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Your search for "flir chip wall grid array" gave back 83336 results.
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
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MRRPB5
September 2024
Price: USD 3,950.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
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MRRPB5
September 2024
Price: USD 3,950.00
An acoustic camera is an imaging device used to locate sound sources and to characterize them. It consists of a group of microphones 鈥� also called...
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GIR
September 2024
Price: USD 3,480.00
The global System in Package market size was valued at USD 5957.9 million in 2023 and is forecast to a readjusted size of USD 8439.8 million by 2030...
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GIR
July 2024
Price: USD 3,480.00
The global Solder Spheres market size was valued at USD 249.3 million in 2023 and is forecast to a readjusted size of USD 380.4 million by 2030 with...
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GIR
June 2024
Price: USD 3,480.00
The global Lead Solder Ball market size was valued at USD 16 million in 2023 and is forecast to a readjusted size of USD 24 million by 2030 with a...
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GIR
June 2024
Price: USD 3,480.00
The global Gene Array market size was valued at US$ 932 million in 2024 and is forecast to a readjusted size of USD 1035 million by 2031 with a CAGR...
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GIR
April 2025
Price: USD 3,480.00
An Acoustic sound imaging Camera is an imaging device used to locate sound sources and to characterize them. It consists of a group of microphones 鈥�...
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MRRPB5
February 2023
Price: USD 2,900.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
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MRRPB5
March 2024
Price: USD 2,900.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
颁补迟补濒辞驳:听
MRRPB5
March 2024
Price: USD 2,900.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
颁补迟补濒辞驳:听
MRRPB5
February 2024
Price: USD 2,900.00
The global Solder Ball Packaging Material market size was valued at US$ 237 million in 2023. With growing demand in downstream market, the Solder...
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LPI
February 2024
Price: USD 3,660.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
颁补迟补濒辞驳:听
MRRPB5
January 2024
Price: USD 2,900.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
颁补迟补濒辞驳:听
MRRPB5
January 2024
Price: USD 2,900.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
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GIR
September 2024
Price: USD 3,480.00
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