chip-To-Chip/Carrier/Chip Packaging Solutions/Automatic Sub-Mounting Processing. It Is Characterized By High Placement Accuracy And Is...
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MRRPB5
February 2023
Price: USD 2,900.00
Wafer Inspection and Metrology Systems for Advanced Packaging is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-...
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MRRPB5
October 2023
Price: USD 2,900.00
Filming on wafers used in the production of semiconductor integrated circuits. The global Vacuum Wafer Mounter market was valued at US$ million in...
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MRRPB5
March 2023
Price: USD 2,900.00
Fully-automated industrial versions are for large-scale mass production. Die bonders are specialized semi- or fully-automatic high-precision machine...
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MRRPB5
February 2023
Price: USD 2,900.00
Semi-Automatic Die Bonder Equipment is a high precision, operator controlled machine for picking and placing bare semiconductor and related devices...
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MRRPB5
February 2023
Price: USD 2,900.00
The global Wafer Inspection and Metrology Systems for Advanced Packaging market size was valued at US$ 433 million in 2024 and is forecast to a...
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GIR
July 2025
Price: USD 3,480.00
The global Advanced Interconnect Packaging Inspection and Metrology Systems market size was valued at US$ 433 million in 2024 and is forecast to a...
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GIR
July 2025
Price: USD 3,480.00
The global market for Manual Spherical Bonding Machine was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
April 2025
Price: USD 2,900.00
The global market for Ball Wire Bonder was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031,...
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MRRPB5
April 2025
Price: USD 2,900.00
The global market for Spherical Lead Bonding Machine was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
April 2025
Price: USD 2,900.00
The global Chip Sorter market size was valued at US$ 2350 million in 2024 and is forecast to a readjusted size of USD 4916 million by 2031 with a...
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GIR
April 2025
Price: USD 3,480.00
The global Semiconductor Chip Test Probe Stations market size was valued at US$ 1305 million in 2024 and is forecast to a readjusted size of USD 2153...
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GIR
April 2025
Price: USD 3,480.00
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