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Your search for "Semiconductor Packaging" gave back 256112 results.
The global market for Antenna-in-Package Technology was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million...
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MRRPB5
October 2024
Price: USD 3,950.00
The global SiC Power Device Package Line market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
July 2024
Price: USD 2,900.00
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to...
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MRRPB5
September 2024
Price: USD 3,950.00
The global market for Packaged GaN LED was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with...
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MRRPB5
September 2024
Price: USD 3,950.00
The Thin Shrink Small Outline Package (TSSOP), is a rectangular surface mount plastic ic package with gull-wing leads. The global market for Thin...
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MRRPB5
November 2024
Price: USD 3,950.00
Package Testing Machine is a type of experimental equipment used for quality inspection and control of packaging materials and finished packaging...
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LPI
October 2024
Price: USD 3,660.00
A power electronic module or power module acts as a physical container for the storage of several power components, usually power semiconductor...
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MRRPB5
September 2024
Price: USD 3,950.00
Metal Packaged Thyristors are high-power semiconductor devices typically used in applications requiring high current capacity. Based on the packaging...
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LPI
October 2024
Price: USD 3,660.00
The global Multi Chip Module Packaging market size was valued at US$ million in 2023. With growing demand in downstream market, the Multi Chip Module...
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LPI
October 2024
Price: USD 3,660.00
Semiconductor Leadframe is the basic component that delivers electric signal to external circuits and supports the chip inside of semiconductor...
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MRRPB5
April 2024
Price: USD 3,950.00
The global Diamond Package Substrate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of...
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MRRPB5
August 2024
Price: USD 2,900.00
LED ceramic substrate is an electronic sheet material, use electronic ceramic as substrate, the membrane and the outer circuit elements apt to form a...
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MRRPB5
December 2024
Price: USD 4,900.00
LED ceramic substrate is an electronic sheet material, use electronic ceramic as substrate, the membrane and the outer circuit elements apt to form a...
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MRRPB5
May 2024
Price: USD 2,900.00
A process wherein a semiconductor chip is packaged in a form suitable for the electronic device. Semiconductor packaging is a process of protecting...
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MRRPB5
August 2024
Price: USD 2,900.00
Flip chip is a packaging technology that interconnects chips and package carriers or substrates with conductive bumps. The global Flip Chip Packages...
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MRRPB5
March 2024
Price: USD 2,900.00
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