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Your search for "flir chip wall grid array" gave back 83190 results.
The global BGA (Ball Grid Array) Package Underfill Adhesive market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD...
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GIR
August 2024
Price: USD 3,480.00
An LGA socket is a type of central processing unit (CPU) socket that uses the land grid array style of integrated circuit packaging. Several...
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MRRPB5
June 2024
Price: USD 2,900.00
A ball grid array (BGA) socket is designed for mounting package boards that use a grid of solder balls, known as BGAs. Unlike the pin grid array (PGA...
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MRRPB5
April 2024
Price: USD 2,900.00
LGA (Land Grid Array Package) is a BGA packaging technology that further reduces the height without solder balls. LGA has thinner and lighter package...
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MRRPB5
October 2023
Price: USD 2,900.00
A ball grid array (BGA) socket is designed for mounting package boards that use a grid of solder balls, known as BGAs. Unlike the pin grid array (PGA...
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GIR
April 2024
Price: USD 3,480.00
The global Ball Grid Array (BGA) Packages market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR...
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MRRPB5
March 2023
Price: USD 2,900.00
An LGA socket is a type of central processing unit (CPU) socket that uses the land grid array style of integrated circuit packaging. Several...
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MRRPB5
October 2023
Price: USD 2,900.00
The global Electronic Circuit Board Underfill Material market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
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MRRPB5
March 2024
Price: USD 2,900.00
Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has...
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MRRPB5
February 2024
Price: USD 2,900.00
The global Electronic Circuit Board Underfill Material market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029,...
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MRRPB5
April 2023
Price: USD 2,900.00
The global Molded Underfill Material market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (...
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MRRPB5
April 2023
Price: USD 4,900.00
Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has...
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MRRPB5
April 2023
Price: USD 2,900.00
The global market for Phase Rotation Meter was valued at US$ 35 million in the year 2024 and is projected to reach a revised size of US$ 44 million...
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MRRPB5
June 2025
Price: USD 2,900.00
The global market for Antenna-in-Package Technology was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million...
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MRRPB5
October 2024
Price: USD 3,950.00
The global Antenna-in-Package Technology market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
August 2024
Price: USD 2,900.00
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