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Your search for "high-performance computing" gave back 238746 results.
The packaging substrate is the largest part of the packaging material cost, and it mainly plays the role of carrying and protecting the chip and...
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MRRPB5
October 2024
Price: USD 3,950.00
The global market for Single Crystal Black Phosphorus was valued at US$ 3.8 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
April 2025
Price: USD 2,900.00
Copper plating chemicals for IC substrates are used to deposit copper layers onto integrated circuit (IC) substrates. These chemicals ensure precise...
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MRRPB5
July 2024
Price: USD 2,900.00
Flexible PCB substrate resin is a specialized resin used in the manufacturing of flexible printed circuit boards (PCBs) for applications requiring...
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MRRPB5
October 2023
Price: USD 2,900.00
Epoxy resins are the main component of durable epoxy compounds used in semiconductor packaging assemblies. Therefore, the properties of the epoxy...
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MRRPB5
November 2024
Price: USD 3,950.00
The global market for Epoxy Resin Thermal Conductive Potting Glue was valued at US$ 368 million in the year 2024 and is projected to reach a revised...
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MRRPB5
April 2025
Price: USD 2,900.00
Wafer process high purity chemicals are highly refined chemical substances used in the manufacturing and processing of semiconductor wafers. These...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Anti-spy Film market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR of %...
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GIR
July 2024
Price: USD 3,480.00
The global Optical Fiber Coloring Ink market size was valued at US$ 877 million in 2024 and is forecast to a readjusted size of USD 1112 million by...
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GIR
April 2025
Price: USD 3,480.00
Adhesives for LED packaging play a key role in the manufacture of LED packages. They ensure excellent, uniform diode illumination and fast production...
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MRRPB5
November 2024
Price: USD 3,950.00
FC underfills (Flip-Chip Underfills) are specialized epoxy-based materials used to fill the gap between a flip-chip die and its substrate to enhance...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Thermal Silicon Pad market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR...
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GIR
December 2024
Price: USD 3,480.00
The global AlNiCo Permanent Magnetic Material market size was valued at USD 2071.3 million in 2023 and is forecast to a readjusted size of USD 3160.1...
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GIR
June 2024
Price: USD 3,480.00
Potting and Encapsulating Compounds Potting and encapsulating products protect electronic components from moisture, dirt, thermal shock, and...
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MRRPB5
March 2024
Price: USD 2,900.00
Epoxy resins are the main component of durable epoxy compounds used in semiconductor packaging assemblies. Therefore, the properties of the epoxy...
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MRRPB5
April 2024
Price: USD 2,900.00
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