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Your search for "flat chip will grid array" gave back 306323 results.
The global market for Array LEDs was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a...
MRRPB5
October 2024
Price: USD 3,950.00
The global Array LEDs market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the...
MRRPB5
March 2024
Price: USD 2,900.00
The global Convection Rework Handheld & Systems market is projected to reach US$ 49 million in 2029, increasing from US$ 61 million in 2022, with...
MRRPB5
October 2023
Price: USD 2,900.00
The term eMMC is short for “embedded Multi-Media Card” and refers to a package consisting of both flash memory and a flash memory controller...
MRRPB5
October 2024
Price: USD 3,950.00
The global Array LEDs market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the...
MRRPB5
February 2023
Price: USD 2,900.00
The term eMMC is short for “embedded Multi-Media Card” and refers to a package consisting of both flash memory and a flash memory controller...
MRRPB5
February 2023
Price: USD 2,900.00
The global market for Mode Field Conversion Fiber Array (MFD-FA) was valued at US$ 104 million in the year 2024 and is projected to reach a revised...
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MRRPB5
April 2025
Price: USD 2,900.00
A DIP socket is an electronic accessory used to mount dual in-line package (DIP) components on printed circuit boards (PCBs). These sockets are...
MRRPB5
September 2024
Price: USD 3,950.00
The global Array LEDs market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of %...
GIR
December 2024
Price: USD 3,480.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
MRRPB5
October 2023
Price: USD 2,900.00
The global Array LEDs market size was valued at US$ million in 2023. With growing demand in downstream market, the Array LEDs is forecast to a...
LPI
December 2024
Price: USD 3,660.00
The global Solder Ball market size is predicted to grow from US$ 296 million in 2025 to US$ 438 million in 2031; it is expected to grow at a CAGR of...
LPI
July 2025
Price: USD 3,660.00
The global FC BGA market size is predicted to grow from US$ 6154 million in 2025 to US$ 10900 million in 2031; it is expected to grow at a CAGR of 10...
LPI
May 2025
Price: USD 3,660.00
Enotyping chips, also known as pharmacogenomic chips, are specialized genetic testing devices that analyze an individual's genetic makeup to...
MRRPB5
September 2024
Price: USD 3,950.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
LPI
November 2024
Price: USD 3,660.00

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