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Your search for "Semiconductor Packaging" gave back 257299 results.
The global Gold Bumping market size was valued at US$ million in 2023. With growing demand in downstream market, the Gold Bumping is forecast to a...
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LPI
October 2024
Price: USD 3,660.00
The global Copper Pillar Bumping market size was valued at US$ million in 2023. With growing demand in downstream market, the Copper Pillar Bumping...
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LPI
October 2024
Price: USD 3,660.00
Bonding wire is a core material for semiconductor packaging. It is a part that connects pins and silicon wafers and transmits electrical signals. It...
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MRRPB5
July 2024
Price: USD 2,900.00
Release tapes are industrial adhesive tapes which are used during the production of electronic devices, these tapes are used for temporary fixation...
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MRRPB5
October 2024
Price: USD 3,950.00
Silver sintered pressed IGBT devices refer to power semiconductor devices that use silver sintering technology to press-fit and package the IGBT chip...
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MRRPB5
July 2024
Price: USD 2,900.00
Automotive OSATs (Outsourced Semiconductor Assembly and Test) are specialized service providers that offer a wide range of semiconductor packaging...
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MRRPB5
February 2023
Price: USD 4,900.00
The global Semiconductor Molding Equipment market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a...
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MRRPB5
February 2023
Price: USD 2,900.00
Hermetic lids are an essential component in microelectronic packaging, providing a sealed and protective environment for sensitive electronic devices...
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MRRPB5
November 2024
Price: USD 3,950.00
The global Wafer Cleaning & Packaging Machines market size was valued at US$ million in 2023. With growing demand in downstream market, the Wafer...
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LPI
October 2024
Price: USD 3,660.00
The global market for EEPROM Memory was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031,...
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MRRPB5
May 2025
Price: USD 2,900.00
The global market for LNB Voltage Regulator was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by...
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MRRPB5
May 2025
Price: USD 2,900.00
Gold bump are most commonly used in semiconductor packaging relating to TCP, COF, COG technology and photoelectron component off-chip interconnect...
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MRRPB5
January 2023
Price: USD 2,900.00
Gold bump are most commonly used in semiconductor packaging relating to TCP, COF, COG technology and photoelectron component off-chip interconnect...
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MRRPB5
January 2023
Price: USD 2,900.00
Copper pillars are terminals used to 鈥渇lip-chip鈥� IC chips to a substrate in a semiconductor package by TCFC (Thermal Compression Flip-Chip)...
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MRRPB5
January 2023
Price: USD 2,900.00
Equipped with solvent-based process equipment such as metal stripping, photoresist stripping, and polymer removal The global Spray Solvent Tool (SST...
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MRRPB5
October 2023
Price: USD 2,900.00
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