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Your search for "flat chip will grid array" gave back 282623 results.
Spherical silica for melamine-urea-formaldehyde (MUF) refers to silica-based particles used as an extender and reinforcement in MUF adhesives and...
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MRRPB5
April 2024
Price: USD 2,900.00
Organic substrate packaging material is a highly reliable and fine design rule used in semiconductor packaging. They are used as a foundation layer...
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MRRPB5
October 2024
Price: USD 3,950.00
Organic substrate packaging material is a highly reliable and fine design rule used in semiconductor packaging. They are used as a foundation layer...
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MRRPB5
July 2024
Price: USD 2,900.00
Organic substrate packaging material is a highly reliable and fine design rule used in semiconductor packaging. They are used as a foundation layer...
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MRRPB5
April 2023
Price: USD 2,900.00
The global BGA (Ball Grid Array) Package Underfill Adhesive market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030...
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MRRPB5
June 2024
Price: USD 2,900.00
The global BGA (Ball Grid Array) Package Underfill Adhesive market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD...
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GIR
August 2024
Price: USD 3,480.00
The global Electronic Circuit Board Underfill Material market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
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MRRPB5
March 2024
Price: USD 2,900.00
The global Electronic Circuit Board Underfill Material market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029,...
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MRRPB5
April 2023
Price: USD 2,900.00
The global Molded Underfill Material market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (...
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MRRPB5
April 2023
Price: USD 4,900.00
The global Electronic Circuit Board Level Underfill Material market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030...
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MRRPB5
August 2024
Price: USD 2,900.00
The global Electronic Circuit Board Level Underfill Material market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029...
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MRRPB5
March 2023
Price: USD 2,900.00
An Arrayed Waveguide Grating (AWG) chip is a device based on photonic integrated technology that uses waveguide structures to separate or multiplex...
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MRRPB5
September 2024
Price: USD 2,900.00
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently...
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MRRPB5
April 2023
Price: USD 2,900.00
The global Solder Ball market size was valued at US$ 278 million in 2024 and is forecast to a readjusted size of USD 425 million by 2031 with a CAGR...
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GIR
February 2025
Price: USD 3,480.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
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MRRPB5
February 2024
Price: USD 2,900.00
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