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Your search for "flat chip will grid array" gave back 1659214 results.
GPRS chips use general packet radio service (GPRS), a standard for wireless communications with a throughput rate of 115 kilobits (kbps) per second...
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MRRPB5
September 2024
Price: USD 2,900.00
GPRS chips use general packet radio service (GPRS), a standard for wireless communications with a throughput rate of 115 kilobits (kbps) per second...
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MRRPB5
April 2023
Price: USD 2,900.00
The global Underfill Materials market size was valued at USD 1204.5 million in 2023 and is forecast to a readjusted size of USD 1587.1 million by...
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GIR
July 2024
Price: USD 3,480.00
The global market for Phased Array T-R Chip was valued at US$ 5245 million in the year 2024 and is projected to reach a revised size of US$ 8314...
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MRRPB5
February 2025
Price: USD 2,900.00
A Phased Array Transmit-Receive (T-R) chip is a semiconductor device used in radar and communication systems, particularly in phased array antenna...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Electronic Underfill Material market size was valued at USD 323.1 million in 2023 and is forecast to a readjusted size of USD 436.8...
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GIR
November 2024
Price: USD 3,480.00
The global System in Package market size was valued at USD 5957.9 million in 2023 and is forecast to a readjusted size of USD 8439.8 million by 2030...
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GIR
July 2024
Price: USD 3,480.00
The global System in Package market size was valued at US$ 5664.3 million in 2023. With growing demand in downstream market, the System in Package is...
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LPI
March 2024
Price: USD 3,660.00
The underfill adhesive is a kind of chemical glue (the main component is epoxy resin) to fill the bottom of the BGA packaging mode chip, using the...
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MRRPB5
September 2024
Price: USD 3,950.00
The underfill adhesive is a kind of chemical glue (the main component is epoxy resin) to fill the bottom of the BGA packaging mode chip, using the...
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MRRPB5
January 2024
Price: USD 2,900.00
The underfill adhesive is a kind of chemical glue (the main component is epoxy resin) to fill the bottom of the BGA packaging mode chip, using the...
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MRRPB5
March 2023
Price: USD 2,900.00
The global Electronic Circuit Board Underfill Material market size was valued at USD million in 2023 and is forecast to a readjusted size of USD...
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GIR
June 2024
Price: USD 3,480.00
The global Baseband Processor Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
August 2024
Price: USD 2,900.00
Highlights The global Baseband Processor Packaging market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029,...
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MRRPB5
March 2023
Price: USD 2,900.00
The global Spherical Silica for MUF market size was valued at US$ 24 million in 2023. With growing demand in downstream market, the Spherical Silica...
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LPI
October 2024
Price: USD 3,660.00
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