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Your search for "flat chip will grid array" gave back 1662951 results.
The global Painted Ceiling Keel market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR...
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GIR
May 2025
Price: USD 3,480.00
The global LGA Socket market size is predicted to grow from US$ 180 million in 2025 to US$ 270 million in 2031; it is expected to grow at a CAGR of 7...
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LPI
February 2025
Price: USD 3,660.00
This report by ElectroniCast Consultants provides the research findings of our study of the worldwide consumption of packaged Light Emitting Diodes (...
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ElectroniCast
March 2016
Price: USD 3,690.00
A LED Display Screen, or light emitting diode display, is a flat panel display that uses an array of light-emitting diodes as the video display. An...
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GIR
September 2024
Price: USD 3,480.00
HuProt鈩� human proteome microarray provides the largest number of unique human proteins known to be included on a single slide, allowing thousands of...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Water Cooling Xenon Test Chambers market size was valued at USD 47 million in 2023 and is forecast to a readjusted size of USD 61 million...
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GIR
December 2024
Price: USD 3,480.00
The global Air Cooling Xenon Test Chambers market size was valued at USD 84 million in 2023 and is forecast to a readjusted size of USD 116.7 million...
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GIR
December 2024
Price: USD 3,480.00
According to our latest research, the global Cloud Computing Chips market size will reach USD million in 2030, growing at a CAGR of % over the...
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GIR
August 2024
Price: USD 3,480.00
The global TGV Deep Hole Sputtering Equipment market size is predicted to grow from US$ 221 million in 2025 to US$ 305 million in 2031; it is...
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LPI
February 2025
Price: USD 3,660.00
An LGA socket is a type of central processing unit (CPU) socket that uses the land grid array style of integrated circuit packaging. Several...
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MRRPB5
October 2023
Price: USD 2,900.00
The global market for TGV Deep Hole Sputtering Equipment was valued at US$ 217 million in the year 2024 and is projected to reach a revised size of...
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MRRPB5
January 2025
Price: USD 2,900.00
A ball grid array (BGA) socket is designed for mounting package boards that use a grid of solder balls, known as BGAs. Unlike the pin grid array (PGA...
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LPI
April 2024
Price: USD 3,660.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
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MRRPB5
March 2023
Price: USD 4,900.00
The global TGV Deep Hole Sputtering Equipment market size was valued at US$ 223 million in 2024 and is forecast to a readjusted size of USD 315...
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GIR
April 2025
Price: USD 3,480.00
The painted ceiling keel is a metal material commonly used in interior decoration to support the installation of ceiling panels. It is made of...
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MRRPB5
August 2024
Price: USD 2,900.00
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