0 items USD 0.00Search
Your search for "flat chip will grid array" gave back 332087 results.
The global Underfill Adhesives market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR...
颁补迟补濒辞驳:听
GIR
August 2024
Price: USD 3,480.00
The global Underfill Materials market size was valued at USD 1204.5 million in 2023 and is forecast to a readjusted size of USD 1587.1 million by...
颁补迟补濒辞驳:听
GIR
July 2024
Price: USD 3,480.00
The underfill adhesive is a kind of chemical glue (the main component is epoxy resin) to fill the bottom of the BGA packaging mode chip, using the...
颁补迟补濒辞驳:听
MRRPB5
September 2024
Price: USD 3,950.00
The underfill adhesive is a kind of chemical glue (the main component is epoxy resin) to fill the bottom of the BGA packaging mode chip, using the...
颁补迟补濒辞驳:听
MRRPB5
January 2024
Price: USD 2,900.00
The underfill adhesive is a kind of chemical glue (the main component is epoxy resin) to fill the bottom of the BGA packaging mode chip, using the...
颁补迟补濒辞驳:听
MRRPB5
March 2023
Price: USD 2,900.00
The global Electronic Circuit Board Underfill Material market size was valued at USD million in 2023 and is forecast to a readjusted size of USD...
颁补迟补濒辞驳:听
GIR
June 2024
Price: USD 3,480.00
The global Spherical Silica for MUF market size was valued at US$ 24 million in 2023. With growing demand in downstream market, the Spherical Silica...
颁补迟补濒辞驳:听
LPI
October 2024
Price: USD 3,660.00
Highlights The global Circuit Board Chips Protecting Encapsulant market is projected to reach US$ million by 2028 from an estimated US$ million in...
颁补迟补濒辞驳:听
MRRPB5
January 2023
Price: USD 2,900.00
The global Circuit Board Chips Protecting Encapsulant market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
颁补迟补濒辞驳:听
MRRPB5
April 2024
Price: USD 2,900.00
The global Underfill Materials market size was valued at US$ 1145.1 million in 2023. With growing demand in downstream market, the Underfill...
颁补迟补濒辞驳:听
LPI
March 2024
Price: USD 3,660.00
Spherical silica for melamine-urea-formaldehyde (MUF) refers to silica-based particles used as an extender and reinforcement in MUF adhesives and...
颁补迟补濒辞驳:听
MRRPB5
October 2023
Price: USD 2,900.00
The global Circuit Board Chips Protecting Encapsulant market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound...
颁补迟补濒辞驳:听
MRRPB5
November 2024
Price: USD 4,900.00
Underfill materials are necessary composite formulations made of organic polymers and inorganic fillers. These materials find their application in...
颁补迟补濒辞驳:听
MRRPB5
January 2024
Price: USD 2,900.00
The global Molded Underfill Material market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of...
颁补迟补濒辞驳:听
MRRPB5
May 2024
Price: USD 2,900.00
The global Molded Underfill Material market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of...
颁补迟补濒辞驳:听
MRRPB5
March 2023
Price: USD 2,900.00
听
