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Your search for "Semiconductor Packaging" gave back 257005 results.
The global System In a Package (SIP) and 3D Packaging market size is predicted to grow from US$ 11210 million in 2025 to US$ 28470 million in 2031;...
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LPI
January 2025
Price: USD 3,660.00
The function of the LED package device is to provide sufficient protection for the chip to prevent the chip from being damaged by long-term exposure...
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MRRPB5
May 2024
Price: USD 2,900.00
The global market for Semiconductor Transfer Molding Equipment was valued at US$ 1756 million in the year 2024 and is projected to reach a revised...
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MRRPB5
May 2025
Price: USD 2,900.00
The global Advanced Packaging Lithography Equipment market size was valued at US$ million in 2023. With growing demand in downstream market, the...
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LPI
October 2024
Price: USD 3,660.00
The global market for Flip Chip CSP (FCCSP) Package was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
January 2025
Price: USD 2,900.00
The global market for Mold Level Packaging Equipment was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$...
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MRRPB5
December 2024
Price: USD 3,950.00
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where...
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MRRPB5
January 2023
Price: USD 2,900.00
The plastic sealing machine is also called the plastic machine, the glue machine, and the plastic sealing machine. It is a machine that can press the...
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MRRPB5
October 2023
Price: USD 2,900.00
The global Chip Scale Package LEDs (CSP LED) market size was valued at US$ 1452 million in 2023 and is forecast to a readjusted size of USD 3966...
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GIR
August 2024
Price: USD 3,480.00
The plastic sealing machine is also called the plastic machine, the glue machine, and the plastic sealing machine. It is a machine that can press the...
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MRRPB5
October 2023
Price: USD 2,900.00
The plastic sealing machine is also called the plastic machine, the glue machine, and the plastic sealing machine. It is a machine that can press the...
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MRRPB5
October 2023
Price: USD 2,900.00
The global Packaged Crystal Oscillators market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030...
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GIR
July 2024
Price: USD 3,480.00
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where...
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MRRPB5
January 2024
Price: USD 2,900.00
The global market for AlSiC Hermetic Packaging was valued at US$ 25.7 million in the year 2024 and is projected to reach a revised size of US$ 34.6...
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MRRPB5
May 2025
Price: USD 2,900.00
IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In...
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MRRPB5
February 2024
Price: USD 2,900.00
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