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Your search for "flir chip wall grid array" gave back 83074 results.
Next generation Mid IR Sensors are leveraging new technology. The 2016 study has 885 pages, 390 tables and figures. Worldwide mid IR sensor markets...
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WinterGreen Research
August 2016
Price: USD 4,100.00
Next generation Mid IR Sensors are leveraging new technology. The 2013 study has 818 pages, 340 tables and figures. Worldwide mid IR sensor markets...
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WinterGreen Research
October 2013
Price: USD 3,800.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
October 2024
Price: USD 3,950.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
May 2024
Price: USD 2,900.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
May 2023
Price: USD 2,900.00
Global Underfill Material Market is accounted for $240.56 million in 2017 and is expected to reach $535.56 million by 2026 growing at a CAGR of 9.3%...
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Stratistics MRC
June 2019
Price: USD 4,150.00
Ball grid array (BGA) components are relatively new and more complex technologies, which gradually replace the dual in-line packaging technology (DIP...
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MRRPB5
November 2024
Price: USD 3,950.00
Ball grid array (BGA) components are relatively new and more complex technologies, which gradually replace the dual in-line packaging technology (DIP...
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MRRPB5
June 2024
Price: USD 2,900.00
Ball grid array (BGA) components are relatively new and more complex technologies, which gradually replace the dual in-line packaging technology (DIP...
颁补迟补濒辞驳:听
MRRPB5
March 2023
Price: USD 2,900.00
A Focal Plane Array (FPA) Infrared Detector is a sophisticated sensor technology used to capture thermal images by detecting infrared radiation. The...
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LPI
August 2024
Price: USD 3,660.00
A Focal Plane Array (FPA) is a sophisticated sensor device used in imaging systems to detect and measure electromagnetic radiation, including visible...
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LPI
August 2024
Price: USD 3,660.00
The PCB used for placing the BGA components is known as BGA PCB. It contains similar connections, just like the ball grid array present on the back...
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MRRPB5
June 2024
Price: USD 2,900.00
The PCB used for placing the BGA components is known as BGA PCB. It contains similar connections, just like the ball grid array present on the back...
颁补迟补濒辞驳:听
MRRPB5
January 2023
Price: USD 2,900.00
A Focal Plane Array (FPA) Infrared Detector is a sophisticated sensor technology used to capture thermal images by detecting infrared radiation. The...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 2,900.00
A Focal Plane Array (FPA) is a sophisticated sensor device used in imaging systems to detect and measure electromagnetic radiation, including visible...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 2,900.00
听
