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Your search for "Semiconductor Packaging" gave back 32977 results.
The global Quad Flat No-leads (QFN) Package market size was valued at USD 2924.4 million in 2023 and is forecast to a readjusted size of USD 3588.5...
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GIR
November 2024
Price: USD 3,480.00
Die bonding paste, also known as die attach paste or die attach adhesive, is a specialized material used in semiconductor packaging to bond...
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MRRPB5
April 2024
Price: USD 2,900.00
The surface-mount IC packages that are assembled on a PCB are available in different types. The most popular ones among these are the QFN packages...
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MRRPB5
February 2023
Price: USD 2,900.00
Temporary bonding adhesives are used in manufacturing to hold two substrates together during a specific process and later must be separated and...
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MRRPB5
August 2024
Price: USD 2,900.00
The global market for Underfills for Semiconductor was valued at US$ 276 million in the year 2024 and is projected to reach a revised size of US$ 460...
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MRRPB5
May 2025
Price: USD 2,900.00
Semiconductor wafer packaging refers to the process of processing wafers to obtain independent chips according to product model and functional...
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MRRPB5
November 2024
Price: USD 3,950.00
The global market for IC Package Substrate Material was valued at US$ 6950 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
Bonding wire is a core material for semiconductor packaging. It is a part that connects pins and silicon wafers and transmits electrical signals. It...
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MRRPB5
July 2024
Price: USD 2,900.00
Release tapes are industrial adhesive tapes which are used during the production of electronic devices, these tapes are used for temporary fixation...
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MRRPB5
October 2024
Price: USD 3,950.00
Epoxy resins are the main component of durable epoxy compounds used in semiconductor packaging assemblies. Therefore, the properties of the epoxy...
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MRRPB5
November 2024
Price: USD 3,950.00
Semiconductor wafer packaging refers to the process of processing wafers to obtain independent chips according to product model and functional...
颁补迟补濒辞驳:听
MRRPB5
June 2024
Price: USD 2,900.00
Release tapes are industrial adhesive tapes which are used during the production of electronic devices, these tapes are used for temporary fixation...
颁补迟补濒辞驳:听
MRRPB5
March 2024
Price: USD 2,900.00
Epoxy resins are the main component of durable epoxy compounds used in semiconductor packaging assemblies. Therefore, the properties of the epoxy...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Metal Electronic Packaging Materials market size was valued at USD 2479.7 million in 2023 and is forecast to a readjusted size of USD 3506...
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GIR
July 2024
Price: USD 3,480.00
The global Ceramic Electronic Packaging Materials market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million...
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GIR
July 2024
Price: USD 3,480.00
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