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Your search for "flir chip wall grid array" gave back 83575 results.
Infrared Thermal Imaging Products are sophisticated devices that utilize infrared technology to detect and visualize heat emissions from objects...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Medical Infrared Thermal Imager market size was valued at US$ million in 2023. With growing demand in downstream market, the Medical...
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LPI
October 2024
Price: USD 3,660.00
The global market for HVDC Wall Bushings was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031,...
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MRRPB5
January 2025
Price: USD 2,900.00
The global HVDC Wall Bushings market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a CAGR...
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GIR
June 2025
Price: USD 3,480.00
The global Microinverter market size was valued at US$ million in 2023. With growing demand in downstream market, the Microinverter is forecast to a...
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LPI
February 2024
Price: USD 3,660.00
The global 5G Small Base Station FPGA Chip market size was valued at US$ 2498 million in 2024 and is forecast to a readjusted size of USD 14010...
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GIR
April 2025
Price: USD 3,480.00
The HVDC wall bushing is the necessary channel for the power transmission of the converter station. The global HVDC Wall Bushings market was valued...
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MRRPB5
May 2024
Price: USD 2,900.00
The global Ultrasonic Imaging Camera market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a...
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GIR
March 2025
Price: USD 3,480.00
The global market for Ultrasonic Imaging Camera was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by...
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MRRPB5
January 2025
Price: USD 2,900.00
The global Integrated Circuit Packaging Solder Ball market size was valued at USD 249.3 million in 2023 and is forecast to a readjusted size of USD...
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GIR
December 2024
Price: USD 3,480.00
Sound source localization cameras are imaging device used to locate sound sources and to characterize them. It consists of a group of microphones 鈥�...
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MRRPB5
October 2024
Price: USD 3,950.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
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MRRPB5
July 2024
Price: USD 4,900.00
The global Advanced Packaging Technologies market size was valued at US$ 14560 million in 2023. With growing demand in downstream market, the...
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LPI
December 2024
Price: USD 3,660.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
April 2024
Price: USD 3,950.00
Worldwide digital communication and data center communication markets include digital signals for video as well. Digital information may represent...
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WinterGreen Research
October 2012
Price: USD 3,700.00
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